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HTSH4801ETK,118

NXP Semiconductors

HTSH4801ETK,118 by NXP Semiconductors

NXP Semiconductors' HTSH4801ETK,118 is a telecom interface IC in a small outline package. With a max operating temp of 85°C and min of -25°C, it's suitable for telecom circuits. This surface-mount IC has dual terminals and can withstand peak reflow temp of 260°C for up to 30s.

Median Price

$1.746

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 36 parts In-Stock

1+ parts

$0.590

100+ parts

-

1k+ parts

-

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36

$0.590

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Mouser Electronics

USA . 2,073 parts In-Stock

1+ parts

$2.310

100+ parts

$1.390

1k+ parts

$1.230

10k+ parts

-

2,073

$2.310

$1.390

$1.230

-

DigiKey

USA . 7,215 parts In-Stock

1+ parts

$2.410

100+ parts

$1.800

1k+ parts

$1.573

10k+ parts

-

7,215

$2.410

$1.800

$1.573

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Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$1.183

9,000

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-

-

$1.183

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,059 parts In-Stock

1+ parts

$0.685

100+ parts

-

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1,059

$0.685

-

-

-

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.804

100+ parts

-

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450

$0.804

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-

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Vyrian

USA . 3,869 parts In-Stock

1+ parts

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3,869

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Anansix

USA . 1,405 parts In-Stock

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1,405

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 11,510 parts In-Stock

1+ parts

$0.540

100+ parts

$1.460

1k+ parts

$0.990

10k+ parts

-

11,510

$0.540

$1.460

$0.990

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Corphita

USA . 1,803 parts In-Stock

1+ parts

$0.649

100+ parts

-

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1,803

$0.649

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Ampacity Inc.

Singapore . 3,831 parts In-Stock

1+ parts

$1.330

100+ parts

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3,831

$1.330

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UNI Independent Distributors

Spain . 4,687 parts In-Stock

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4,687

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.788

1k+ parts

$0.764

10k+ parts

$0.748

500

-

$0.788

$0.764

$0.748

Overview

Unlock seamless communication solutions with the HTSH4801ETK,118 by NXP Semiconductors. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. From enhancing connectivity in telecommunications systems to ensuring smooth data transmission, this product is designed to meet the diverse needs of today's technology-driven world. Experience the value and benefits of superior performance and efficiency with the HTSH4801ETK,118, a game-changer in the telecom industry. Trust NXP Semiconductors for cutting-edge solutions that elevate your communication experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the telecom interface IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount packaging allows for easy installation and replacement of the IC, making it convenient for manufacturing and maintenance purposes.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard PCB layouts and allows for efficient use of space in electronic designs.

No. of Terminals: 2

Having 2 terminals simplifies the connection process and reduces the likelihood of wiring errors during installation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact designs, ideal for applications where size is limited.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the IC can withstand harsh environmental conditions and maintain performance over a wide range of temperatures.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature enables the IC to function reliably in cold environments without the risk of damage or malfunction.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connections and allows for versatile application in various telecom interface systems.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature ensures quick and efficient soldering process during manufacturing, reducing assembly time and production costs.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for reliable solder joints and ensures the IC can withstand the soldering process without any damage.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and reduces the risk of harmful substances in the manufacturing process, making the IC environmentally friendly.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit IC, this product is specifically designed and optimized for telecommunications applications, ensuring high performance and reliability in such systems.

Technical Specifications

Other Function Telecom Interface ICs HTSH4801ETK,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N2

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

LCC2(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HTSH4801ETK,118 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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