Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGM113A256V2R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.8mm. This surface-mount IC is ideal for industrial applications requiring compact microelectronic assemblies.
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Allows for easy integration onto circuit boards, saving space and simplifying assembly.
Provides a standardized shape for easy handling and mounting within electronic devices.
Offers a sufficient number of terminals for connecting various components and peripherals.
Ensures a compact and efficient design for improved performance in telecom applications.
Provides reliability and stability in a wide range of operating conditions.
Allows for reliable operation even in extreme temperature environments.
Enables slim and sleek designs for space-constrained applications.
Offers a compact form factor for easy integration into tight spaces.
Provides a balanced size for versatility in various telecom applications.
Ensures compatibility with industrial-grade equipment for reliable performance in demanding environments.
Eliminates the risk of lead contamination and ensures environmental safety.
Specifically designed for telecom applications, providing optimized performance and reliability.
A commonly used voltage level for efficient power consumption and compatibility with various systems.
Enables precise and secure connections with other components for reliable signal transmission.
Other Function Telecom Interface ICs BGM113A256V2R attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Silicon Labs
JESD-30 Code:
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BGM113A256V2R Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev 12/Oct/2022
PCN Assembly/Origin - Multi Dev 28/Sep/2022
PCN Packaging - Multi Devices 15/Jan/2019
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
2N7002
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
BAV99
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99LT1G
Onsemi
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
LL4148
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Temic Semiconductors
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
USBLC6-2SC6
STMicroelectronics
USBLC6-2SC6 by STMicroelectronics is a unidirectional transient voltage suppressor diode with a breakdown voltage of 6V. It has a max clamping voltage of 17V and operates in temperatures ranging from -40 to 125°C. This device, with dual terminals and matte tin finish, is ideal for protecting sensitive electronics from voltage spikes in various applications.
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
1N4148WS
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ESP32-D0WD
Espressif Systems (shanghai)
ESP32-D0WD by Espressif Systems is a telecom IC with 38 terminals, operating at -40 to 85°C. It has a data rate of 150 Mbps and operates at 3.3V supply voltage. This surface-mount rectangular package is ideal for automotive applications due to its compact size and high performance capabilities.
NINA-B112-03B-00
U-blox Ag
TELECOM CIRCUIT;
BQ51013ARHLT
Texas Instruments
BQ51013ARHLT by Texas Instruments is a Telecom IC with 20 terminals, operating at -40 to 125°C. It has a data rate of 0.002 Mbps and nominal voltage of 5V. Ideal for telecom circuits, this chip carrier package is surface mountable with Ni/Pd/Au terminal finish.
453-00006C
Laird Technologies
453-00006C by Laird Technologies is a surface mount IC with 39 terminals, operating b/w -40 to 85°C. With a compact rectangular package style, it's ideal for industrial telecom circuits requiring a 3V supply voltage. Featuring a low profile of 2.33mm and dimensions of 14x10mm, it suits applications needing high temperature tolerance and small form factor.
HMC1122LP4METR
Analog Devices
Analog Devices' HMC1122LP4METR is a telecom IC with 24 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm. This chip carrier package is surface-mountable and suitable for industrial applications in telecom circuits.
BQ51003YFPT
BQ51003YFPT by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w -40 to 85°C, with a peak reflow temperature of 260°C. Suitable for telecom circuits, it has a battery supply of 5V and very thin profile at 0.5mm seated height.
XCC2642R1FRGZR
XCC2642R1FRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuit applications, it features nickel palladium gold terminal finish and very thin profile design.
WT32I-A-AI6IAP
Silicon Labs
The Silicon Labs WT32I-A-AI6IAP is a telecom IC with 50 terminals, rectangular package shape, and industrial temperature grade. It is surface mountable and has a microelectronic assembly package style. Ideal for telecom circuit applications with operating temperatures ranging from -40°C to 85°C.
CC2640F128RHBR
CC2640F128RHBR by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuits, it features a terminal pitch of 0.5mm and no-lead terminal form.
ODIN-W260-06B
Other Telecom ICs;
ADAR1000ACCZN-R7
ADAR1000ACCZN-R7 by Analog Devices is a telecom IC with 88 terminals, operating temp range of -40 to 85°C. It has a nominal voltage of 3.3V and negative supply voltage of -5V. Ideal for telecom circuits, this IC comes in a square package style with surface mount feature.
