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SN65LVCP114ZJA

Texas Instruments

SN65LVCP114ZJA by Texas Instruments

SN65LVCP114ZJA by Texas Instruments is a telecom interface IC with 4 functions, operating at 2.5/3.3V. It features a grid array package style with 167 terminals and supports data rates up to 14200 Mbps. Ideal for industrial applications requiring high-speed communication in harsh environments.

Median Price

$23.888

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 160 parts In-Stock

1+ parts

$22.570

100+ parts

$20.590

1k+ parts

$20.580

10k+ parts

$20.570

160

$22.570

$20.590

$20.580

$20.570

Texas Instruments

USA . 3,078 parts In-Stock

1+ parts

$25.205

100+ parts

$22.405

1k+ parts

$16.474

10k+ parts

-

3,078

$25.205

$22.405

$16.474

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DigiKey

USA . 659 parts In-Stock

1+ parts

$44.420

100+ parts

$34.277

1k+ parts

$30.746

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659

$44.420

$34.277

$30.746

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Arrow

USA . 320 parts In-Stock

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$20.610

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320

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$20.610

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Distributors (In-Stock)

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Digiode

USA . 3,199 parts In-Stock

1+ parts

$21.442

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3,199

$21.442

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Nova Conductors

Japan . 100 parts In-Stock

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$24.346

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100

$24.346

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Martec Srl

Italy . 3,200 parts In-Stock

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3,200

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Chip Stock

USA . 3,000 parts In-Stock

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3,000

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Component Sense

UK . 908 parts In-Stock

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908

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Vyrian

USA . 711 parts In-Stock

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711

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Sunrise Surplus Inc.

USA . 2 parts In-Stock

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Resion

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,245 parts In-Stock

1+ parts

$11.099

100+ parts

-

1k+ parts

$11.558

10k+ parts

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2,245

$11.099

-

$11.558

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DigiPath Technology Company

USA . 587 parts In-Stock

1+ parts

$12.222

100+ parts

$11.244

1k+ parts

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587

$12.222

$11.244

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ChromeModa Solutions

Germany . 5,762 parts In-Stock

1+ parts

$12.471

100+ parts

$10.226

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5,762

$12.471

$10.226

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$12.471

100+ parts

$11.847

1k+ parts

$11.224

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1,720

$12.471

$11.847

$11.224

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Ampacity Inc.

Singapore . 905 parts In-Stock

1+ parts

$17.520

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905

$17.520

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Semicontronic

India . 757 parts In-Stock

1+ parts

$17.520

100+ parts

$17.082

1k+ parts

$16.994

10k+ parts

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757

$17.520

$17.082

$16.994

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Corphita

USA . 4,334 parts In-Stock

1+ parts

$20.313

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4,334

$20.313

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Continental Prestige Electronics

USA . 5,219 parts In-Stock

1+ parts

$24.346

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$23.859

5,219

$24.346

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$23.859

Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$24.350

100+ parts

$23.132

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-

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$21.672

450

$24.350

$23.132

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$21.672

Corohmni

South Africa . 1,048 parts In-Stock

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$25.344

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1,048

$25.344

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Microchip USA

USA . 7,237 parts In-Stock

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$72.427

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$72.427

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Lixinc

USA . 10,248 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,231 parts In-Stock

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Perfect Parts

USA . 786 parts In-Stock

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786

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GreenTree Electronics

Israel . 544 parts In-Stock

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544

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A-Z Elektronik GmbH

Germany . 480 parts In-Stock

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480

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Kepictronics

USA . 250 parts In-Stock

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250

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Overview

Experience seamless communication with the SN65LVCP114ZJA by Texas Instruments. Crafted with precision and quality, this telecom interface IC offers unparalleled performance in a variety of applications. Whether you're looking to enhance your networking systems or improve data transmission, this versatile product is designed to meet your needs. With its reliable power supply, high-speed data rate, and industrial-grade temperature rating, the SN65LVCP114ZJA delivers exceptional value and efficiency to customers. Upgrade your telecom circuits today with Texas Instruments' leading-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology makes installation easy and efficient, saving time and effort during assembly.

No. of Functions: 4

Having multiple functions in one device increases functionality and versatility, allowing for more diverse applications.

Package Shape: SQUARE

A square package shape helps in efficient use of space and allows for easier placement on circuit boards.

Power Supplies (V): 2.5/3.3

Multiple power supply options offer flexibility in powering the device according to specific requirements.

No. of Terminals: 167

A high number of terminals allow for more connections and interfaces, enhancing the device's capabilities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style provides a compact design with a low profile and fine pitch, making it suitable for applications with space constraints.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand harsh environmental conditions and maintain reliable performance.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures the IC can function in cold conditions, increasing its versatility and usability in various environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and allows for easier access during assembly and maintenance.

Maximum Seated Height: 1.35 mm

A low maximum seated height helps in reducing the overall size of the device, making it suitable for compact applications.

Width: 12 mm

A width of 12mm offers a balance between size and functionality, allowing for easy integration into various systems.

Maximum Time At Peak Reflow Temperature (s): 30

A short maximum time at peak reflow temperature prevents overheating of the IC during soldering, reducing the risk of damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and connection of the IC, leading to reliable performance.

Length: 12 mm

A length of 12mm provides a compact form factor, suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates that the IC is designed to operate reliably in harsh industrial environments, making it a durable choice for industrial applications.

No. of Channels: 8

Having 8 channels allows for multiple communication paths, enabling the device to handle complex data transfer requirements.

Terminal Form: BALL

A terminal form of ball provides a reliable connection and easy soldering, ensuring a secure attachment to the PCB.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type, this IC is specifically designed for telecommunications applications, ensuring optimized performance and compatibility.

Nominal Supply Voltage: 2.5 V

Having a nominal supply voltage of 2.5V ensures stable and consistent power delivery to the IC, enhancing its performance and reliability.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8mm allows for compact and efficient connections on the circuit board, saving space and enabling high-density designs.

Data Rate: 14200 Mbps

A high data rate of 14200 Mbps enables fast and efficient data transfer, making this IC suitable for high-speed communication applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the IC can withstand moderate exposure to moisture during storage and handling, ensuring its reliability in various environments.

Technical Specifications

Other Function Telecom Interface ICs SN65LVCP114ZJA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

14200 Mbps

JESD-30 Code:

S-PBGA-B167

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

8

No. of Functions:

4

No. of Terminals:

167

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA167,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.35 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

SN65LVCP114ZJA Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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