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PM-8916-0-176NSP-TR-02-1-01

Qualcomm

PM-8916-0-176NSP-TR-02-1-01 by Qualcomm

PM-8916-0-176NSP-TR-02-1-01 by Qualcomm is a 176-terminal GRID ARRAY IC with HVCMOS technology, 0.4mm terminal pitch, and 3.6V supply voltage. It's used in TELECOM CIRCUITS due to its thin profile and fine pitch for telecom interface applications.

Median Price

$2.440

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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Bristol Electronics

USA . 21,419 parts In-Stock

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Rebound Electronics

UK . 15,249 parts In-Stock

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Vyrian

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iBuyXS LLC

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$2.170

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Advanced Electronics

New Zealand . 2,591 parts In-Stock

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Corohmni

South Africa . 1,066 parts In-Stock

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Argo Parts USA

USA . 1,776 parts In-Stock

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Continental Prestige Electronics

USA . 607 parts In-Stock

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Modulus Dynamics

Lithuania . 2,955 parts In-Stock

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$11.801

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Aztec Data Supply Inc.

USA . 234 parts In-Stock

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AZTECH Wire

Italy . 190 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 38,618 parts In-Stock

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Perfect Parts

USA . 13,440 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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BidChips

USA . 2,801 parts In-Stock

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GreenTree Electronics

Israel . 2,801 parts In-Stock

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Kepictronics

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Netroflash

USA . 500 parts In-Stock

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$2.391

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$2.318

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$2.269

500

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$2.269

Overview

Enhance your telecom devices with the PM-8916-0-176NSP-TR-02-1-01 by Qualcomm. As a leader in telecom interface ICs, Qualcomm delivers top-notch quality and reliability. This product's advanced technology and versatile applications make it a must-have for any telecom project. With a compact design and high performance, the PM-8916-0-176NSP-TR-02-1-01 offers unmatched value and benefits to customers looking for seamless connectivity solutions. Upgrade your telecom systems today with Qualcomm's cutting-edge innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

The square package shape helps in saving space on the circuit board.

No. of Terminals: 176

With a high number of terminals, this product can handle multiple connections efficiently.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enhances signal transmission and reduces space constraints.

Terminal Position: BOTTOM

Bottom terminal position ensures proper connectivity and stability.

Maximum Seated Height: 0.86 mm

The low maximum seated height adds to the compactness and efficiency of the product.

Width: 6.2 mm

The narrow width makes it suitable for applications where space is limited.

Length: 6.2 mm

The compact length further adds to the space-saving design of the product.

Technology: HVCMOS

The use of HVCMOS technology ensures high voltage operation with low power consumption.

Terminal Form: BALL

Ball terminal form enables easy and reliable connections during installation.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this product is optimized for telecommunications functions.

Nominal Supply Voltage: 3.6 V

The 3.6V supply voltage meets common power requirements in telecom applications.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for high-density mounting on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this product has an intermediate level of sensitivity to moisture, suitable for standard manufacturing environments.

Technical Specifications

Other Function Telecom Interface ICs PM-8916-0-176NSP-TR-02-1-01 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Qualcomm

Specs

JESD-30 Code:

S-PBGA-B176

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

176

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.86 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

HVCMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

6.2 mm

Trade Compliance

PM-8916-0-176NSP-TR-02-1-01 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Qualcomm

Qualcomm develops and licenses wireless technology and designs chips for smartphones. The company's key patents revolve around CDMA and OFDMA technologies, which are standards in wireless communications that are the backbone of all 3G and 4G networks. The firm is a leader in 5G network technology as well. Qualcomm's IP is licensed by virtually all wireless device makers. The firm is also the world's largest wireless chip vendor, supplying nearly every premier handset maker with leading-edge processors. Qualcomm also sells RF-front end modules into smartphones and chips into automotive and Internet of Things markets.

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