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BGT24MTR11E6327XUMA1

Infineon Technologies

BGT24MTR11E6327XUMA1 by Infineon Technologies

Infineon's BGT24MTR11E6327XUMA1 is a telecom IC with 32 terminals, operating at -40 to 105°C. It features a 3.3V supply voltage, quad terminal position, and no-lead form factor. This industrial-grade chip carrier is surface-mountable and suitable for telecom circuit applications due to its bipolar technology.

Median Price

$13.168

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,383 parts In-Stock

1+ parts

$12.702

100+ parts

$9.824

1k+ parts

$9.540

10k+ parts

-

2,383

$12.702

$9.824

$9.540

-

Arrow

USA . 965 parts In-Stock

1+ parts

$13.633

100+ parts

$9.192

1k+ parts

$8.870

10k+ parts

-

965

$13.633

$9.192

$8.870

-

Newark

USA . 52 parts In-Stock

1+ parts

$13.660

100+ parts

$10.580

1k+ parts

$8.610

10k+ parts

-

52

$13.660

$10.580

$8.610

-

Chip1Stop

Japan . 151 parts In-Stock

1+ parts

$13.800

100+ parts

$8.270

1k+ parts

$7.410

10k+ parts

-

151

$13.800

$8.270

$7.410

-

Mouser Electronics

USA . 383 parts In-Stock

1+ parts

$13.810

100+ parts

$9.360

1k+ parts

$8.460

10k+ parts

-

383

$13.810

$9.360

$8.460

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Element14

Singapore . 2,383 parts In-Stock

1+ parts

-

100+ parts

$10.088

1k+ parts

$9.798

10k+ parts

-

2,383

-

$10.088

$9.798

-

Verical

USA . 2,051 parts In-Stock

1+ parts

-

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-

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-

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2,051

-

-

-

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Rochester

USA . 1,102 parts In-Stock

1+ parts

-

100+ parts

$7.840

1k+ parts

$7.010

10k+ parts

$6.600

1,102

-

$7.840

$7.010

$6.600

RS (Exports)

UK . 981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.234

10k+ parts

$11.609

981

-

-

$12.234

$11.609

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 401 parts In-Stock

1+ parts

$6.422

100+ parts

-

1k+ parts

-

10k+ parts

-

401

$6.422

-

-

-

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$10.301

100+ parts

-

1k+ parts

-

10k+ parts

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450

$10.301

-

-

-

Chip Stock

USA . 4,230 parts In-Stock

1+ parts

-

100+ parts

-

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4,230

-

-

-

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Vyrian

USA . 1,776 parts In-Stock

1+ parts

-

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-

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-

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1,776

-

-

-

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VNN

France . 1,481 parts In-Stock

1+ parts

-

100+ parts

-

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-

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1,481

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,539 parts In-Stock

1+ parts

$6.060

100+ parts

$5.908

1k+ parts

$5.878

10k+ parts

-

1,539

$6.060

$5.908

$5.878

-

Ampacity Inc.

Singapore . 1,522 parts In-Stock

1+ parts

$6.060

100+ parts

-

1k+ parts

-

10k+ parts

-

1,522

$6.060

-

-

-

Corphita

USA . 120 parts In-Stock

1+ parts

$6.084

100+ parts

-

1k+ parts

-

10k+ parts

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120

$6.084

-

-

-

Aztec Data Supply Inc.

USA . 4,778 parts In-Stock

1+ parts

$7.102

100+ parts

-

1k+ parts

-

10k+ parts

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4,778

$7.102

-

-

-

Corohmni

South Africa . 458 parts In-Stock

1+ parts

$9.759

100+ parts

-

1k+ parts

-

10k+ parts

-

458

$9.759

-

-

-

Continental Prestige Electronics

USA . 2,776 parts In-Stock

1+ parts

$9.800

100+ parts

$7.670

1k+ parts

-

10k+ parts

-

2,776

$9.800

$7.670

-

-

Advanced Electronics

New Zealand . 91 parts In-Stock

1+ parts

$10.507

100+ parts

$10.507

1k+ parts

$10.507

10k+ parts

-

91

$10.507

$10.507

$10.507

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Modulus Dynamics

Lithuania . 1,271 parts In-Stock

1+ parts

$11.748

100+ parts

$11.278

1k+ parts

$10.808

10k+ parts

-

1,271

$11.748

$11.278

$10.808

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GreenTree Electronics

Israel . 24,000 parts In-Stock

1+ parts

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24,000

-

-

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Glotronic Ltd.

UK . 21,600 parts In-Stock

1+ parts

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21,600

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$10.095

1k+ parts

$9.786

10k+ parts

$9.580

1,000

-

$10.095

$9.786

$9.580

Kepictronics

USA . 990 parts In-Stock

1+ parts

-

100+ parts

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990

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

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500

-

-

-

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Robosynatics

Brazil . 345 parts In-Stock

1+ parts

-

100+ parts

$13.417

1k+ parts

$13.143

10k+ parts

$13.143

345

-

$13.417

$13.143

$13.143

Lucentia Tech

USA . 345 parts In-Stock

1+ parts

-

100+ parts

$13.417

1k+ parts

$13.143

10k+ parts

$13.143

345

-

$13.417

$13.143

$13.143

Argo Parts USA

USA . 261 parts In-Stock

1+ parts

-

100+ parts

-

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-

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261

-

-

-

-

iodParts Technologies Inc.

India . 18 parts In-Stock

1+ parts

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18

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-

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Perfect Parts

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

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-

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2

-

-

-

-

Overview

Unlock the potential of advanced telecom interfaces with the BGT24MTR11E6327XUMA1 by Infineon Technologies. Crafted with precision and expertise, this cutting-edge product offers unmatched quality and reliability that Infineon Technologies is known for. Ideal for a wide range of applications in the telecom industry, this innovative IC delivers exceptional performance, efficiency, and versatility. Experience seamless integration, superior functionality, and optimized performance with the BGT24MTR11E6327XUMA1. Elevate your projects with this top-of-the-line solution that promises to exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape provides easier integration and layout on a circuit board.

No. of Terminals: 32

With a high number of terminals, this product can support complex telecom interfaces.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product ensures reliability in various environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in extreme conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability.

Maximum Seated Height: 0.9 mm

Low seated height enables compact and slim designs.

Width: 4.5 mm

Narrow width makes the product suitable for space-constrained applications.

Length: 5.5 mm

Compact length allows for efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Technology: BIPOLAR

Bipolar technology provides high-speed performance and low noise operation.

Nominal Supply Voltage: 3.3 V

Operating at a standard supply voltage of 3.3V makes it compatible with common systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has a moderate moisture sensitivity, suitable for standard manufacturing processes.

Technical Specifications

Other Function Telecom Interface ICs BGT24MTR11E6327XUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PQCC-N32

JESD-609 Code:

e3

Length:

5.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4.5 mm

Trade Compliance

BGT24MTR11E6327XUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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