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SA636BS,115

NXP Semiconductors

SA636BS,115 by NXP Semiconductors

SA636BS,115 by NXP Semiconductors is a telecom interface IC with 1 function. It has a package style of CHIP CARRIER and a very thin profile. With an operating temperature range of -40 to 85 °C, it is suitable for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,972 parts In-Stock

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2,972

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Digiode

USA . 1,128 parts In-Stock

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1,128

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Anansix

USA . 692 parts In-Stock

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692

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Nova Conductors

Japan . 36 parts In-Stock

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36

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Distributors (Availability)

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Corohmni

South Africa . 213 parts In-Stock

1+ parts

$8.369

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213

$8.369

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Aztec Data Supply Inc.

USA . 2,285 parts In-Stock

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$10.544

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2,285

$10.544

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AZTECH Wire

Italy . 452 parts In-Stock

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$12.621

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452

$12.621

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Advanced Electronics

New Zealand . 81 parts In-Stock

1+ parts

$12.855

100+ parts

$11.698

1k+ parts

$10.541

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81

$12.855

$11.698

$10.541

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One Stop Electronics

USA . 299 parts In-Stock

1+ parts

$470.000

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299

$470.000

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Ampacity Inc.

Singapore . 1,441 parts In-Stock

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$512.000

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1,441

$512.000

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UNI Independent Distributors

Spain . 5,821 parts In-Stock

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5,821

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Continental Prestige Electronics

USA . 4,064 parts In-Stock

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Corphita

USA . 3,067 parts In-Stock

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3,067

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Argo Parts USA

USA . 877 parts In-Stock

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Benley Electronics

USA . 400 parts In-Stock

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400

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Experience the next level of telecommunications with the SA636BS,115 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors has crafted this cutting-edge product to deliver unrivaled quality and performance. Whether you're looking to enhance your communication devices or streamline your telecom infrastructure, this versatile chip carrier offers seamless integration and exceptional reliability. With its compact design and industrial-grade temperature resistance, the SA636BS,115 is built to exceed your expectations. Trust NXP Semiconductors to provide you with the best solutions for all your telecom interface needs. Elevate your connectivity today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy installation on printed circuit boards, saving time and making the product more compact.

No. of Terminals: 20

Having a high number of terminals allows for more connectivity options and flexibility in designing circuits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Nominal Supply Voltage: 3 V

The low supply voltage requirement makes this product energy-efficient and suitable for battery-powered devices.

Technical Specifications

Other Function Telecom Interface ICs SA636BS,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N20

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

SA636BS,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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