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BGM15HA12E6327XTSA1

Infineon Technologies

BGM15HA12E6327XTSA1 by Infineon Technologies

BGM15HA12E6327XTSA1 by Infineon is a telecom interface IC with 12 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 2.8V, it's ideal for telecom circuit applications requiring surface mount technology.

Median Price

$0.524

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,015 parts In-Stock

1+ parts

$0.036

100+ parts

$0.034

1k+ parts

$0.032

10k+ parts

-

1,015

$0.036

$0.034

$0.032

-

Chip1Stop

Japan . 1,015 parts In-Stock

1+ parts

$0.671

100+ parts

-

1k+ parts

-

10k+ parts

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1,015

$0.671

-

-

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Rochester

USA . 895,500 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

895,500

-

$0.515

$0.428

$0.381

Verical

USA . 895,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.534

10k+ parts

$0.476

895,500

-

-

$0.534

$0.476

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 422 parts In-Stock

1+ parts

$0.034

100+ parts

-

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422

$0.034

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Vyrian

USA . 8,385 parts In-Stock

1+ parts

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8,385

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Bristol Electronics

USA . 3,333 parts In-Stock

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3,333

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VNN

France . 3,206 parts In-Stock

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3,206

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 224,375 parts In-Stock

1+ parts

$0.029

100+ parts

-

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224,375

$0.029

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Semicontronic

India . 224,179 parts In-Stock

1+ parts

$0.029

100+ parts

$0.028

1k+ parts

$0.028

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-

224,179

$0.029

$0.028

$0.028

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Corphita

USA . 289 parts In-Stock

1+ parts

$0.032

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289

$0.032

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AZTECH Wire

Italy . 535 parts In-Stock

1+ parts

$10.120

100+ parts

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535

$10.120

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Advanced Electronics

New Zealand . 89 parts In-Stock

1+ parts

$11.336

100+ parts

$10.769

1k+ parts

$10.769

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89

$11.336

$10.769

$10.769

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Modulus Dynamics

Lithuania . 3,370 parts In-Stock

1+ parts

$14.543

100+ parts

$13.961

1k+ parts

$13.380

10k+ parts

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3,370

$14.543

$13.961

$13.380

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Corohmni

South Africa . 270 parts In-Stock

1+ parts

$15.641

100+ parts

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270

$15.641

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Aztec Data Supply Inc.

USA . 4,869 parts In-Stock

1+ parts

$17.080

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4,869

$17.080

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RC Electronics

USA . 83,778 parts In-Stock

1+ parts

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100+ parts

$0.390

1k+ parts

$0.350

10k+ parts

$0.340

83,778

-

$0.390

$0.350

$0.340

Argo Parts USA

USA . 4,257 parts In-Stock

1+ parts

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4,257

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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QUARKTWIN TECHNOLOGY LTD

USA . 3,156 parts In-Stock

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3,156

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Continental Prestige Electronics

USA . 1,645 parts In-Stock

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1,645

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Perfect Parts

USA . 112 parts In-Stock

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112

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Overview

Unlock the power of seamless communication with the BGM15HA12E6327XTSA1 by Infineon Technologies. This cutting-edge product boasts exceptional quality and reliability, thanks to its renowned manufacturer. Ideal for various telecom applications, this Telecom Interface IC offers unmatched value and benefits to customers. Say goodbye to connectivity issues and experience superior performance with this innovative solution. Choose the BGM15HA12E6327XTSA1 for a seamless communication experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and strength, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on circuit boards, saving time and resources during assembly.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and space-saving design, ideal for applications where size constraints are a consideration.

No. of Terminals: 12

Having 12 terminals allows for multiple connections and functionality, providing flexibility in usage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand heat stress and operate reliably in various environmental conditions.

Nominal Supply Voltage: 2.8 V

Operating at a nominal supply voltage of 2.8 V, the product is energy-efficient and suitable for low-power applications.

Technical Specifications

Other Function Telecom Interface ICs BGM15HA12E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PBCC-N12

JESD-609 Code:

e4

Length:

1.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.65 mm

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD NICKEL

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.1 mm

Trade Compliance

BGM15HA12E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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