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ADRV9009BBCZ

Analog Devices

ADRV9009BBCZ by Analog Devices

Analog Devices ADRV9009BBCZ is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a fine pitch terminal style and tin silver copper finish.

Median Price

$512.000

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 650 parts In-Stock

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$506.617

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$506.617

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Analog Devices Inc

USA . 4 parts In-Stock

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$512.000

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$471.040

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4

$512.000

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$471.040

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Chip1Stop

Japan . 1 parts In-Stock

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$512.000

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1

$512.000

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DigiKey

USA . 16 parts In-Stock

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$767.120

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$767.120

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Newark

USA . 4 parts In-Stock

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$790.050

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$790.050

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Digiode

USA . 410 parts In-Stock

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$486.400

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410

$486.400

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Maritex

Poland . 106 parts In-Stock

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$492.143

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$351.315

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106

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$351.315

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Nova Conductors

Japan . 100 parts In-Stock

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$614.400

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$614.400

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Vyrian

USA . 7,171 parts In-Stock

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VNN

France . 3,588 parts In-Stock

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Chip Stock

USA . 625 parts In-Stock

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Next Level Components, LLC

USA . 11 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,511 parts In-Stock

1+ parts

$6.660

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3,511

$6.660

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Parana Technologies

USA . 1,303 parts In-Stock

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$8.421

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$7.832

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1,303

$8.421

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$7.832

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IDEA Electronic Components Group

UK . 449 parts In-Stock

1+ parts

$9.055

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$8.602

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449

$9.055

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$8.602

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$9.232

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$8.770

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$8.770

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200

$9.232

$8.770

$8.770

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Corohmni

South Africa . 363 parts In-Stock

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$10.607

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363

$10.607

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AZTECH Wire

Italy . 256 parts In-Stock

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$11.395

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256

$11.395

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DigiPath Technology Company

USA . 1,925 parts In-Stock

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$14.126

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$13.561

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$13.561

1,925

$14.126

$13.561

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$13.561

Ampacity Inc.

Singapore . 5 parts In-Stock

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$435.200

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5

$435.200

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Semicontronic

India . 4 parts In-Stock

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$435.200

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$424.320

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$422.144

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4

$435.200

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Corphita

USA . 920 parts In-Stock

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$460.800

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920

$460.800

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Continental Prestige Electronics

USA . 2 parts In-Stock

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$484.920

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$484.920

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Component Stockers USA

USA . 17 parts In-Stock

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$546.900

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17

$546.900

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Netroflash

USA . 1,000 parts In-Stock

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$614.400

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$602.112

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$614.400

$602.112

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Argo Parts USA

USA . 316 parts In-Stock

1+ parts

$614.400

100+ parts

$608.256

1k+ parts

$602.112

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$595.968

316

$614.400

$608.256

$602.112

$595.968

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Lixinc

USA . 10,966 parts In-Stock

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RC Electronics

USA . 135 parts In-Stock

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Epart123

USA . 51 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the ADRV9009BBCZ by Analog Devices. As a leader in the industry, Analog Devices delivers top-notch quality and reliability in all their products. This telecom interface IC is versatile and perfect for a wide range of applications. With its high performance and advanced features, this product offers unparalleled value and benefits to customers. Experience seamless connectivity and unmatched efficiency with the ADRV9009BBCZ. Elevate your projects to the next level with this exceptional solution from Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy integration and installation of the product onto circuit boards, saving time and effort in assembly.

Package Shape: SQUARE

The square package shape ensures efficient use of space on the circuit board, maximizing component density and reducing overall footprint.

No. of Terminals: 196

Having 196 terminals allows for a high level of connectivity and versatility in connecting with other components or devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand tough environmental conditions and operate reliably under heat stress.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can function effectively in cold environments without risk of damage or failure.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides good conductivity and corrosion resistance, ensuring stable connections and long-term performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier soldering and mounting onto the circuit board, simplifying the assembly process.

Maximum Seated Height: 1.27 mm

The low maximum seated height of 1.27 mm helps in achieving a slim and compact profile for the product, ideal for space-constrained applications.

Width: 12 mm

The width of 12 mm provides a balance between compactness and ease of handling during installation and maintenance of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable soldering and assembly processes, enhancing the overall quality and durability of the product.

Length: 12 mm

The length of 12 mm contributes to the overall compact design of the product, making it suitable for applications with limited space availability.

Temperature Grade: INDUSTRIAL

Being classified as industrial grade indicates that the product is designed to meet stringent quality and performance standards, making it suitable for industrial applications.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, ensuring stability and durability in high-demand applications.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type IC, the product is specifically designed for telecommunications applications, offering optimized performance and compatibility in such scenarios.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V is energy efficient and compatible with a wide range of applications, ensuring flexibility and versatility in usage.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm allows for precise and efficient connections, enabling high-density packaging and improved signal integrity.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the product is robust against moisture exposure, ensuring reliability and longevity in various environmental conditions.

Technical Specifications

Other Function Telecom Interface ICs ADRV9009BBCZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.27 mm

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Trade Compliance

ADRV9009BBCZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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