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HTSH5601ETK,118

NXP Semiconductors

HTSH5601ETK,118 by NXP Semiconductors

NXP Semiconductors' HTSH5601ETK,118 is a telecom IC with 2 terminals in a small outline package. It operates b/w -25°C to 85°C and can withstand peak reflow temperature of 260°C for 30s. Ideal for telecom circuit applications due to its surface mount capability and dual terminal position.

Median Price

$0.442

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,870 parts In-Stock

1+ parts

$0.850

100+ parts

$0.541

1k+ parts

$0.463

10k+ parts

$0.404

5,870

$0.850

$0.541

$0.463

$0.404

DigiKey

USA . 5,712 parts In-Stock

1+ parts

$0.850

100+ parts

$0.630

1k+ parts

$0.548

10k+ parts

-

5,712

$0.850

$0.630

$0.548

-

Arrow

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.272

24,000

-

-

-

$0.272

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.372

9,000

-

-

-

$0.372

Rochester

USA . 129 parts In-Stock

1+ parts

-

100+ parts

$0.442

1k+ parts

$0.366

10k+ parts

$0.327

129

-

$0.442

$0.366

$0.327

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,889 parts In-Stock

1+ parts

$0.286

100+ parts

-

1k+ parts

-

10k+ parts

-

3,889

$0.286

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.362

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$0.362

-

-

-

Vyrian

USA . 11,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,031

-

-

-

-

NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.408

6,000

-

-

-

$0.408

Anansix

USA . 2,498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,498

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,410 parts In-Stock

1+ parts

$0.231

100+ parts

-

1k+ parts

-

10k+ parts

-

11,410

$0.231

-

-

-

Corphita

USA . 2,237 parts In-Stock

1+ parts

$0.271

100+ parts

-

1k+ parts

-

10k+ parts

-

2,237

$0.271

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.355

100+ parts

-

1k+ parts

$0.341

10k+ parts

-

50

$0.355

-

$0.341

-

Argo Parts USA

USA . 3,413 parts In-Stock

1+ parts

$0.362

100+ parts

-

1k+ parts

-

10k+ parts

$0.351

3,413

$0.362

-

-

$0.351

Continental Prestige Electronics

USA . 149 parts In-Stock

1+ parts

$0.362

100+ parts

-

1k+ parts

-

10k+ parts

$0.355

149

$0.362

-

-

$0.355

Semicontronic

India . 22,211 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

22,211

$0.500

$0.488

$0.485

-

Corohmni

South Africa . 113 parts In-Stock

1+ parts

$7.545

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$7.545

-

-

-

Aztec Data Supply Inc.

USA . 1,712 parts In-Stock

1+ parts

$14.520

100+ parts

-

1k+ parts

-

10k+ parts

-

1,712

$14.520

-

-

-

Perfect Parts

USA . 53,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

53,760

-

-

-

-

Glotronic Ltd.

UK . 19,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,200

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

UNI Independent Distributors

Spain . 2,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,370

-

-

-

-

Robosynatics

Brazil . 2,323 parts In-Stock

1+ parts

-

100+ parts

$8.499

1k+ parts

$8.325

10k+ parts

$8.325

2,323

-

$8.499

$8.325

$8.325

Lucentia Tech

USA . 2,323 parts In-Stock

1+ parts

-

100+ parts

$8.499

1k+ parts

$8.325

10k+ parts

$8.325

2,323

-

$8.499

$8.325

$8.325

Overview

Upgrade your telecom devices with the HTSH5601ETK,118 by NXP Semiconductors. This high-quality telecom interface IC offers unparalleled reliability and performance, thanks to NXP's leading expertise in semiconductor manufacturing. Ideal for a wide range of applications, this product ensures seamless communication and connectivity. Trust NXP to deliver cutting-edge technology that enhances your products and exceeds customer expectations. Unlock the potential of your telecom devices with the HTSH5601ETK,118 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to environmental factors, making this product a reliable choice for telecom applications.

Surface Mount: YES

The surface mount capability simplifies the assembly process, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board, making it suitable for compact telecom devices.

No. of Terminals: 2

Having a small number of terminals simplifies the connection process and reduces the risk of errors during installation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making this product ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can perform reliably in a variety of telecom environments, including those with elevated temperatures.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures that this product can function effectively in cold telecom environments without risking damage.

Terminal Position: DUAL

The dual terminal position allows for flexibility in connection options, providing compatibility with a variety of telecom systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature minimizes the risk of damage to the product during the soldering process, ensuring its reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes this product suitable for use in telecom applications where high temperature soldering processes are required.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination, making this product environmentally friendly and compliant with RoHS regulations.

Telecom IC Type: TELECOM CIRCUIT

The specific telecom circuit type ensures that this product is designed to meet the performance and compatibility requirements of telecom systems, making it a dependable choice for telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs HTSH5601ETK,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N2

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

LCC2(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HTSH5601ETK,118 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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