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BGM15LA12E6327XTSA1

Infineon Technologies

BGM15LA12E6327XTSA1 by Infineon Technologies

BGM15LA12E6327XTSA1 by Infineon is a telecom IC with 12 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It has a nominal voltage of 2.8V and terminal finish of gold nickel, ideal for telecom circuit applications.

Median Price

$0.616

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,430,658 parts In-Stock

1+ parts

-

100+ parts

$0.593

1k+ parts

$0.492

10k+ parts

$0.439

1,430,658

-

$0.593

$0.492

$0.439

Verical

USA . 1,390,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.616

10k+ parts

$0.549

1,390,500

-

-

$0.616

$0.549

DigiKey

USA . 13,158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.740

10k+ parts

-

13,158

-

-

$0.740

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.452

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$0.452

-

-

-

Digiode

USA . 369 parts In-Stock

1+ parts

$0.463

100+ parts

-

1k+ parts

-

10k+ parts

-

369

$0.463

-

-

-

Vyrian

USA . 944,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

944,355

-

-

-

-

VNN

France . 2,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,880

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 944,489 parts In-Stock

1+ parts

$0.414

100+ parts

$0.404

1k+ parts

$0.402

10k+ parts

-

944,489

$0.414

$0.404

$0.402

-

Ampacity Inc.

Singapore . 944,314 parts In-Stock

1+ parts

$0.414

100+ parts

-

1k+ parts

-

10k+ parts

-

944,314

$0.414

-

-

-

Corphita

USA . 360 parts In-Stock

1+ parts

$0.438

100+ parts

-

1k+ parts

-

10k+ parts

-

360

$0.438

-

-

-

Continental Prestige Electronics

USA . 6,203 parts In-Stock

1+ parts

$0.452

100+ parts

-

1k+ parts

-

10k+ parts

$0.443

6,203

$0.452

-

-

$0.443

Argo Parts USA

USA . 4,520 parts In-Stock

1+ parts

$0.452

100+ parts

-

1k+ parts

-

10k+ parts

$0.438

4,520

$0.452

-

-

$0.438

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.452

100+ parts

$0.443

1k+ parts

-

10k+ parts

-

1,000

$0.452

$0.443

-

-

Component Stockers USA

USA . 54,667 parts In-Stock

1+ parts

$0.500

100+ parts

$0.470

1k+ parts

$0.430

10k+ parts

$0.430

54,667

$0.500

$0.470

$0.430

$0.430

Aztec Data Supply Inc.

USA . 47,851 parts In-Stock

1+ parts

$6.430

100+ parts

-

1k+ parts

-

10k+ parts

-

47,851

$6.430

-

-

-

Modulus Dynamics

Lithuania . 3,943 parts In-Stock

1+ parts

$12.366

100+ parts

$11.871

1k+ parts

$11.377

10k+ parts

-

3,943

$12.366

$11.871

$11.377

-

Corohmni

South Africa . 131 parts In-Stock

1+ parts

$12.806

100+ parts

-

1k+ parts

-

10k+ parts

-

131

$12.806

-

-

-

RC Electronics

USA . 40,033 parts In-Stock

1+ parts

-

100+ parts

$0.460

1k+ parts

$0.430

10k+ parts

$0.420

40,033

-

$0.460

$0.430

$0.420

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Discover the cutting-edge BGM15LA12E6327XTSA1 by Infineon Technologies, a top-of-the-line product in the Other Function Telecom Interface ICs category. Infused with superior quality and reliability, this telecom circuit is designed to exceed expectations. With a streamlined rectangular package shape and gold nickel terminal finish, this innovative chip carrier offers unmatched performance in various industrial applications. Elevate your projects with the exceptional value and benefits that this product brings, setting new standards in the industry. Experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort in assembly process.

Package Shape: RECTANGULAR

Compact rectangular shape enables efficient use of space on a circuit board.

No. of Terminals: 12

Sufficient number of terminals for connecting various components in a circuit.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides protection and durability to the integrated circuit.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, ideal for diverse environments.

Terminal Finish: GOLD NICKEL

Gold nickel terminal finish ensures reliable and consistent connectivity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the PCB.

Maximum Seated Height: 0.65 mm

Low seated height reduces the overall profile of the product, saving space in electronic devices.

Width: 1.1 mm

Narrow width allows for compact placement on the circuit board.

Length: 1.9 mm

Short length contributes to the overall small size of the product, ideal for space-limited applications.

Temperature Grade: INDUSTRIAL

Industrial grade temperature rating ensures reliable performance in harsh conditions.

Terminal Form: BUTT

Butt terminal form provides secure and stable connection points.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring compatibility and optimal performance.

Nominal Supply Voltage: 2.8 V

Nominal supply voltage of 2.8V meets standard requirements for telecom interfaces.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and efficient use of space on the PCB.

Technical Specifications

Other Function Telecom Interface ICs BGM15LA12E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-XBCC-B12

JESD-609 Code:

e4

Length:

1.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.65 mm

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD NICKEL

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.1 mm

Trade Compliance

BGM15LA12E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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