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HTSH5601ETK

NXP Semiconductors

HTSH5601ETK by NXP Semiconductors

HTSH5601ETK by NXP Semiconductors is a telecom interface IC designed for reliable performance in various applications. It features a dual terminal, operates b/w -25 °C and 85 °C, and comes in a compact rectangular package. Ideal for surface mount technology, it enhances telecom circuit efficiency.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 757 parts In-Stock

1+ parts

$1.000

100+ parts

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757

$1.000

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J2 Sourcing AB

Sweden . 30,000 parts In-Stock

1+ parts

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1k+ parts

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30,000

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Digiode

USA . 442 parts In-Stock

1+ parts

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442

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Anansix

USA . 85 parts In-Stock

1+ parts

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85

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ComSIT Distribution GmbH

Germany . 82 parts In-Stock

1+ parts

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82

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 394 parts In-Stock

1+ parts

$412.000

100+ parts

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394

$412.000

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Infinite Electronics LLP (Excess)

. 30,004 parts In-Stock

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30,004

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Corphita

USA . 4,382 parts In-Stock

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4,382

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UNI Independent Distributors

Spain . 586 parts In-Stock

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586

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Overview

Elevate your telecom solutions with the HTSH5601ETK from NXP Semiconductors, a trusted leader in cutting-edge technology. This compact interface IC is designed for reliability and efficiency, ensuring seamless communication across various applications. Experience superior performance under challenging conditions, with an operating range that promises durability. Unlock new potentials in your projects—choose quality, choose NXP, and transform your connectivity today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, ensuring longevity and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, improving space efficiency on PCBs and enabling higher density circuit layouts.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the printed circuit board, making it easier to route signals and fit into tight designs.

No. of Terminals: 2

With only two terminals, the component simplifies circuit connections, reducing complexity and improving assembly efficiency.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for modern electronic devices, allowing for miniaturization without sacrificing performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows this IC to function reliably in a wide range of environments, making it suitable for various telecom applications.

Minimum Operating Temperature: -25 °C

The ability to operate at a minimum temperature of -25 °C ensures performance in colder conditions, widening the usage scenarios for this telecom IC.

Terminal Position: DUAL

The dual terminal position enhances connectivity options, providing flexibility in design and ease of integration within systems.

Terminal Form: NO LEAD

No lead configuration simplifies the soldering process and enhances mechanical stability, leading to better performance in compact designs.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit IC, it is specifically designed for telecommunications applications, ensuring optimized performance for signaling and data transmission.

Technical Specifications

Other Function Telecom Interface ICs HTSH5601ETK attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N2

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

HTSH5601ETK Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.32.00

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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