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MCP2140A-I/P

Microchip Technology

MCP2140A-I/P by Microchip Technology

MCP2140A-I/P by Microchip: Telecom IC with 18 terminals, CMOS tech, 3V supply voltage. Ideal for telecom circuits in industrial settings. Operating temp -40 to 85°C, package style in-line, TS 16949 screening level.

Median Price

$2.620

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Microchip Technology

USA . 4,021 parts In-Stock

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$2.620

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$1.990

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$1.910

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$1.890

4,021

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$1.990

$1.910

$1.890

DigiKey

USA . 233 parts In-Stock

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$2.620

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$1.990

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Nova Conductors

Japan . 46 parts In-Stock

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$2.006

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NAC Semi

USA . 3,225 parts In-Stock

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$2.330

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$2.100

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Bristol Electronics

USA . 250 parts In-Stock

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$3.575

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$1.680

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$1.537

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Vyrian

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Dan-Mar Components

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ACDS - Activité Composants Distribution Service

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Argo Parts USA

USA . 4,032 parts In-Stock

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$2.006

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Continental Prestige Electronics

USA . 1,415 parts In-Stock

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$1.965

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Ampacity Inc.

Singapore . 235 parts In-Stock

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Component Stockers USA

USA . 168 parts In-Stock

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$1.940

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AZTECH Wire

Italy . 677 parts In-Stock

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NIA Electronics

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Ledger Components

France . 3,741 parts In-Stock

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Montano Global Distributors

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LOOK Integrated Logistics

Peru . 1,468 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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LMD Electronica

Estonia . 17 parts In-Stock

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Overview

Elevate your telecom interface solutions with the MCP2140A-I/P by Microchip Technology. With a reputation for top-quality manufacturing, this IC offers unparalleled performance and reliability. Ideal for a wide range of applications in the telecom industry, this product delivers outstanding value and benefits to customers. Experience seamless connectivity and enhanced functionality with the MCP2140A-I/P – the ultimate choice for all your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, ensuring the product lasts long.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability of the product, meeting industry standards.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into existing systems.

No. of Terminals: 18

18 terminals provide connectivity options for versatile use in various telecom applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and conductivity, ensuring a reliable connection for the product.

Width: 7.62 mm

Compact width makes the product suitable for space-constrained telecom equipment.

Nominal Supply Voltage: 3 V

Low nominal supply voltage makes the product energy-efficient and suitable for battery-powered devices.

Technical Specifications

Other Function Telecom Interface ICs MCP2140A-I/P attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e3

Length:

22.86 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

5.334 mm

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MCP2140A-I/P Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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