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MRF24WB0MA/RM

Microchip Technology

MRF24WB0MA/RM by Microchip Technology

MRF24WB0MA/RM by Microchip: 3.3V supply, 36 terminals, telecom IC for commercial use. Rectangular package, surface mountable. Ideal for telecom circuit applications in temperatures from 0 to 70°C.

Median Price

$26.930

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

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$26.930

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Verical

USA . 3 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$30.800

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Chip Stock

USA . 9,847 parts In-Stock

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Vyrian

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Cogito LLC

Ukraine . 1,431 parts In-Stock

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Inventory MP

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Bristol Electronics

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Dan-Mar Components

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Connector Distribution Corp

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Right Parts Inc.

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AZTECH Wire

Italy . 590 parts In-Stock

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$7.309

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Aztec Data Supply Inc.

USA . 2,893 parts In-Stock

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$10.095

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$22.890

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Semicontronic

India . 3 parts In-Stock

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$22.890

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$22.318

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$22.203

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Corohmni

South Africa . 207 parts In-Stock

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$27.040

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$27.851

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$26.459

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Continental Prestige Electronics

USA . 6,894 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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$30.184

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Lixinc

USA . 18,214 parts In-Stock

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Marpe Global Electronics

Taiwan . 6,008 parts In-Stock

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Argo Parts USA

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QualityLine Systems

Poland . 3,028 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,834 parts In-Stock

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Perfect Parts

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XL Components Corporation

Australia . 32 parts In-Stock

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Overview

Unlock seamless connectivity with the MRF24WB0MA/RM by Microchip Technology, a leading manufacturer in the industry. Ideal for various applications in the telecom interface ICs category, this product offers unparalleled quality and reliability. With surface mount capability and a compact rectangular package shape, this IC provides effortless integration into your projects. Experience the value of smooth operation at temperatures ranging from 0 to 70°C, with a nominal supply voltage of 3.3V. Elevate your designs with the superior performance and efficiency of the MRF24WB0MA/RM.

Feature Benefit Bullets

Surface Mount: YES

The ability to be surface mounted makes the product easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into existing designs.

Power Supplies (V): 3.3

The 3.3V power supply allows for compatibility with a wide range of telecom systems.

No. of Terminals: 36

With 36 terminals, this product offers flexibility in connecting to other components and peripherals.

Package Style (Meter): UNCASED CHIP

The unencased chip package style allows for a compact design and efficient heat dissipation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for the product to be used in a wide range of environments.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures good electrical conductivity.

Terminal Position: UPPER

The upper terminal position makes it easier to access and connect to other components on the PCB.

Temperature Grade: COMMERCIAL

The commercial temperature grade means the product is suitable for standard operating conditions in commercial applications.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliant with RoHS regulations.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type IC, this product is specifically designed for use in telecom applications, ensuring reliable and efficient communication.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is ideal for telecom applications, providing compatibility and stability.

Technical Specifications

Other Function Telecom Interface ICs MRF24WB0MA/RM attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XUUC-N36

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

MODULE,36LEAD,.8

Package Shape:

Package Style (Meter):

UNCASED CHIP

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

MRF24WB0MA/RM Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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