Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGT24ATR11E6433XUMA1 by Infineon is a Telecom IC with 32 terminals, operating b/w -40 to 125°C. It features a 3.3V supply voltage, AEC-Q100 screening level, and is designed for automotive applications due to its bipolar technology. The package style includes chip carrier and heat sink/slug in a very thin profile, making it suitable for compact telecom circuit designs.
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DigiKey
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$15.200
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$10.697
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$9.233
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$8.740
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Verical
$9.775
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Digiode
$14.440
Vyrian
NAC Semi
$14.630
Modulus Dynamics
$7.630
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$7.020
Corphita
$13.680
QUARKTWIN TECHNOLOGY LTD
Eastek
Native Components
Authorized Procurement Solutions
Northwest PG Solutions
The plastic/epoxy package body material makes the product lightweight and durable, ideal for various telecom applications.
Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly processes.
AEC-Q100 screening ensures high reliability and quality standards, making the product suitable for automotive applications.
With a high maximum operating temperature, the product can withstand elevated temperatures without performance degradation.
Operating at a nominal supply voltage of 3.3 V, the product is compatible with standard power sources in electronic systems.
Other Function Telecom Interface ICs BGT24ATR11E6433XUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
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BGT24ATR11E6433XUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
1N4148
Philips Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Excel (Suzhou) Semiconductor
1N4148WT
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
SS14
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; No. of Phases: 1; Config: SINGLE; Maximum Operating Temperature: 125 Cel;
LL4148
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Formosa Microsemi
2N7002
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
BAV99
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
WLR089U0-I/RM
Microchip Technology
Microchip Technology's WLR089U0-I/RM is a telecom IC with 12 Mbps data rate, operating at -40 to 85°C. It has 40 terminals in a rectangular package style for industrial use. Suitable for telecom interfaces, it offers a nominal voltage of 3.3V and surface-mount capability.
RS9116W-SB00-AA1-X2A
Silicon Labs
TELECOM CIRCUIT;
CC1190RGVT
CC1190RGVT by Texas Instruments is a telecom IC with 16 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with power supplies of 2.5/3.3V. Ideal for industrial applications requiring a compact design and reliable performance.
BGM220PC22HNA2R
Silicon Labs BGM220PC22HNA2R is a telecom IC with 31 terminals, operating at -40 to 105°C. It has a data rate of 2 Mbps and operates at 3V. This rectangular package is ideal for telecom interface applications.
ETRX357-LRS
Silicon Labs' ETRX357-LRS is a telecom IC with 33 terminals, operating from -40 to 85°C. With a supply voltage of 3V, it's ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY package and DUAL terminal position.
XB3-24ARM
Digi International
The Digi International XB3-24ARM is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40°C to 85°C, making it suitable for various telecom applications. The RECTANGULAR package style and SPECIAL SHAPE design enhance its performance in Other Function Telecom Interface ICs.
TRF7970ARHBT
TRF7970ARHBT by Texas Instruments is a telecom IC with 32 terminals, operating at 5V. It offers a data rate of 0.848 Mbps and can withstand temperatures from -40 to 110°C. Ideal for industrial applications requiring high-speed communication in compact spaces.
SIM7600G
Simcom Wireless Solutions
SIM7600G by Simcom Wireless Solutions is a telecom IC with 135 terminals, operating from -40 to 85°C. It supports data rates up to 42 Mbps at a supply voltage of 3.8V. Ideal for industrial applications requiring high-speed cellular connectivity in a compact square package.
BLE113-A-V1
BLE113-A-V1 by Silicon Labs is a surface mount telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It features a rectangular package style, measures 15.725mm in length, and has a terminal pitch of 0.8mm. Ideal for industrial applications requiring low-profile telecom circuit integration.
BLUENRG-MSCSP
STMicroelectronics
BLUENRG-MSCSP by STMicroelectronics is a telecom IC with 34 terminals, operating at -40 to 85°C. Its grid array package has a very thin profile and fine pitch, suitable for industrial applications requiring a 3V supply voltage. The IC is designed for surface mount assembly in compact devices due to its small dimensions of 2.56mm width and 2.66mm length.
