Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SA639DH,518 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. Operating from -40 to 85°C, it has a nominal voltage of 3V. Ideal for telecom circuits, this IC features gull wing terminals and is suitable for industrial temperature grades.
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AZTECH Wire
$8.751
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$453.000
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$776.000
Bastille Electronics
UNI Independent Distributors
Corphita
This material provides good durability and reliability for the product, making it suitable for long-term use in various environments.
Ease of installation and space-saving design due to surface mount capability.
Rectangular shape allows for easier integration into different systems and designs.
Sufficient number of terminals for connectivity and functionality.
Suitable for operation in a wide range of temperature conditions, ideal for industrial applications.
Low power consumption with a nominal supply voltage of 3V, making it energy-efficient.
Other Function Telecom Interface ICs SA639DH,518 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
SA639DH,518 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
LM358AN
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
General Transistor
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
RN4020-V/RM120
Microchip Technology's RN4020-V/RM120 is a telecom IC with 24 terminals, operating at 3.3V. It offers a data rate of 1 Mbps and operates b/w -30 to 85°C. Ideal for applications requiring high-speed communication in compact spaces.
PN5120A0HN1/C2,151
NXP Semiconductors
NXP Semiconductors PN5120A0HN1/C2,151 is a telecom IC with 32 terminals and operates at -30 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. This chip carrier package is suitable for telecom circuits requiring low-profile components.
ATECC508A-SSHDA-B
Atmel
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ZOE-M8Q-0-10
U-blox Ag
ZOE-M8Q-0-10 by U-blox Ag is a telecom IC with 51 terminals, operating at -40 to 85°C. It features a 3V supply voltage, 0.5mm terminal pitch, and AEC-Q100 screening for industrial applications. This surface-mount device in square package shape is ideal for compact telecom circuit designs.
CC430F5135IRGZR
Texas Instruments
CC430F5135IRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.2V and data rate of 0.5 Mbps. Ideal for industrial applications requiring low power consumption and reliable communication.
ETRX357HR-LRS
Silicon Labs
Silicon Labs' ETRX357HR-LRS is a telecom IC with 33 terminals, operating b/w -40°C to 85°C. With a nominal voltage of 3V, it's ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY package and DUAL terminal position.
DA14682-00F08A92
Dialog Semiconductor
Other Telecom ICs; Peak Reflow Temperature (C): 255; Moisture Sensitivity Level (MSL): 3;
CY7B923-JXIT
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
453-00039R
Laird Technologies
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
ODIN-W260-00B
TELECOM CIRCUIT;
MAX7033EUI+
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
DWM3000TR13
Qorvo
MRF24J40MAT-I/RM
MRF24J40MAT-I/RM by Microchip: Telecom IC with 3.3V supply, 12 terminals, -40 to 85°C temp range. Ideal for industrial applications requiring reliable wireless communication in a compact MICROELECTRONIC ASSEMBLY package.
BGS12SN6E6327XTSA1
Infineon Technologies
BGS12SN6E6327XTSA1 by Infineon Technologies is a telecom interface IC with 6 terminals, chip carrier package style, and operating temperatures from -30 to 85°C. It is surface mountable and suitable for telecom circuit applications with a nominal voltage of 2.6V.
TDA5150
TDA5150 by Infineon Technologies is a telecom interface IC with 10 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 2/3.3V and is designed for telecom circuits, featuring a small outline package suitable for surface mounting applications. The package material is plastic/epoxy with a square shape and gull wing terminal form, making it ideal for industrial temperature grade environments.
CC2640R2FRGZT
CC2640R2FRGZT by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel palladium gold terminal finish and is surface mountable.
BM71BLES1FC2-0B02AA
BM71BLES1FC2-0B02AA by Microchip is a telecom IC with 16 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3V. It is a surface mount rectangular package suitable for industrial applications, offering data rate of 0.0086 Mbps.
RN41SM-I/RM
Microchip Technology's RN41SM-I/RM is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and gold over nickel terminal finish. This rectangular package is ideal for industrial applications requiring reliable telecom circuit interfaces.
BGM15HA12E6327XTSA1
BGM15HA12E6327XTSA1 by Infineon is a telecom interface IC with 12 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 2.8V, it's ideal for telecom circuit applications requiring surface mount technology.
ZED-F9P-00B
ZED-F9P-00B by U-blox Ag is a 54-terminal IC with AEC-Q100 screening, operating from -40 to 85°C. It features a 3V supply voltage, telecom circuit type, and compact rectangular package. Ideal for telecom interfaces in industrial applications due to its small size and wide temperature range.
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SA636DK/01,118
SA636DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features nickel palladium gold terminal finish and 3V nominal voltage for telecom circuit applications.
SA636DK/01,112
SA636DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include nickel palladium gold terminal finish, 3V supply voltage, and gull wing terminal form for telecom circuit applications.
SA639DH/01,118
SA639DH/01,118 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. Operating b/w -40 to 85 °C, it has a nominal voltage of 3V and terminal pitch of 0.65mm. Ideal for industrial applications requiring telecom circuit functionality.
SA636DK/01
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
SA638
Philips Semiconductors
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
SA636BS,115
SA636BS,115 by NXP Semiconductors is a telecom interface IC with 1 function. It has a package style of CHIP CARRIER and a very thin profile. With an operating temperature range of -40 to 85 °C, it is suitable for industrial applications.
SA636DK/02J
SA639DH/01,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
SA636DK,112
SA636DK,118
SA639DH-T
SA636DK-T
SA639
SA639DH,512
SA639DH
SA636BS
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: VQCCN; Package Shape: SQUARE;
SA636DK
SA636DK/02
SA639DH/01
SA639DH/01 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V, it features gull wing terminals and is designed for telecom circuit applications.
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