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BGT24MR2E6327XUMA1

Infineon Technologies

BGT24MR2E6327XUMA1 by Infineon Technologies

BGT24MR2E6327XUMA1 by Infineon is a Telecom IC with 32 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 105°C, suitable for industrial use. It operates at 3.3V and features a thin profile design for telecom circuit applications.

Median Price

$6.112

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 58 parts In-Stock

1+ parts

$1.810

100+ parts

$1.810

1k+ parts

$1.810

10k+ parts

-

58

$1.810

$1.810

$1.810

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Arrow

USA . 540 parts In-Stock

1+ parts

$4.637

100+ parts

-

1k+ parts

-

10k+ parts

-

540

$4.637

-

-

-

Chip1Stop

Japan . 700 parts In-Stock

1+ parts

$5.230

100+ parts

-

1k+ parts

-

10k+ parts

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700

$5.230

-

-

-

Farnell

UK . 82 parts In-Stock

1+ parts

$7.200

100+ parts

$5.160

1k+ parts

$4.950

10k+ parts

-

82

$7.200

$5.160

$4.950

-

Mouser Electronics

USA . 851 parts In-Stock

1+ parts

$8.260

100+ parts

$6.370

1k+ parts

$5.340

10k+ parts

-

851

$8.260

$6.370

$5.340

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DigiKey

USA . 142 parts In-Stock

1+ parts

$10.870

100+ parts

$7.184

1k+ parts

-

10k+ parts

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142

$10.870

$7.184

-

-

Rochester

USA . 1,731 parts In-Stock

1+ parts

-

100+ parts

$4.890

1k+ parts

$4.380

10k+ parts

$4.120

1,731

-

$4.890

$4.380

$4.120

Verical

USA . 995 parts In-Stock

1+ parts

-

100+ parts

$6.112

1k+ parts

$5.787

10k+ parts

-

995

-

$6.112

$5.787

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Element14

Singapore . 82 parts In-Stock

1+ parts

-

100+ parts

$8.880

1k+ parts

$8.120

10k+ parts

-

82

-

$8.880

$8.120

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 230 parts In-Stock

1+ parts

$4.028

100+ parts

-

1k+ parts

-

10k+ parts

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230

$4.028

-

-

-

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$6.560

100+ parts

-

1k+ parts

-

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600

$6.560

-

-

-

Chip Stock

USA . 3,300 parts In-Stock

1+ parts

-

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3,300

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-

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Vyrian

USA . 349 parts In-Stock

1+ parts

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349

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VNN

France . 50 parts In-Stock

1+ parts

-

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50

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 469 parts In-Stock

1+ parts

$3.600

100+ parts

$3.510

1k+ parts

$3.492

10k+ parts

-

469

$3.600

$3.510

$3.492

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Ampacity Inc.

Singapore . 336 parts In-Stock

1+ parts

$3.600

100+ parts

-

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-

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336

$3.600

-

-

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Corphita

USA . 453 parts In-Stock

1+ parts

$3.816

100+ parts

-

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-

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453

$3.816

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

$6.560

100+ parts

-

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-

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50

$6.560

-

-

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Continental Prestige Electronics

USA . 82 parts In-Stock

1+ parts

$7.920

100+ parts

$5.720

1k+ parts

-

10k+ parts

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82

$7.920

$5.720

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-

Aztec Data Supply Inc.

USA . 2,479 parts In-Stock

1+ parts

$8.461

100+ parts

-

1k+ parts

-

10k+ parts

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2,479

$8.461

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-

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Corohmni

South Africa . 4 parts In-Stock

1+ parts

$8.503

100+ parts

-

1k+ parts

-

10k+ parts

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4

$8.503

-

-

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Modulus Dynamics

Lithuania . 2,668 parts In-Stock

1+ parts

$11.153

100+ parts

$10.707

1k+ parts

$10.261

10k+ parts

-

2,668

$11.153

$10.707

$10.261

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Argo Parts USA

USA . 4,305 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,305

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-

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,500

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-

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Perfect Parts

USA . 535 parts In-Stock

1+ parts

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100+ parts

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535

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

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50

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-

Overview

Unlock the power of seamless connectivity with the BGT24MR2E6327XUMA1 by Infineon Technologies. Crafted with precision and expertise, this telecom IC offers unparalleled reliability and performance for a wide range of applications. From cutting-edge telecommunications systems to innovative IoT devices, this product delivers exceptional value and efficiency to customers. Experience the advantage of superior quality and advanced technology with the BGT24MR2E6327XUMA1, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the telecom interface IC, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and labor costs during production.

Package Shape: RECTANGULAR

Rectangular package shape offers versatility in placement on the circuit board, maximizing space efficiency and allowing for compact designs.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, this telecom interface IC is suitable for a wide range of telecom applications, providing stable performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the telecom IC can withstand harsh environmental conditions, making it ideal for industrial applications.

Technical Specifications

Other Function Telecom Interface ICs BGT24MR2E6327XUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PQCC-N32

JESD-609 Code:

e3

Length:

5.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4.5 mm

Trade Compliance

BGT24MR2E6327XUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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