Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGT24MR2E6327XUMA1 by Infineon is a Telecom IC with 32 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 105°C, suitable for industrial use. It operates at 3.3V and features a thin profile design for telecom circuit applications.
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Plastic/epoxy material provides durability and protection for the telecom interface IC, ensuring reliability in various operating conditions.
Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and labor costs during production.
Rectangular package shape offers versatility in placement on the circuit board, maximizing space efficiency and allowing for compact designs.
Operating at a nominal supply voltage of 3.3V, this telecom interface IC is suitable for a wide range of telecom applications, providing stable performance.
Industrial temperature grade ensures the telecom IC can withstand harsh environmental conditions, making it ideal for industrial applications.
Other Function Telecom Interface ICs BGT24MR2E6327XUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
BGT24MR2E6327XUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
Yangzhou Yangjie Electronics
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
Wuxi Xuyang Electronic
EU2B-YS3203F
Idec
ROTARY SWITCH;
Unitrode
1N4148WSF-7
Diodes Incorporated
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ATMEGA328P-AU
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
International Devices
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
RS9116W-DB00-CC1
Silicon Labs
Silicon Labs' RS9116W-DB00-CC1 is a telecom IC with 107 terminals, operating from -40 to 85°C. It has a nominal voltage of 1.85V and is surface-mountable in industrial applications. The package style is grid array, making it suitable for various telecom circuit interfaces.
XB3-24APS
Digi International
The Digi International XB3-24APS is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40 to 85 °C, making it suitable for telecom applications. The RECTANGULAR package shape and SPECIAL SHAPE style enhance its performance in Other Function Telecom Interface ICs.
MAX2771ETI+
Analog Devices
Analog Devices' MAX2771ETI+ is a BICMOS telecom IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial applications. With a nominal voltage of 2.85V, it's ideal for telecom circuit interfaces requiring precise temperature control.
MAX-8Q-0-10
U-blox Ag
The U-blox Ag MAX-8Q-0-10 is a surface mount telecom IC with 18 terminals. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3V. With a compact size (9.7mm x 10.1mm), it's ideal for applications requiring telecom circuit functionality in tight spaces.
BT121-A-V2-IAP
Silicon Labs BT121-A-V2-IAP is a telecom IC with 33 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1mm. This surface-mount IC in rectangular package is ideal for industrial applications requiring compact telecom circuit solutions.
NEO-M8U-0
NEO-M8U-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its AEC-Q100 screening level and TS 16949 certification make it ideal for industrial applications requiring a 3V supply voltage. With a compact rectangular package style, this IC is suitable for various telecom circuit functions.
CYBLE-416045-02
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 43; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
451-00001C
Laird Technologies
Laird Technologies' 451-00001C is a surface mount telecom IC with 71 terminals. Operating temp range: -40 to 85°C. Features include data rate of 2 Mbps, nominal voltage of 3.3 V, and compact rectangular package suitable for telecom circuit applications.
MRF24WG0MB-I/RM
MRF24WG0MB-I/RM by Microchip: Operates at -40 to 85°C, with 3.3V supply voltage. Telecom IC for industrial use, featuring 36 terminals in a rectangular package style. Ideal for applications requiring reliable telecom interface ICs.
ZOE-M8G-0
ZOE-M8G-0 by U-blox Ag is a telecom IC with 51 terminals in a square grid array package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 1.8V and thin profile design, it's ideal for telecom circuit applications.
SARA-U201-04B
TELECOM CIRCUIT;
CLRC66302HN,157
NXP Semiconductors
The NXP Semiconductors CLRC66302HN,157 is a telecom interface IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 105°C and has a data rate of 1 Mbps at 5V supply voltage. Ideal for industrial applications requiring high-speed communication in compact spaces.
CC2640R2FYFVR
Texas Instruments
CC2640R2FYFVR by Texas Instruments is a telecom IC with 34 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it has a very thin profile and fine pitch design for compact applications.
MAX2769CETI+T
Maxim Integrated
TELECOM CIRCUIT; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
LMS7002M
Lime Microsystems
Lime Microsystems' LMS7002M is a telecom IC with 261 terminals, operating from -40 to 85°C. It has a nominal voltage of 1.2V and uses a grid array package style. Ideal for industrial applications requiring precise telecom circuit functionality in compact form factor.
MAX2769CETI+
TELECOM CIRCUIT; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
CC430F5137IRGZ
CC430F5137IRGZ by Texas Instruments is a telecom IC with a data rate of 0.5 Mbps and operates at a nominal voltage of 2.2V. This industrial-grade chip carrier has 48 terminals, is surface mountable, and suitable for telecom circuit applications. With a temperature range from -40 to 85°C, it features nickel palladium gold terminal finish and very thin profile package style.
AS3933-BTST
Ams Ag
AS3933-BTST by Ams Ag is a telecom IC with 16 terminals, operating from -40 to 85°C. It features a small outline package, Gull Wing terminals, and 3V supply voltage. Ideal for telecom circuits, this IC has a rectangular shape and is surface mountable for industrial applications.
ENW89815A3KF
Panasonic
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 50; Peak Reflow Temperature (C): 250;
CLRC66301HN,557
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 30;
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BGT24LTR11N16E6327XTSA1
Infineon Technologies
BGT24LTR11N16E6327XTSA1 by Infineon is a Telecom IC with 16 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and a terminal pitch of 0.5mm. This chip carrier is ideal for telecom circuit applications due to its very thin profile and industrial temperature grade suitability.
BGT24MTR11E6327XUMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;
BGT24MTR12E6327XUMA1
BGT24MTR12E6327XUMA1 by Infineon is a telecom IC with 32 terminals in a chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. With a supply voltage of 3.3V, it features a terminal pitch of 0.5mm and is surface mountable for various telecom interface applications.
BGT24AT2E6466XUMA1
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3;
BGT24LTR11N16
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 16; Package Code: HVBCC; Package Shape: SQUARE;
BGT24LTR11N16E6327
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 16; Package Code: VBCC; Package Shape: SQUARE;
BGT24LTR22
Other Telecom ICs; Moisture Sensitivity Level (MSL): 1;
BGT24AR2E6327
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGT24AR4E6433XUMA1
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;
BGT24ATR11E6327
BGT24ATR12E6433XUMA1
BGT24AT2E6433XUMA1
BGT24AR4
BGT24ATR11E6433
BGT24AR4E6466XUMA1
BGT24ATR11E6433XUMA1
BGT24ATR12
BGT24ATR11
BGT24AR2
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