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HTSH4801ETK

NXP Semiconductors

HTSH4801ETK by NXP Semiconductors

HTSH4801ETK by NXP Semiconductors is a telecom interface IC designed for reliable performance in various applications. It features a dual terminal, operates b/w -25 °C and 85 °C, and comes in a compact rectangular package. Ideal for surface mount designs, it enhances communication systems efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,131 parts In-Stock

1+ parts

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1k+ parts

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1,131

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Digiode

USA . 901 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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901

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Vyrian

USA . 155 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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155

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,526 parts In-Stock

1+ parts

$219.000

100+ parts

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1k+ parts

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10k+ parts

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1,526

$219.000

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UNI Independent Distributors

Spain . 5,949 parts In-Stock

1+ parts

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5,949

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Corphita

USA . 707 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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707

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Overview

Discover the HTSH4801ETK by NXP Semiconductors, a leader in innovative telecom solutions. This compact interface IC delivers exceptional reliability and performance across various applications, ensuring seamless communication for your projects. With NXP's commitment to quality and cutting-edge technology, the HTSH4801ETK offers remarkable value, making it the ideal choice for enhancing connectivity while optimizing power efficiency and thermal stability. Elevate your designs with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and stability, protecting the IC from environmental factors.

Surface Mount: YES

Surface mount capability allows for easy integration into compact designs, saving space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient layout and thermal management on printed circuit boards.

No. of Terminals: 2

With only 2 terminals, this IC simplifies connections, reducing potential points of failure and minimizing design complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, providing flexibility in design.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C makes it suitable for a wide range of applications, ensuring performance under various conditions.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25 °C means this product can function effectively in harsh environments.

Terminal Position: DUAL

Dual terminal position allows for symmetrical mounting and improves mechanical stability on the PCB.

Terminal Form: NO LEAD

No lead terminal form enhances design flexibility and contributes to lower profile assemblies, making it suitable for modern compact devices.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type ensures this IC is specifically designed for communication applications, offering reliability in connection and transmission.

Technical Specifications

Other Function Telecom Interface ICs HTSH4801ETK attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N2

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

HTSH4801ETK Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.32.00

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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