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ISO508P

Texas Instruments

ISO508P by Texas Instruments

ISO508P by Texas Instruments is a 24-terminal telecom interface IC with a rectangular package style. Operating b/w -40 to 85 °C, it's ideal for industrial applications. With a nominal voltage of 5V and through-hole terminal form, it offers reliable telecom circuit functionality.

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Lifecycle Status

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5

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1k+

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Digiode

USA . 4,633 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Vyrian

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Electronics Depot

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J & M Industries LLC

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Parana Technologies

USA . 614 parts In-Stock

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$11.526

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$11.939

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614

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Corohmni

South Africa . 529 parts In-Stock

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$11.712

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ChromeModa Solutions

Germany . 834 parts In-Stock

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$12.951

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$10.620

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$12.951

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IDEA Electronic Components Group

UK . 14 parts In-Stock

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$12.951

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$12.303

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$11.656

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AZTECH Wire

Italy . 332 parts In-Stock

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$18.134

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Semicontronic

India . 972 parts In-Stock

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$536.000

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$522.600

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$519.920

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One Stop Electronics

USA . 1,239 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 4,400 parts In-Stock

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Argo Parts USA

USA . 3,535 parts In-Stock

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Corphita

USA . 3,378 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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A-Z Elektronik GmbH

Germany . 282 parts In-Stock

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DigiPath Technology Company

USA . 251 parts In-Stock

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$11.677

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Advanced Electronics

New Zealand . 97 parts In-Stock

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Kepictronics

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Overview

Enhance your telecom systems with the Texas Instruments ISO508P, a top-quality telecom interface IC designed to optimize communication processes. With a reputation for excellence, Texas Instruments delivers products that exceed industry standards. The ISO508P offers unparalleled reliability, efficiency, and performance, making it the ideal choice for a wide range of applications. Experience seamless connectivity and superior functionality with this innovative product, providing unmatched value and benefits to customers seeking cutting-edge telecom solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making the product reliable in various operating conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing telecom equipment and space-efficient design.

No. of Terminals: 24

With a higher number of terminals, this product can support complex telecom interfaces and connections.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved connectivity, ensuring reliable data transmission.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions and maintain performance.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in telecom applications, ensuring compatibility with existing systems.

Technical Specifications

Other Function Telecom Interface ICs ISO508P attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

Length:

30.99 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

6.35 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

ISO508P Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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