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SA612AD/01,118

NXP Semiconductors

SA612AD/01,118 by NXP Semiconductors

SA612AD/01,118 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This small outline IC is suitable for telecom circuit applications due to its dual terminal position and gull wing form factor.

Median Price

$1.975

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$1.975

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50

$1.975

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Vyrian

USA . 7,195 parts In-Stock

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7,195

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Digiode

USA . 3,567 parts In-Stock

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3,567

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Anansix

USA . 1,723 parts In-Stock

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1,723

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Bristol Electronics

USA . 185 parts In-Stock

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185

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.936

100+ parts

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1k+ parts

$1.859

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1,000

$1.936

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$1.859

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Continental Prestige Electronics

USA . 6,960 parts In-Stock

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$1.975

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$1.936

6,960

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$1.936

Argo Parts USA

USA . 701 parts In-Stock

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$1.975

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701

$1.975

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Modulus Dynamics

Lithuania . 345 parts In-Stock

1+ parts

$6.546

100+ parts

$6.546

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$6.546

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345

$6.546

$6.546

$6.546

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Aztec Data Supply Inc.

USA . 1,214 parts In-Stock

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$7.028

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Advanced Electronics

New Zealand . 39 parts In-Stock

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$7.172

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$6.813

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$6.813

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39

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$6.813

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AZTECH Wire

Italy . 535 parts In-Stock

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$7.594

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535

$7.594

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Corohmni

South Africa . 86 parts In-Stock

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$15.635

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86

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Ampacity Inc.

Singapore . 756 parts In-Stock

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$162.000

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$162.000

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Semicontronic

India . 1,083 parts In-Stock

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$382.000

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$372.450

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$370.540

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1,083

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One Stop Electronics

USA . 1,432 parts In-Stock

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$606.000

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Perfect Parts

USA . 7,319 parts In-Stock

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Corphita

USA . 3,286 parts In-Stock

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UNI Independent Distributors

Spain . 1,189 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the SA612AD/01,118 from NXP Semiconductors. Designed for exceptional performance and reliability, this telecom interface IC is a game-changer in its category. With a sleek rectangular package body and dual terminal position, this product offers unmatched value and versatility for a wide range of applications. Elevate your projects with ease and efficiency using the SA612AD/01,118 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable telecom devices.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB, making it convenient for compact designs.

Package Shape: RECTANGULAR

The rectangular shape of the package provides efficient use of board space and facilitates easy placement on the PCB.

No. of Terminals: 8

With 8 terminals, this product offers flexibility in connectivity options and is suitable for various telecom interface applications.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design with shrink pitch ensure a compact form factor, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function optimally even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple finishes on the terminals enhances conductivity and provides resistance to corrosion for long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for increased connectivity options and flexibility in installation.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm enables a slim profile and easy integration into space-constrained designs.

Width: 3.9 mm

The compact width of 3.9mm makes the product suitable for applications where board space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product ensures efficient soldering and assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for lead-free soldering and ensures robust mechanical connections.

Length: 4.9 mm

The short length of 4.9mm contributes to the overall compactness of the product, making it suitable for small form factor designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature conditions, making it suitable for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and inspection during the manufacturing process, ensuring quality connections.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this product offers specialized features and performance tailored to meet telecom interface requirements.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is commonly used in telecom applications, ensuring compatibility and reliable operation.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for high-density mounting and precise alignment on the PCB, making it ideal for complex circuit layouts.

Technical Specifications

Other Function Telecom Interface ICs SA612AD/01,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SA612AD/01,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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