Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SA636DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include nickel palladium gold terminal finish, 3V supply voltage, and gull wing terminal form for telecom circuit applications.
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This material provides durability and protection for the telecom interface IC, ensuring long-term functionality.
Surface mount packaging allows for easy installation and space-saving on PCBs.
Rectangular shape simplifies the integration of this IC into circuit designs.
Having 20 terminals enables this IC to handle multiple connections and functions efficiently.
With a high maximum operating temperature, this IC can perform reliably in various environments.
This finish ensures good conductivity and corrosion resistance, improving the overall performance of the IC.
The compact width of this IC allows for efficient use of space on PCBs.
The high peak reflow temperature enables the IC to withstand the soldering process during assembly.
Operating at a low nominal supply voltage makes this IC energy-efficient.
Other Function Telecom Interface ICs SA636DK/01,112 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
SA636DK/01,112 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Multiple Parts obs 26/May/2022
PCN Assembly/Origin - Transf RC3 Line ASMC from 125mm to 150mm 18/Dec/2015
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
SMBJ18CA
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
LM7805CT
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Electronic Transistors
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
SS14
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
M24308/2-1F
Souriau
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Body or Shell Style: RECEPTACLE; MIL Conformity: YES;
Boca Semiconductor
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
1N4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
88E6176-A1-TFJ2I000
Marvell Technology
Marvell Technology's 88E6176-A1-TFJ2I000 is a telecom circuit IC with 128 terminals in a square flatpack package. It features gull wing terminal form and quad terminal position, suitable for surface mount applications. Ideal for various functions in telecommunications interfaces.
PCM3060PWR
Texas Instruments
PCM3060PWR by Texas Instruments is a 2-channel Telecom IC with CMOS technology. It operates b/w -25°C to 85°C, with a supply voltage of 3.3V. The package style is small outline, thin profile, and shrink pitch, making it suitable for telecom circuit applications.
BT8510EPJC
Conexant Systems
Conexant Systems' BT8510EPJC is a CMOS telecom IC with 68 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, requiring 5V supply voltage and drawing 0.1mA current. Ideal for CEPT PCM-30/E-1 applications, it features tin/lead terminal finish and quad position.
A1101R09C00GM
Ttm Technologies
TELECOM CIRCUIT;
AD9364BBCZ
AD9364BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.8V. Ideal for telecom circuits, it features a fine pitch and bottom terminal position for surface mount applications.
PD69208T4ILQ-TR
Microchip Technology
Microchip Technology's PD69208T4ILQ-TR is a 56-terminal telecom IC with a max operating temp of 85°C. It features a no-lead terminal form, quad terminal position, and industrial temperature grade. Ideal for telecom circuits, this chip carrier package has a square shape and very thin profile for surface mount applications.
SX1502I087TRT
Semtech
Semtech's SX1502I087TRT is a telecom IC with 20 terminals in a square chip carrier package. Operating from -40 to 85°C, it has a nominal voltage of 3.3V and matte tin terminal finish. Ideal for telecom circuits, this IC is surface mountable and features an industrial temperature grade.
HT12D(18DIP)
Holtek Semiconductor
HT12D(18DIP) by Holtek Semiconductor is a CMOS telecom IC with 18 terminals. It operates at temperatures from -20°C to 70°C and supports power supplies of 2.4V to 12V. This rectangular, plastic package is ideal for telecom circuit applications.
AP22804AW5-7
Diodes Incorporated
Diodes Inc.'s AP22804AW5-7 is a telecom IC with 5 terminals, operating from -40 to 85°C. Its small outline package is ideal for telecom circuits, featuring matte tin finish and gull wing terminals. With a nominal 5V supply voltage, it's suitable for industrial applications requiring compact design and high temperature tolerance.
TLK2711AJRZQE
TLK2711AJRZQE by Texas Instruments is a telecom interface IC with 80 terminals in a square grid array package. Operating at 2.5V, it has a temperature range of 0-70°C and terminal finish of Tin Silver Copper. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design for commercial applications.
TM266DVA1
Pulse Electronics
TM266DVA1 by Pulse Electronics is a telecom IC with 28 terminals, operating at -55 to 125°C. It features a 5V supply voltage and GULL WING terminals in a small outline package. Ideal for military-grade applications requiring hybrid technology and high reliability in telecommunications circuits.
SA616DK/01,112
NXP Semiconductors
SA616DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features nickel palladium gold terminal finish and gull wing form factor for telecom circuit applications.
NINA-B112-03B-00
U-blox Ag
Inrcore
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP28,.5;
ISL32275EFVZ-T
Intersil
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
ADRV9008BBCZ-1
ADRV9008BBCZ-1 by Analog Devices is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom applications requiring precise signal processing and connectivity in industrial environments.
AS3933-BQFT
Sciosense Bv
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
SJA1105TELY
The NXP SJA1105TELY is a telecom interface IC with 159 terminals in a grid array package. It operates b/w -40°C to 105°C, supporting data rates up to 100 Mbps. Designed for telecom circuits, it has a low profile and fine pitch, making it suitable for various applications.
CC1175RHBR
CC1175RHBR by Texas Instruments is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5/3.3V and data rate of 0.2 Mbps, suitable for industrial applications requiring a compact chip carrier package with surface mount capability.
TM1062DSB2
Pulser
TELECOM CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SA636DK/01,118
SA636DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features nickel palladium gold terminal finish and 3V nominal voltage for telecom circuit applications.
SA639DH/01,118
SA639DH/01,118 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. Operating b/w -40 to 85 °C, it has a nominal voltage of 3V and terminal pitch of 0.65mm. Ideal for industrial applications requiring telecom circuit functionality.
SA636DK/01
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
SA638
Philips Semiconductors
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
SA636BS,115
SA636BS,115 by NXP Semiconductors is a telecom interface IC with 1 function. It has a package style of CHIP CARRIER and a very thin profile. With an operating temperature range of -40 to 85 °C, it is suitable for industrial applications.
SA636DK/02J
SA639DH/01,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
SA636DK,112
SA639DH,518
SA636DK,118
SA639DH-T
SA636DK-T
SA639
SA639DH,512
SA639DH
SA636BS
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: VQCCN; Package Shape: SQUARE;
SA636DK
SA636DK/02
SA639DH/01
SA639DH/01 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V, it features gull wing terminals and is designed for telecom circuit applications.
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