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BGSF110GN26E6327XTSA1

Infineon Technologies

BGSF110GN26E6327XTSA1 by Infineon Technologies

BGSF110GN26E6327XTSA1 by Infineon is a Telecom IC with 26 terminals in a rectangular chip carrier package. Operating temperature range from -30 to 85°C, suitable for telecom circuits. Utilizes CMOS technology with a nominal voltage of 3V, ideal for surface mount applications.

Median Price

$1.409

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 819,983 parts In-Stock

1+ parts

-

100+ parts

$1.380

1k+ parts

$1.150

10k+ parts

$1.020

819,983

-

$1.380

$1.150

$1.020

Verical

USA . 498,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

$1.275

498,000

-

-

$1.438

$1.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 409 parts In-Stock

1+ parts

$1.074

100+ parts

-

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-

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-

409

$1.074

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.420

100+ parts

-

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-

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-

50

$1.420

-

-

-

Vyrian

USA . 8,661 parts In-Stock

1+ parts

-

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8,661

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VNN

France . 911 parts In-Stock

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911

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 819,768 parts In-Stock

1+ parts

$0.960

100+ parts

$0.936

1k+ parts

$0.931

10k+ parts

-

819,768

$0.960

$0.936

$0.931

-

Ampacity Inc.

Singapore . 819,555 parts In-Stock

1+ parts

$0.960

100+ parts

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819,555

$0.960

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Corphita

USA . 206 parts In-Stock

1+ parts

$1.017

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-

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206

$1.017

-

-

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Continental Prestige Electronics

USA . 3,819 parts In-Stock

1+ parts

$1.420

100+ parts

-

1k+ parts

-

10k+ parts

$1.392

3,819

$1.420

-

-

$1.392

Argo Parts USA

USA . 170 parts In-Stock

1+ parts

$1.420

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-

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170

$1.420

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.420

100+ parts

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100

$1.420

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-

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Modulus Dynamics

Lithuania . 3,644 parts In-Stock

1+ parts

$9.356

100+ parts

$8.982

1k+ parts

$8.608

10k+ parts

-

3,644

$9.356

$8.982

$8.608

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$11.756

100+ parts

$11.169

1k+ parts

$11.169

10k+ parts

-

350

$11.756

$11.169

$11.169

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Aztec Data Supply Inc.

USA . 2,389 parts In-Stock

1+ parts

$13.885

100+ parts

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2,389

$13.885

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Corohmni

South Africa . 388 parts In-Stock

1+ parts

$15.674

100+ parts

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388

$15.674

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AZTECH Wire

Italy . 1,104 parts In-Stock

1+ parts

$20.520

100+ parts

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10k+ parts

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1,104

$20.520

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Overview

Unlock a world of seamless connectivity with the BGSF110GN26E6327XTSA1 by Infineon Technologies. Crafted with precision and expertise, this telecom interface IC boasts top-notch quality and reliability. Perfectly suited for a range of applications in the telecommunications industry, this product offers unparalleled value and benefits to customers. Experience efficient performance, easy installation, and superior functionality with the BGSF110GN26E6327XTSA1. Elevate your communication systems with this cutting-edge technology from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort.

Package Shape: RECTANGULAR

Compact and space-saving design for efficient PCB layout.

No. of Terminals: 26

Plenty of connection options for versatile integration into telecom systems.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for various environmental conditions.

Minimum Operating Temperature: -30 °C

Can operate in low-temperature environments without issues, providing reliability in different settings.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Provides excellent conductivity and corrosion resistance for long-lasting performance.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Nominal Supply Voltage: 3 V

Operates at a common voltage level, making it compatible with various systems.

Technical Specifications

Other Function Telecom Interface ICs BGSF110GN26E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PQCC-N26

JESD-609 Code:

e4

Length:

3.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

26

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Maximum Seated Height:

.77 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Position:

QUAD

Width:

2.6 mm

Trade Compliance

BGSF110GN26E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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