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SA636DK/01,112

NXP Semiconductors

SA636DK/01,112 by NXP Semiconductors

SA636DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include nickel palladium gold terminal finish, 3V supply voltage, and gull wing terminal form for telecom circuit applications.

Median Price

$5.310

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$5.310

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-

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650

$5.310

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Vyrian

USA . 8,056 parts In-Stock

1+ parts

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8,056

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Digiode

USA . 2,227 parts In-Stock

1+ parts

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2,227

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Anansix

USA . 498 parts In-Stock

1+ parts

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498

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Cogito LLC

Ukraine . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,881 parts In-Stock

1+ parts

$5.310

100+ parts

-

1k+ parts

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10k+ parts

$5.204

6,881

$5.310

-

-

$5.204

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.310

100+ parts

-

1k+ parts

$5.044

10k+ parts

$4.938

2,000

$5.310

-

$5.044

$4.938

Aztec Data Supply Inc.

USA . 2,835 parts In-Stock

1+ parts

$6.770

100+ parts

-

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2,835

$6.770

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Advanced Electronics

New Zealand . 30 parts In-Stock

1+ parts

$13.516

100+ parts

$12.840

1k+ parts

$12.840

10k+ parts

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30

$13.516

$12.840

$12.840

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AZTECH Wire

Italy . 263 parts In-Stock

1+ parts

$19.295

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263

$19.295

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Semicontronic

India . 1,275 parts In-Stock

1+ parts

$231.000

100+ parts

$225.225

1k+ parts

$224.070

10k+ parts

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1,275

$231.000

$225.225

$224.070

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Ampacity Inc.

Singapore . 1,601 parts In-Stock

1+ parts

$705.000

100+ parts

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1,601

$705.000

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One Stop Electronics

USA . 1,014 parts In-Stock

1+ parts

$785.000

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1,014

$785.000

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Perfect Parts

USA . 5,880 parts In-Stock

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5,880

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UNI Independent Distributors

Spain . 4,844 parts In-Stock

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4,844

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Corphita

USA . 4,057 parts In-Stock

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4,057

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Argo Parts USA

USA . 3,018 parts In-Stock

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3,018

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Corohmni

South Africa . 1,273 parts In-Stock

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1,273

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Robosynatics

Brazil . 172 parts In-Stock

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172

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Lucentia Tech

USA . 172 parts In-Stock

1+ parts

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100+ parts

$14.079

1k+ parts

$13.791

10k+ parts

$13.791

172

-

$14.079

$13.791

$13.791

Overview

Enhance your telecom projects with the SA636DK/01,112 by NXP Semiconductors. Known for their top-notch quality and reliability, NXP Semiconductors delivers cutting-edge solutions in the telecom interface ICs category. This product boasts a compact design with a small outline and low profile, making it perfect for various applications. Experience seamless communication and enhanced functionality with the SA636DK/01,112, offering customers unparalleled value, benefits, and advantages. Elevate your projects with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the telecom interface IC, ensuring long-term functionality.

Surface Mount: YES

Surface mount packaging allows for easy installation and space-saving on PCBs.

Package Shape: RECTANGULAR

Rectangular shape simplifies the integration of this IC into circuit designs.

No. of Terminals: 20

Having 20 terminals enables this IC to handle multiple connections and functions efficiently.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can perform reliably in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish ensures good conductivity and corrosion resistance, improving the overall performance of the IC.

Width: 4.4 mm

The compact width of this IC allows for efficient use of space on PCBs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables the IC to withstand the soldering process during assembly.

Nominal Supply Voltage: 3 V

Operating at a low nominal supply voltage makes this IC energy-efficient.

Technical Specifications

Other Function Telecom Interface ICs SA636DK/01,112 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SA636DK/01,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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