Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGM113A256V2R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.8mm. This surface-mount IC is ideal for industrial applications requiring compact microelectronic assemblies.
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Allows for easy integration onto circuit boards, saving space and simplifying assembly.
Provides a standardized shape for easy handling and mounting within electronic devices.
Offers a sufficient number of terminals for connecting various components and peripherals.
Ensures a compact and efficient design for improved performance in telecom applications.
Provides reliability and stability in a wide range of operating conditions.
Allows for reliable operation even in extreme temperature environments.
Enables slim and sleek designs for space-constrained applications.
Offers a compact form factor for easy integration into tight spaces.
Provides a balanced size for versatility in various telecom applications.
Ensures compatibility with industrial-grade equipment for reliable performance in demanding environments.
Eliminates the risk of lead contamination and ensures environmental safety.
Specifically designed for telecom applications, providing optimized performance and reliability.
A commonly used voltage level for efficient power consumption and compatibility with various systems.
Enables precise and secure connections with other components for reliable signal transmission.
Other Function Telecom Interface ICs BGM113A256V2R attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Silicon Labs
JESD-30 Code:
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BGM113A256V2R Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev 12/Oct/2022
PCN Assembly/Origin - Multi Dev 28/Sep/2022
PCN Packaging - Multi Devices 15/Jan/2019
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
BAV99
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
NXP Semiconductors
RC0805FR-0710KL
Yageo
Yageo's RC0805FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. Ideal for applications requiring resistance to operate b/w -55°C to 155°C, such as in automotive electronics or industrial control systems. Features metal glaze/thick film technology and matte tin finish with nickel barrier.
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
SA616DK/01,112
SA616DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features nickel palladium gold terminal finish and gull wing form factor for telecom circuit applications.
ADRV9008BBCZ-1
Analog Devices
ADRV9008BBCZ-1 by Analog Devices is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom applications requiring precise signal processing and connectivity in industrial environments.
ATECC508A-SSHDA-B
Atmel
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
XB3-24ARM-J
Digi International
The Digi International XB3-24ARM-J is a TELECOM CIRCUIT IC with 1 Mbps data rate. Operating temperature range: -40 to 85°C. RECTANGULAR package shape for telecom interfaces, ideal for various telecommunications applications.
CC2640F128RGZT
CC2640F128RGZT by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel/palladium/gold terminal finish and very thin profile design.
BT832F
Fanstel
BT832F by Fanstel is a surface mount telecom IC with 40 terminals. It operates in an industrial temperature range of -40 to 85°C and has a data rate of 1 Mbps. This compact rectangular package is suitable for various telecom circuit applications.
JODY-W374-00B
U-blox Ag
TELECOM CIRCUIT;
WLR089U0-I/RM
Microchip Technology's WLR089U0-I/RM is a telecom IC with 12 Mbps data rate, operating at -40 to 85°C. It has 40 terminals in a rectangular package style for industrial use. Suitable for telecom interfaces, it offers a nominal voltage of 3.3V and surface-mount capability.
PN5120A0HN1/C1,151
PN5120A0HN1/C1,151 by NXP Semiconductors is a telecom interface IC with 32 terminals and power supplies of 1.8/3.3V, suitable for telecom circuits. It operates b/w -30 to 85°C, has a terminal pitch of 0.5mm, and features a nickel palladium gold finish for robust connectivity in various applications.
BLUENRG-MSCSP
STMicroelectronics
BLUENRG-MSCSP by STMicroelectronics is a telecom IC with 34 terminals, operating at -40 to 85°C. Its grid array package has a very thin profile and fine pitch, suitable for industrial applications requiring a 3V supply voltage. The IC is designed for surface mount assembly in compact devices due to its small dimensions of 2.56mm width and 2.66mm length.
TLV320AIC3104IRHBR
TLV320AIC3104IRHBR by Texas Instruments is a 32-terminal telecom IC with 2 channels. It operates b/w -40 to 85°C, suitable for industrial use. The chip carrier package style with a very thin profile and nickel/palladium/gold terminal finish make it ideal for telecom circuit applications.
CYBLE-022001-00
Cypress Semiconductor
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3;
CC2640R2FYFVR
CC2640R2FYFVR by Texas Instruments is a telecom IC with 34 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it has a very thin profile and fine pitch design for compact applications.
WT32I-E-AI6
Silicon Labs
WT32I-E-AI6 by Silicon Labs is a surface mount telecom interface IC with 1 function. It has a rectangular package shape, 50 terminals, and a max seated height of 2.55 mm. This industrial-grade IC is suitable for telecom circuit applications.
MAX-M8W-0-10
MAX-M8W-0-10 by U-blox Ag is a GNSS module with 18 terminals and a rectangular package shape. It operates in industrial temperature range (-40 to 85 °C) and has a compact size of 2.5mm width and 10.1mm length. This module is suitable for various applications requiring precise positioning and navigation capabilities.
BLUENRG-234
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1;
450-0178C
Laird Technologies
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
HMC773ALC3BTR-R5
Analog Devices' HMC773ALC3BTR-R5 is a telecom IC with 12 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. With a very thin profile and no-lead terminal form, it's ideal for telecom interface applications.
SPSGRF-868
SPSGRF-868 by STMicroelectronics is a telecom IC with 11 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm, suitable for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages in surface mount form.
RN41-I/RM477
Microchip Technology's RN41-I/RM477 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in a rectangular package style. Ideal for industrial applications requiring reliable telecom circuit interfaces.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BGM111A256V21R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 31; Package Shape: RECTANGULAR; Length: 15 mm;
BGM13P22F512GE-V2
BGM111A256V2R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 31; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
BGM13P22F512GA-V2R
BGM11S22F256GA-V2
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4; Terminal Finish: NICKEL GOLD;
BGM111A256V21
BGM111A256V21 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial telecom circuit applications due to its compact size and temperature range.
BGM111A256V2
BGM111A256V2 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial applications requiring reliable telecom circuit interfaces.
BGM13P22F512GA-V2
BGM113A256V21R
BGM113A256V21R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for industrial applications requiring a surface mount rectangular package style with a seated height of 2mm.
BGM113A256V2
BGM113A256V2 by Silicon Labs is a telecom IC with 36 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 0.8mm. This rectangular microelectronic assembly is ideal for industrial applications requiring telecom circuit interfaces.
BGM123A256V2R
BGM123A256V2R by Silicon Labs is a telecom IC with 56 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for telecom circuit applications in industrial settings due to its compact square package style and surface mount capability.
BGM113A256V21
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Shape: RECTANGULAR; Length: 15.73 mm;
BGM121A256V2R
BGM121A256V2R by Silicon Labs is a surface mount telecom interface IC with 1 function. It has a square package shape, 56 terminals, and a max seated height of 1.4mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 3.3V.
BGM15MA12E6327XTSA1
Infineon Technologies
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGM121A256V2
Silicon Labs' BGM121A256V2 is a telecom IC with 56 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial-grade applications. The surface-mountable square package measures 6.5mm x 6.5mm x 1.4mm, making it suitable for compact telecom interface solutions.
BGM15HA12E6327XTSA1
BGM15LA12E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR;
BGM13P22F512GE-V2R
BGM123A256V2
Silicon Labs BGM123A256V2 is a telecom IC with 56 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and MSL level of 3. Suitable for industrial applications, it comes in a square package style measuring 6.5mm x 6.5mm x 1.4mm, making it ideal for surface mount assembly processes up to 260°C peak reflow temperature within 40 seconds.
BGM113A256V1R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED;
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