Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;
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$12.296
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$13.662
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Digiode
$11.533
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$10.926
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Other Function Telecom Interface ICs BGT24ATR12E6433XUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Screening Level:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
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Terminal Position:
Width:
BGT24ATR12E6433XUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
DP83848IVVX/NOPB
Texas Instruments
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
2N7002
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
1N4148WT
Formosa Microsemi
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
STMicroelectronics
1N4148
Dc Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Electronic Transistors
Hy Electronic
Fagor Electronica S Coop
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
ENW89815A3KF
Panasonic
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 50; Peak Reflow Temperature (C): 250;
ISP1507-AX-RS
Insight Sip
ISP1507-AX-RS by Insight Sip is a telecom IC with 62 terminals, operating at -40 to 85°C. It has a data rate of 2 Mbps and runs on a 3V supply voltage. Ideal for industrial applications requiring high-speed communication in compact form factors.
SN65DSI85ZQER
SN65DSI85ZQER by Texas Instruments is a 64-terminal, industrial-grade telecom interface IC with a data rate of 1 Mbps. It operates b/w -40°C to 85°C and has a supply voltage of 1.8V. This square-shaped IC in grid array package is ideal for telecom circuit applications requiring fine pitch and low profile design.
SI4010-C2-GTR
Silicon Labs
SI4010-C2-GTR by Silicon Labs is a telecom IC with 10 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and uses CMOS technology. This small outline package is ideal for telecom circuit applications due to its industrial temperature grade and surface mount capability.
TM1062DVA1
Pulser
TELECOM CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
BLUENRG-M2SP
BLUENRG-M2SP by STMicroelectronics is a 20-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It comes in a rectangular package style, suitable for industrial applications requiring reliable telecom circuit interfaces. With surface mount capability and compact dimensions of 13.5mm x 11.5mm x 2.5mm, it offers peak reflow temperature of 240°C for efficient assembly processes.
CC1120RHBT
CC1120RHBT by Texas Instruments is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and data rate of 0.2 Mbps, suitable for telecom circuits in industrial applications. This surface-mount chip carrier package measures 5x5mm with a very thin profile, making it ideal for compact designs.
NRF51822-QFAB-R
Nordic Semiconductor Asa
NRF51822-QFAB-R by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, operating from -25 to 75°C. It features a square chip carrier package style at 0.95mm height, suitable for telecom circuit applications.
ST25R3917-AQWT
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
BMD-350-A-R
U-blox Ag
The U-blox Ag BMD-350-A-R is a telecom IC with 2 Mbps data rate, suitable for industrial applications. It operates b/w -40°C to 85°C, with peak reflow temperature of 250°C. This surface mount rectangular package has MSL level of 3 and is ideal for telecom circuit designs.
AS3933-BTST
Sciosense Bv
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
HMC641ALP4ETR
Analog Devices
HMC641ALP4ETR by Analog Devices is a telecom interface IC with 24 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a nominal negative supply voltage of -3V and terminal pitch of 0.5mm, it is ideal for telecom circuit designs requiring compact and high-performance solutions.
SN65LVCP114ZJA
SN65LVCP114ZJA by Texas Instruments is a telecom interface IC with 4 functions, operating at 2.5/3.3V. It features a grid array package style with 167 terminals and supports data rates up to 14200 Mbps. Ideal for industrial applications requiring high-speed communication in harsh environments.
SN65DSI86IPAPRQ1
SN65DSI86IPAPRQ1 by Texas Instruments is a telecom interface IC with 64 terminals in a square package. It operates b/w -40 to 85°C, with terminal finish of NiPdAu. This IC has a nominal voltage of 1.2V and is suitable for industrial temperature grade applications.
BGM113A256V2R
BGM113A256V2R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.8mm. This surface-mount IC is ideal for industrial applications requiring compact microelectronic assemblies.
TM266DVA1
Pulse Electronics
TM266DVA1 by Pulse Electronics is a telecom IC with 28 terminals, operating at -55 to 125°C. It features a 5V supply voltage and GULL WING terminals in a small outline package. Ideal for military-grade applications requiring hybrid technology and high reliability in telecommunications circuits.
BMD-350-A-R-00
BMD-350-A-R-00 by U-blox Ag is a telecom IC with 47 terminals, operating at -40 to 85°C. It has a data rate of 2 Mbps and nominal voltage of 3V. This surface-mount IC in rectangular package is ideal for industrial applications requiring high-speed telecom circuit integration.
XCC3235MODSF12MOBR
XCC3235MODSF12MOBR by Texas Instruments is a telecom IC with 63 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and comes in a rectangular chip carrier package. Ideal for industrial applications requiring telecom circuit interfaces.
ISL32275EFVZ-T
Intersil
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
RN4871-I/RM130
Microchip Technology
RN4871-I/RM130 by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates in an industrial temperature range of -40 to 85 °C and has a data rate of 0.01 Mbps. This IC is commonly used in telecom circuits for various applications.
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BGT24LTR11N16E6327XTSA1
Infineon Technologies
BGT24LTR11N16E6327XTSA1 by Infineon is a Telecom IC with 16 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and a terminal pitch of 0.5mm. This chip carrier is ideal for telecom circuit applications due to its very thin profile and industrial temperature grade suitability.
BGT24MTR11E6327XUMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;
BGT24MTR12E6327XUMA1
BGT24MTR12E6327XUMA1 by Infineon is a telecom IC with 32 terminals in a chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. With a supply voltage of 3.3V, it features a terminal pitch of 0.5mm and is surface mountable for various telecom interface applications.
BGT24MR2E6327XUMA1
BGT24AT2E6466XUMA1
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3;
BGT24LTR11N16
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 16; Package Code: HVBCC; Package Shape: SQUARE;
BGT24LTR11N16E6327
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 16; Package Code: VBCC; Package Shape: SQUARE;
BGT24LTR22
Other Telecom ICs; Moisture Sensitivity Level (MSL): 1;
BGT24AR2E6327
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGT24AR4E6433XUMA1
BGT24ATR11E6327
BGT24AT2E6433XUMA1
BGT24AR4
BGT24ATR11E6433
BGT24AR4E6466XUMA1
BGT24ATR11E6433XUMA1
BGT24ATR12
BGT24ATR11
BGT24AR2
Supply Digital Components
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