SA612AD/01
NXP Semiconductors
SA612AD/01 by NXP Semiconductors is a telecom IC with 8 terminals, operating from -40 to 85°C. It has a supply voltage of 6V and terminal pitch of 1.27mm. This small outline package is ideal for telecom circuit applications in industrial settings.
PN5321A3HN/C106;55
NXP Semiconductors' PN5321A3HN/C106;55 is a telecom IC with 40 terminals, operating b/w -30 to 85°C. It has a nominal voltage of 3.4V and terminal pitch of 0.5mm. This chip carrier package is suitable for various telecom circuit applications due to its compact size and surface mount capability.
LXMS33HCNG-134
Murata Manufacturing
Murata's LXMS33HCNG-134 is a telecom IC with small outline, very thin profile package. Operating temp range -40 to 85°C. Dual terminal position, no lead form for industrial applications in telecom interfaces.
LM2893MX
LM2893MX by National Semiconductor is a telecom interface IC with 20 terminals, operating b/w -40 to 85°C. It has a supply voltage of 18V and max current draw of 79mA. Ideal for industrial applications requiring small outline packages and gull wing terminals.
AD9671KBCZ
Analog Devices
AD9671KBCZ by Analog Devices is a 144-terminal GRID ARRAY IC with low profile and fine pitch. Operating b/w 0-85°C, it has a supply voltage of 1.4V and terminal pitch of 0.8mm. Ideal for telecom circuits, its package is made of PLASTIC/EPOXY and is surface mountable for various applications.
STID135-WB
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
WL1807MODGIMOCT
WL1807MODGIMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -40 to 85°C, it has a nominal voltage of 3.7V and supports data rates up to 100 Mbps. Ideal for industrial applications requiring high-speed telecommunications functionality.
AT86RF215-ZUR
Atmel
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;
NRF51822-QFAA-R7
Nordic Semiconductor Asa
NRF51822-QFAA-R7 by Nordic Semiconductor Asa is a 48-terminal chip carrier with a 3V supply voltage. Operating b/w -25°C to 75°C, it's ideal for telecom circuits due to its compact square shape (6x6mm) and very thin profile. This surface-mount IC has quad terminal positions and no-lead form, making it suitable for commercial extended temperature grade applications.
TRF7970ARHBR
TRF7970ARHBR by Texas Instruments is a telecom IC with 32 terminals, operating at 5V. It has a data rate of 0.848 Mbps and can withstand temperatures from -40 to 110°C. Ideal for telecom circuits, it comes in a square chip carrier package suitable for surface mounting applications.
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BGT24LTR11N16E6327XTSA1
Infineon Technologies
BGT24LTR11N16E6327XTSA1 by Infineon is a Telecom IC with 16 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and a terminal pitch of 0.5mm. This chip carrier is ideal for telecom circuit applications due to its very thin profile and industrial temperature grade suitability.
BGT24MTR11E6327XUMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;
BGT24MTR12E6327XUMA1
BGT24MTR12E6327XUMA1 by Infineon is a telecom IC with 32 terminals in a chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. With a supply voltage of 3.3V, it features a terminal pitch of 0.5mm and is surface mountable for various telecom interface applications.
BGT24MR2E6327XUMA1
BGT24AT2E6466XUMA1
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3;
BGT24LTR11N16
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 16; Package Code: HVBCC; Package Shape: SQUARE;
BGT24LTR11N16E6327
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 16; Package Code: VBCC; Package Shape: SQUARE;
BGT24LTR22
Other Telecom ICs; Moisture Sensitivity Level (MSL): 1;
BGT24AR2E6327
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGT24AR4E6433XUMA1
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;
BGT24ATR11E6327
BGT24ATR12E6433XUMA1
BGT24AT2E6433XUMA1
BGT24AR4
BGT24ATR11E6433
BGT24AR4E6466XUMA1
BGT24ATR12
BGT24ATR11
BGT24AR2
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
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12,000 In-Stock
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