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MRF24WG0MB-I/RM10C

Microchip Technology

MRF24WG0MB-I/RM10C by Microchip Technology

MRF24WG0MB-I/RM10C by Microchip Technology is a telecom interface IC with 1 function. It has a rectangular package shape, 36 terminals, and operates at temperatures ranging from -40 to 85 °C. This IC is commonly used in industrial applications requiring reliable wireless communication.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,034 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,034

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,078 parts In-Stock

1+ parts

$12.100

100+ parts

-

1k+ parts

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1,078

$12.100

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AZTECH Wire

Italy . 193 parts In-Stock

1+ parts

$14.538

100+ parts

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193

$14.538

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Corohmni

South Africa . 98 parts In-Stock

1+ parts

$15.759

100+ parts

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98

$15.759

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Ampacity Inc.

Singapore . 273 parts In-Stock

1+ parts

$361.000

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273

$361.000

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Semicontronic

India . 1,592 parts In-Stock

1+ parts

$925.000

100+ parts

$901.875

1k+ parts

$897.250

10k+ parts

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1,592

$925.000

$901.875

$897.250

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RGB Technical Solutions

Ukraine . 6,966 parts In-Stock

1+ parts

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6,966

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Argo Parts USA

USA . 3,071 parts In-Stock

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3,071

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Continental Prestige Electronics

USA . 3,034 parts In-Stock

1+ parts

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100+ parts

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3,034

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience seamless connectivity and stay ahead of the game with the MRF24WG0MB-I/RM10C by Microchip Technology. As a trusted manufacturer in the industry, Microchip delivers unmatched quality and reliability. This versatile telecom interface IC is designed to meet your diverse needs, offering unparalleled performance in a compact package. Whether you're looking to enhance your wireless communication systems or develop innovative IoT applications, this product has got you covered. With its industrial-grade temperature rating and advanced features, it ensures optimal functionality even in challenging environments. Say goodbye to connectivity issues and unlock endless possibilities with the MRF24WG0MB-I/RM10C. Get connected today!

Feature Benefit Bullets

No. of Functions: 1

This product provides a single versatile function, offering simplicity and ease of use.

Screening Level: TS 16949

With this high screening level, this product ensures excellent quality and reliability.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient utilization of space during installation.

No. of Terminals: 36

With 36 terminals, this product offers extensive connectivity options.

Package Style: MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style ensures precise and reliable circuitry.

Maximum Operating Temperature: 85 °C

This product can withstand high temperatures, making it suitable for various demanding environments.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product remains functional even in extreme cold conditions.

Terminal Position: DUAL

The dual terminal position facilitates easy and secure connections.

Maximum Seated Height: 2.7 mm

With a low maximum seated height, this product allows for compact and streamlined designs.

Width: 21 mm

The 21 mm width ensures compatibility with various mounting options and space limitations.

Length: 31 mm

The 31 mm length provides a balanced form factor for efficient integration and installation.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial environments, this product guarantees optimal performance in rugged conditions.

Terminal Form: NO LEAD

The no-lead terminal form minimizes the risk of damage and enhances durability.

Telecom IC Type: TELECOM CIRCUIT

Engineered specifically for telecom applications, this product delivers exceptional performance in the telecommunication field.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this product offers compatibility with standard power sources.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch ensures compatibility with industry-standard connectors and facilitates easy integration.

Technical Specifications

Other Function Telecom Interface ICs MRF24WG0MB-I/RM10C attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XDMA-N36

Length:

31 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Screening Level:

TS 16949

Maximum Seated Height:

2.7 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

21 mm

Trade Compliance

MRF24WG0MB-I/RM10C Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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