451-00001
Laird Technologies' 451-00001 is a telecom IC with 71 terminals, operating at -40 to 85°C. With a supply voltage of 3.3V, it supports data rates up to 2 Mbps. This surface-mount IC in rectangular package is ideal for telecom circuit applications.
ST25R3915-AQFT
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
LMH0384SQX/NOPB
National Semiconductor
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: QCCN; Package Shape: SQUARE;
XB3-24Z8UM
Digi International
The Digi International XB3-24Z8UM is a surface mount telecom IC with 34 terminals. Operating temperature ranges from -40°C to 85°C, suitable for industrial applications. With a compact size of 13mm x 19mm, it's ideal for telecom circuit integration in various devices.
BGS12PN10E6327XTSA1
Infineon Technologies
BGS12PN10E6327XTSA1 by Infineon is a Telecom IC with CMOS technology, operating b/w -30°C to 85°C. It features a 10-terminal chip carrier package with very thin profile, suitable for telecom circuit applications. With a nominal voltage of 2.85V and compact dimensions of 1.5mm x 1.1mm, it's ideal for space-constrained designs requiring surface mount compatibility.
EQCO62T20.3
Microchip Technology
EQCO62T20.3 by Microchip Technology is a telecom interface IC with 1 function, 16 terminals, and a square package shape. It operates in an industrial temperature range of -40 to 85°C and has a nominal voltage of 1.2V. This IC is suitable for telecom circuit applications.
SX1308IMLTRT
Semtech
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; JESD-609 Code: e3;
NRF51822-QFAC-R
Nordic Semiconductor Asa
NRF51822-QFAC-R by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, -25 to 75°C operating range, and 0.4mm terminal pitch. It is used in telecom circuits due to its square chip carrier package style and thin profile design.
MAX-8Q-0-10
The U-blox Ag MAX-8Q-0-10 is a surface mount telecom IC with 18 terminals. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3V. With a compact size (9.7mm x 10.1mm), it's ideal for applications requiring telecom circuit functionality in tight spaces.
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BGM111A256V21R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 31; Package Shape: RECTANGULAR; Length: 15 mm;
BGM13P22F512GE-V2
BGM111A256V2R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 31; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
BGM13P22F512GA-V2R
BGM11S22F256GA-V2
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4; Terminal Finish: NICKEL GOLD;
BGM111A256V21
BGM111A256V21 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial telecom circuit applications due to its compact size and temperature range.
BGM111A256V2
BGM111A256V2 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial applications requiring reliable telecom circuit interfaces.
BGM13P22F512GA-V2
BGM113A256V21R
BGM113A256V21R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for industrial applications requiring a surface mount rectangular package style with a seated height of 2mm.
BGM113A256V2
BGM113A256V2 by Silicon Labs is a telecom IC with 36 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 0.8mm. This rectangular microelectronic assembly is ideal for industrial applications requiring telecom circuit interfaces.
BGM123A256V2R
BGM123A256V2R by Silicon Labs is a telecom IC with 56 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for telecom circuit applications in industrial settings due to its compact square package style and surface mount capability.
BGM113A256V21
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Shape: RECTANGULAR; Length: 15.73 mm;
BGM121A256V2R
BGM121A256V2R by Silicon Labs is a surface mount telecom interface IC with 1 function. It has a square package shape, 56 terminals, and a max seated height of 1.4mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 3.3V.
BGM15MA12E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGM121A256V2
Silicon Labs' BGM121A256V2 is a telecom IC with 56 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial-grade applications. The surface-mountable square package measures 6.5mm x 6.5mm x 1.4mm, making it suitable for compact telecom interface solutions.
BGM15HA12E6327XTSA1
BGM15LA12E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR;
BGM13P22F512GE-V2R
BGM123A256V2
Silicon Labs BGM123A256V2 is a telecom IC with 56 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and MSL level of 3. Suitable for industrial applications, it comes in a square package style measuring 6.5mm x 6.5mm x 1.4mm, making it ideal for surface mount assembly processes up to 260°C peak reflow temperature within 40 seconds.
BGM113A256V1R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED;
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