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PM-8916-0-176NSP-TR-02-0-VV

Qualcomm

PM-8916-0-176NSP-TR-02-0-VV by Qualcomm

TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 176; Package Code: VFBGA; Package Shape: SQUARE; Length: 6.2 mm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Other Function Telecom Interface ICs PM-8916-0-176NSP-TR-02-0-VV attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Qualcomm

Specs

JESD-30 Code:

S-PBGA-B176

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

176

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.86 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

HVCMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

6.2 mm

Trade Compliance

PM-8916-0-176NSP-TR-02-0-VV Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Qualcomm

Qualcomm develops and licenses wireless technology and designs chips for smartphones. The company's key patents revolve around CDMA and OFDMA technologies, which are standards in wireless communications that are the backbone of all 3G and 4G networks. The firm is a leader in 5G network technology as well. Qualcomm's IP is licensed by virtually all wireless device makers. The firm is also the world's largest wireless chip vendor, supplying nearly every premier handset maker with leading-edge processors. Qualcomm also sells RF-front end modules into smartphones and chips into automotive and Internet of Things markets.

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