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MCP2150-I/SO

Microchip Technology

MCP2150-I/SO by Microchip Technology

MCP2150-I/SO by Microchip Technology is a CMOS telecom IC with 18 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features matte tin terminal finish and 3.3V nominal voltage for telecom circuit interfaces.

Median Price

$4.553

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

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Chip1Stop

Japan . 6 parts In-Stock

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$4.550

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Mouser Electronics

USA . 810 parts In-Stock

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$5.420

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$4.100

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Microchip Technology

USA . 690 parts In-Stock

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$5.420

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$4.100

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$3.960

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$3.930

690

$5.420

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DigiKey

USA . 55 parts In-Stock

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$5.420

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$4.100

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Master Electronics

USA . 110 parts In-Stock

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$3.870

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Verical

USA . 84 parts In-Stock

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Arrow

USA . 24 parts In-Stock

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NAC Semi

USA . 588 parts In-Stock

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$5.150

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$4.670

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$4.270

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Forefront Electronics and Design

USA . 1 parts In-Stock

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$14.700

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Vyrian

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Nova Conductors

Japan . 600 parts In-Stock

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IBS Electronics

USA . 110 parts In-Stock

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$5.989

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$5.778

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Bristol Electronics

USA . 92 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Atlantic Semiconductor

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Odi Ramu Company

Canada . 73 parts In-Stock

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Micros

Poland . 42 parts In-Stock

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$3.110

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$3.049

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ACDS - Activité Composants Distribution Service

France . 42 parts In-Stock

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Partservice

France . 42 parts In-Stock

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$3.014

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$2.955

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$2.955

42

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$2.955

Micros sp.j. W. Kędra i J. Lic

Poland . 42 parts In-Stock

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$3.229

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$3.165

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$3.165

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$3.165

Lakeland Logistics Inc

USA . 30 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 18 parts In-Stock

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PC Components Company LLC

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Distributors (Availability)

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Continental Prestige Electronics

USA . 75 parts In-Stock

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$2.950

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$2.240

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Ampacity Inc.

Singapore . 133 parts In-Stock

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$3.290

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Vigor

Singapore . 171 parts In-Stock

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Corohmni

South Africa . 80 parts In-Stock

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Microchip USA

USA . 1,080 parts In-Stock

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$15.176

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Kepictronics

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

Germany . 8,404 parts In-Stock

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NIA Electronics

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Ledger Components

France . 7,352 parts In-Stock

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Argo Parts USA

USA . 5,449 parts In-Stock

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LMD Electronica

Estonia . 4,778 parts In-Stock

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LOOK Integrated Logistics

Peru . 4,746 parts In-Stock

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Montano Global Distributors

Canada . 3,915 parts In-Stock

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Metaverse IC Inc.

Canada . 1,174 parts In-Stock

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Perfect Parts

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ChipTracer

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Netroflash

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Cyclops Electronics Ltd (Excess)

UK . 241 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 131 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 100 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

UK . 34 parts In-Stock

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GreenTree Electronics

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Overview

Enhance your telecom projects with the MCP2150-I/SO by Microchip Technology, a top-quality telecom interface IC designed to deliver reliable performance. With Microchip Technology's reputation for excellence in the industry, you can trust that this product meets the highest standards. Whether you're working on telecommunications, networking, or industrial automation applications, this versatile IC offers unmatched value and benefits to help you achieve your project goals. Upgrade your designs with the MCP2150-I/SO today and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to environmental factors, making this product a reliable choice for long-term use.

Surface Mount: YES

The surface mount feature makes installation easier and more convenient, saving time and effort during assembly.

Screening Level: TS 16949

Compliance with TS 16949 screening level standards ensures high quality and reliability, making this product suitable for telecom applications where stability is crucial.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board, optimizing the design and layout of the overall telecom system.

No. of Terminals: 18

The 18 terminals provide ample connectivity options, allowing for versatile integration into various telecom interfaces.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enables compact designs for telecom applications with limited real estate.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures in telecom environments, ensuring optimal performance under challenging conditions.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is common in telecom systems, making this product compatible with existing infrastructure and power requirements.

Technical Specifications

Other Function Telecom Interface ICs MCP2150-I/SO attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

17.87 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

2.64 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.49 mm

Trade Compliance

MCP2150-I/SO Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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