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MRF24WG0MBR-I/RM10C

Microchip Technology

MRF24WG0MBR-I/RM10C by Microchip Technology

MRF24WG0MBR-I/RM10C by Microchip: Telecom IC with 36 terminals, 3.3V supply voltage, -40 to 85°C operating temp range. Ideal for industrial telecom applications requiring TS 16949 screening level and compact MICROELECTRONIC ASSEMBLY package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,500 parts In-Stock

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5,500

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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AZTECH Wire

Italy . 588 parts In-Stock

1+ parts

$7.612

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588

$7.612

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Aztec Data Supply Inc.

USA . 2,524 parts In-Stock

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$12.920

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2,524

$12.920

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Corohmni

South Africa . 79 parts In-Stock

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$15.058

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79

$15.058

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Ampacity Inc.

Singapore . 1,237 parts In-Stock

1+ parts

$740.000

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1,237

$740.000

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West Coast Incorporated

USA . 1,514 parts In-Stock

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1,514

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Continental Prestige Electronics

USA . 1,471 parts In-Stock

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Argo Parts USA

USA . 308 parts In-Stock

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308

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Aranea Global

USA . 100 parts In-Stock

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Overview

Upgrade your connectivity with the MRF24WG0MBR-I/RM10C by Microchip Technology. This telecom interface IC offers unparalleled quality and reliability, meeting TS 16949 screening standards. With its compact rectangular package and industrial temperature grade, this product is perfect for a wide range of applications. Experience seamless communication and enhanced performance with Microchip Technology's cutting-edge technology. Elevate your projects with the MRF24WG0MBR-I/RM10C today!

Feature Benefit Bullets

Screening Level TS 16949

Ensures high quality and reliability in automotive applications, making this product a suitable choice for automotive telecom interface ICs.

No. of Terminals 36

Provides flexibility in connecting with other components and peripherals, enabling versatile usage.

Maximum Operating Temperature 85 °C

Allows for operation in high temperature environments, increasing the product's usability in various conditions.

Minimum Operating Temperature -40 °C

Can withstand low temperatures, making it suitable for use in cold environments.

Width 21 mm

Compact size enables easy integration into space-constrained applications.

Length 31 mm

Optimal dimensions for fitting into different types of systems and devices.

Temperature Grade INDUSTRIAL

Designed to operate reliably in industrial settings, ensuring durability and performance in demanding conditions.

Nominal Supply Voltage 3.3 V

Standard voltage requirement for compatibility with a wide range of electronic systems and power sources.

Technical Specifications

Other Function Telecom Interface ICs MRF24WG0MBR-I/RM10C attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XDMA-N36

Length:

31 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Screening Level:

TS 16949

Maximum Seated Height:

2.7 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Width:

21 mm

Trade Compliance

MRF24WG0MBR-I/RM10C Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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