Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Silicon Labs BGM123A256V2 is a telecom IC with 56 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and MSL level of 3. Suitable for industrial applications, it comes in a square package style measuring 6.5mm x 6.5mm x 1.4mm, making it ideal for surface mount assembly processes up to 260°C peak reflow temperature within 40 seconds.
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Surface mount allows for easy and efficient assembly onto circuit boards, saving time and reducing the overall size of the product.
Square package shape provides a compact design, saving space on the circuit board and making it suitable for applications where size is a constraint.
Having 56 terminals allows for a wide range of connectivity options, making this product versatile and suitable for complex telecom interfaces.
High maximum operating temperature ensures reliability even in demanding industrial environments where temperatures can fluctuate.
Low minimum operating temperature allows for consistent performance in cold conditions, making this product suitable for a wide range of operating environments.
Compact width of 6.5 mm enables efficient use of space on the circuit board and facilitates a streamlined design for applications with size constraints.
Operating at a nominal supply voltage of 3.3 V makes this product energy-efficient and compatible with standard power sources, ensuring ease of integration.
Other Function Telecom Interface ICs BGM123A256V2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Silicon Labs
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
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Package Style (Meter):
Peak Reflow Temperature (C):
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Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
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Maximum Time At Peak Reflow Temperature (s):
Width:
BGM123A256V2 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev 12/Oct/2022
PCN Packaging - IC/SIP MOQ Chg 11/Jan/2022 Labeling Change 14/Dec/2021
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
SMBJ18CA
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NC7WZ07P6X
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDLL4148
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
1N4148
Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
STMicroelectronics
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
LM555CMX
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
TLK2711IRCPG4
Texas Instruments
TLK2711IRCPG4 by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and peak reflow temp of 260°C. Ideal for telecom circuits, it features a flatpack package style and gull wing terminal form.
CC430F5137IRGZT
CC430F5137IRGZT by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.2V and data rate of 0.5 Mbps. Ideal for industrial applications requiring low power consumption and reliable communication.
ADF7012BRUZ-RL
Analog Devices
Analog Devices' ADF7012BRUZ-RL is a telecom IC with 24 terminals, operating at 2.5/3.3V. It has a temperature range of -40 to 85°C and uses CMOS technology. The package style is small outline, thin profile, shrink pitch, making it suitable for industrial telecom applications.
ESP32-D0WDQ6-V3
Espressif Systems (shanghai)
ESP32-D0WDQ6-V3 by Espressif Systems is a surface mount telecom IC with 1 function. It has a square package shape, 48 terminals, and a very thin profile. With a data rate of 150 Mbps, it is suitable for various telecom circuit applications.
DWM3000SQ
Qorvo
TELECOM CIRCUIT;
ATECC508A-SSHDA-B
Atmel
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MAX24287ETK+
MAX24287ETK+ by Microchip Technology is a telecom IC with 68 terminals in a square chip carrier package. It operates b/w -40 to 85°C, supporting circuits at 1.2V supply voltage for data rates up to 1000 Mbps. Ideal for applications requiring very thin profile and surface mount compatibility.
XB3-24Z8UM-J
Digi International
The Digi International XB3-24Z8UM-J is a surface mount telecom IC with 34 terminals. Operating temperature range of -40 to 85°C, suitable for industrial applications. Package style is microelectronic assembly, making it ideal for telecom circuit interfaces.
CC2640F128RSMT
CC2640F128RSMT by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuits, it features a terminal pitch of 0.4mm and no-lead terminal form for industrial applications.
SN65DSI85ZQER
SN65DSI85ZQER by Texas Instruments is a 64-terminal, industrial-grade telecom interface IC with a data rate of 1 Mbps. It operates b/w -40°C to 85°C and has a supply voltage of 1.8V. This square-shaped IC in grid array package is ideal for telecom circuit applications requiring fine pitch and low profile design.
PD69208T4ILQ-TR
Microchip Technology's PD69208T4ILQ-TR is a 56-terminal telecom IC with a max operating temp of 85°C. It features a no-lead terminal form, quad terminal position, and industrial temperature grade. Ideal for telecom circuits, this chip carrier package has a square shape and very thin profile for surface mount applications.
CY7B933-JXI
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
451-00002
Laird Technologies
Laird Technologies' 451-00002 is a surface mount telecom IC with 71 terminals. Operating b/w -40 to 85°C, it has a seated height of 2.35mm and nominal voltage of 3.3V. Ideal for telecom circuits, it offers data rates up to 2 Mbps in microelectronic assemblies.
BQ51003YFPT
BQ51003YFPT by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w -40 to 85°C, with a peak reflow temperature of 260°C. Suitable for telecom circuits, it has a battery supply of 5V and very thin profile at 0.5mm seated height.
A1101R08A00GM
Ttm Technologies
MAX7033EUI
Maxim Integrated
MAX7033EUI by Maxim Integrated is a telecom IC with 28 terminals, operating at -40 to 105°C. It has a supply voltage of 3.3V, consumes 0.00688mA current, and features GULL WING terminals for industrial applications in telecom circuits.
FUSB340TMX
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Code: HVQCCN; Package Shape: RECTANGULAR;
ANNA-B112-01B-00
U-blox Ag
SI4461-C2A-GMR
Silicon Labs
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL;
CYBLE-222014-01
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 22; Package Shape: SQUARE; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BGM111A256V21R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 31; Package Shape: RECTANGULAR; Length: 15 mm;
BGM13P22F512GE-V2
BGM111A256V2R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 31; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
BGM13P22F512GA-V2R
BGM113A256V2R
BGM113A256V2R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.8mm. This surface-mount IC is ideal for industrial applications requiring compact microelectronic assemblies.
BGM11S22F256GA-V2
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4; Terminal Finish: NICKEL GOLD;
BGM111A256V21
BGM111A256V21 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial telecom circuit applications due to its compact size and temperature range.
BGM111A256V2
BGM111A256V2 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial applications requiring reliable telecom circuit interfaces.
BGM13P22F512GA-V2
BGM113A256V21R
BGM113A256V21R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for industrial applications requiring a surface mount rectangular package style with a seated height of 2mm.
BGM113A256V2
BGM113A256V2 by Silicon Labs is a telecom IC with 36 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 0.8mm. This rectangular microelectronic assembly is ideal for industrial applications requiring telecom circuit interfaces.
BGM123A256V2R
BGM123A256V2R by Silicon Labs is a telecom IC with 56 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for telecom circuit applications in industrial settings due to its compact square package style and surface mount capability.
BGM113A256V21
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Shape: RECTANGULAR; Length: 15.73 mm;
BGM121A256V2R
BGM121A256V2R by Silicon Labs is a surface mount telecom interface IC with 1 function. It has a square package shape, 56 terminals, and a max seated height of 1.4mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 3.3V.
BGM15MA12E6327XTSA1
Infineon Technologies
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGM121A256V2
Silicon Labs' BGM121A256V2 is a telecom IC with 56 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial-grade applications. The surface-mountable square package measures 6.5mm x 6.5mm x 1.4mm, making it suitable for compact telecom interface solutions.
BGM15HA12E6327XTSA1
BGM15LA12E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR;
BGM13P22F512GE-V2R
BGM123A256V1R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Shape: SQUARE; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
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