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ISO518P-U

Texas Instruments

ISO518P-U by Texas Instruments

ISO518P-U by Texas Instruments is a 24-terminal telecom IC with a 5V supply voltage. It operates b/w -40°C to 85°C, making it suitable for industrial applications. This surface-mount IC has a small outline package and Gull Wing terminals, ideal for telecom circuit interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,523 parts In-Stock

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5,523

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Vyrian

USA . 2,102 parts In-Stock

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2,102

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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20

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Distributors (Availability)

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$7.630

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281

$7.630

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Parana Technologies

USA . 1,770 parts In-Stock

1+ parts

$15.354

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$15.744

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1,770

$15.354

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$15.744

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ChromeModa Solutions

Germany . 5,573 parts In-Stock

1+ parts

$17.252

100+ parts

$14.147

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5,573

$17.252

$14.147

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IDEA Electronic Components Group

UK . 630 parts In-Stock

1+ parts

$17.252

100+ parts

$16.389

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$15.527

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630

$17.252

$16.389

$15.527

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One Stop Electronics

USA . 2,209 parts In-Stock

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$702.000

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2,209

$702.000

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Corphita

USA . 2,580 parts In-Stock

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2,580

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DigiPath Technology Company

USA . 1,905 parts In-Stock

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$15.554

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1,905

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$15.554

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Overview

Enhance your telecom interface with the Texas Instruments ISO518P-U, a high-quality product designed to meet your communication needs. With a reputation for excellence in manufacturing, Texas Instruments delivers reliability and performance in every product. The ISO518P-U is versatile, offering a wide range of applications within the telecom industry. Experience the value and benefits of this innovative solution, providing seamless connectivity and efficiency for your projects. Trust Texas Instruments to deliver cutting-edge technology that meets your demands.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the IC, making it a reliable choice for telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving time and reducing overall production costs.

Package Shape: RECTANGULAR

The rectangular package shape is a common and practical design for telecom interface ICs, ensuring compatibility with standard PCB layouts.

No. of Terminals: 24

Having a sufficient number of terminals allows for the IC to interface with various components within a telecom system, offering versatility and functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the IC can function reliably in demanding telecom environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the IC to operate effectively in a wide range of temperature conditions, making it suitable for diverse applications.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and installation, accommodating different design requirements and making integration easier.

Width: 13.525 mm

The compact width of 13.525 mm allows for space-efficient placement on PCBs, ideal for applications where board real estate is a concern.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the IC can operate reliably in harsh industrial environments, providing long-term performance and durability.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common and widely available power requirement, allowing for easy integration with existing telecom systems.

Technical Specifications

Other Function Telecom Interface ICs ISO518P-U attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

30.99 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

6.35 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

13.525 mm

Trade Compliance

ISO518P-U Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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