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MCP2140-I/SO

Microchip Technology

MCP2140-I/SO by Microchip Technology

MCP2140-I/SO by Microchip: Telecom IC with 18 terminals, CMOS tech, 3V supply voltage. Small outline package for telecom circuits, operates b/w -40 to 85°C. Ideal for industrial applications requiring TS 16949 screening level.

Median Price

$2.760

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 68 parts In-Stock

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$2.760

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Nova Conductors

Japan . 15 parts In-Stock

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$2.160

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$2.160

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SPM Sales

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Vyrian

USA . 53 parts In-Stock

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ComSIT Distribution GmbH

Germany . 17 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 1,000 parts In-Stock

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$2.117

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$2.032

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$2.117

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Vigor

Singapore . 252 parts In-Stock

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$2.150

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Continental Prestige Electronics

USA . 3,810 parts In-Stock

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$2.160

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$2.117

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Argo Parts USA

USA . 749 parts In-Stock

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$2.160

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Ampacity Inc.

Singapore . 53 parts In-Stock

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$5.110

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Andel Nordic

Denmark . 210 parts In-Stock

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$6.598

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$6.334

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$6.334

210

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$6.334

AZTECH Wire

Italy . 798 parts In-Stock

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$14.375

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Microchip USA

USA . 1,416 parts In-Stock

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$17.940

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Lixinc

USA . 17,545 parts In-Stock

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Assy Fe

Spain . 5,880 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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RGB Technical Solutions

Ukraine . 811 parts In-Stock

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Perfect Parts

USA . 29 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 8 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the MCP2140-I/SO by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality telecom interface ICs that guarantee high performance and reliability. Designed to meet the demands of various applications, this product offers unparalleled value, benefits, and advantages to customers. Say goodbye to connectivity issues and experience the convenience of efficient communication with the MCP2140-I/SO.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material is durable and lightweight, making the product suitable for various applications.

Surface Mount

YES - This feature allows for easy installation and saves space on the PCB.

Screening Level

TS 16949 - Ensures high quality standards and reliability in performance.

Package Shape

RECTANGULAR - Provides a compact and efficient design for integration into electronic systems.

No. of Terminals

18 - Offers flexibility in connectivity options for different setups.

Package Style (Meter)

SMALL OUTLINE - Ideal for applications where space is limited.

Maximum Operating Temperature

85 °C - Can withstand high temperatures, ensuring stable performance in harsh environments.

Minimum Operating Temperature

40 °C - Functions reliably even in extremely low temperatures.

Terminal Finish

MATTE TIN - Provides excellent conductivity and solderability for reliable connections.

Terminal Position

DUAL - Allows for versatile PCB layout options and better signal integrity.

Maximum Seated Height

2.64 mm - Low profile design is suitable for compact electronic devices.

Width

7.49 mm - Compact size saves PCB space in crowded layouts.

Length

11.53 mm - Optimal dimensions for fitting into various electronic systems.

Temperature Grade

INDUSTRIAL - Designed to operate in industrial temperature range for reliable performance.

Technology

CMOS - Uses low power consumption technology for energy efficiency.

Terminal Form

GULL WING - Ensures secure mechanical and electrical connections.

Telecom IC Type

TELECOM CIRCUIT - Specifically designed for telecom applications, ensuring compatibility and performance.

Nominal Supply Voltage

3 V - Compatible with common supply voltages for easy integration into existing systems.

Terminal Pitch

1.27 mm - Allows for precise placement and high density mounting on PCBs.

Moisture Sensitivity Level (MSL)

2 - Resistant to moisture for increased reliability and longevity.

Technical Specifications

Other Function Telecom Interface ICs MCP2140-I/SO attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

11.53 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

2.64 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.49 mm

Trade Compliance

MCP2140-I/SO Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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