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CYBLE-214015-01

Infineon Technologies

CYBLE-214015-01 by Infineon Technologies

CYBLE-214015-01 by Infineon Technologies is a surface mount telecom IC with 1 function and 32 terminals. It has a square package shape, measuring 11mm in width and length, with a max seated height of 1.8mm. With an operating temperature range of -40 to 85°C, it is suitable for industrial applications.

Median Price

$11.595

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 285 parts In-Stock

1+ parts

$6.040

100+ parts

-

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285

$6.040

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Arrow

USA . 13 parts In-Stock

1+ parts

$12.220

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-

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13

$12.220

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Mouser Electronics

USA . 1,391 parts In-Stock

1+ parts

$13.140

100+ parts

$10.010

1k+ parts

$7.550

10k+ parts

-

1,391

$13.140

$10.010

$7.550

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DigiKey

USA . 764 parts In-Stock

1+ parts

$13.140

100+ parts

$10.011

1k+ parts

$8.852

10k+ parts

-

764

$13.140

$10.011

$8.852

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Newark

USA . 334 parts In-Stock

1+ parts

$13.140

100+ parts

$10.020

1k+ parts

$8.700

10k+ parts

-

334

$13.140

$10.020

$8.700

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Farnell

UK . 456 parts In-Stock

1+ parts

$14.282

100+ parts

$13.668

1k+ parts

$13.515

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456

$14.282

$13.668

$13.515

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Avnet

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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$7.999

10k+ parts

$7.549

2,000

-

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$7.999

$7.549

Future Electronics

Canada . 500 parts In-Stock

1+ parts

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$10.970

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500

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$10.970

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Rochester

USA . 314 parts In-Stock

1+ parts

-

100+ parts

$7.550

1k+ parts

$6.760

10k+ parts

$6.360

314

-

$7.550

$6.760

$6.360

Verical

USA . 86 parts In-Stock

1+ parts

-

100+ parts

$9.438

1k+ parts

$8.450

10k+ parts

$7.950

86

-

$9.438

$8.450

$7.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 774 parts In-Stock

1+ parts

$7.970

100+ parts

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774

$7.970

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$14.608

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10

$14.608

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ComSIT Distribution GmbH

Germany . 1,802 parts In-Stock

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1,802

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ComSIT USA

USA . 1,802 parts In-Stock

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1,802

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Vyrian

USA . 1,093 parts In-Stock

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1,093

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GLYN GmbH & Co. KG

Germany . 379 parts In-Stock

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379

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 998 parts In-Stock

1+ parts

$7.130

100+ parts

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998

$7.130

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Semicontronic

India . 753 parts In-Stock

1+ parts

$7.130

100+ parts

$6.952

1k+ parts

$6.916

10k+ parts

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753

$7.130

$6.952

$6.916

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Corphita

USA . 711 parts In-Stock

1+ parts

$7.551

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711

$7.551

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Aztec Data Supply Inc.

USA . 279 parts In-Stock

1+ parts

$7.590

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279

$7.590

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Modulus Dynamics

Lithuania . 444 parts In-Stock

1+ parts

$8.700

100+ parts

$8.352

1k+ parts

$8.004

10k+ parts

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444

$8.700

$8.352

$8.004

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Corohmni

South Africa . 609 parts In-Stock

1+ parts

$9.163

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609

$9.163

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Continental Prestige Electronics

USA . 656 parts In-Stock

1+ parts

$16.740

100+ parts

$12.760

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656

$16.740

$12.760

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GreenTree Electronics

Israel . 13,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,154 parts In-Stock

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Epart123

USA . 1,000 parts In-Stock

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$25.500

1,000

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$25.500

Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$14.316

1k+ parts

$13.878

10k+ parts

$13.585

100

-

$14.316

$13.878

$13.585

Glotronic Ltd.

UK . 29 parts In-Stock

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29

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Overview

Experience the seamless connectivity and cutting-edge technology of the CYBLE-214015-01 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies guarantees top-notch quality and reliability. This versatile telecom interface IC offers a host of advantages, making it the ideal choice for various applications. With its compact square shape and surface mount capability, it is easily integrated into any design. Whether you're looking to enhance your communication systems or streamline data transfer, the CYBLE-214015-01 delivers exceptional performance. Trust in Infineon Technologies to provide you with unparalleled value, benefits, and advantages that will elevate your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

This product's surface mount capability enables easy installation and integration into various electronic devices or systems, making it a flexible and convenient choice.

No. of Functions: 1

With its single function design, this product simplifies circuitry and offers a compact solution, making it ideal for applications where space is limited.

Package Shape: SQUARE

The square shape of this product's package provides stability and efficient use of board space, ensuring reliable performance in different environments.

No. of Terminals: 32

The ample number of terminals on this product facilitates smooth connectivity and compatibility with different systems, allowing for versatile applications.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style of this product ensures high-quality manufacturing and assembly, guaranteeing durability and optimal performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand elevated temperatures, enhancing its reliability even in demanding conditions.

Minimum Operating Temperature: -40 °C

Featuring a minimum operating temperature of -40°C, this product maintains stable operation even in extremely cold environments, expanding its usability.

Maximum Seated Height: 1.8 mm

The low maximum seated height of 1.8 millimeters minimizes the space required for installation, enabling it to fit seamlessly into compact designs.

Width: 11 mm

The 11-millimeter width of this product ensures compatibility with standard electronic layouts and simplifies integration into various systems.

Length: 11 mm

With an 11-millimeter length, this product offers a compact form factor, making it suitable for applications where space optimization is crucial.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification of this product signifies its reliability and suitability for use in rugged industrial environments, providing robust performance and longevity.

Terminal Form: NO LEAD

The no lead terminal form simplifies the manufacturing process and promotes environmental friendliness, making this product an eco-conscious choice.

Telecom IC Type: TELECOM CIRCUIT

As a specialized telecom circuit IC, this product is tailored to meet the requirements of telecommunications applications, ensuring optimal performance and compatibility.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 volts, this product provides compatibility with standard voltage levels, making it readily applicable in various electronic systems.

Terminal Pitch: 0.66 mm

The terminal pitch of 0.66 millimeters offers precise and secure electrical connections, enabling reliable signal transmission and reducing the risk of signal interference.

Moisture Sensitivity Level (MSL): 3

Featuring a moisture sensitivity level of 3, this product has improved resistance to moisture and humidity, enhancing its durability and reliability in different environments.

Technical Specifications

Other Function Telecom Interface ICs CYBLE-214015-01 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-XXMA-N32

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

1.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.66 mm

Terminal Position:

UNSPECIFIED

Width:

11 mm

Trade Compliance

CYBLE-214015-01 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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