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SA639DH,518

NXP Semiconductors

SA639DH,518 by NXP Semiconductors

SA639DH,518 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. Operating from -40 to 85°C, it has a nominal voltage of 3V. Ideal for telecom circuits, this IC features gull wing terminals and is suitable for industrial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 771 parts In-Stock

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Vyrian

USA . 450 parts In-Stock

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450

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Anansix

USA . 418 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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AZTECH Wire

Italy . 563 parts In-Stock

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$8.751

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One Stop Electronics

USA . 1,304 parts In-Stock

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$453.000

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Ampacity Inc.

Singapore . 1,488 parts In-Stock

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$776.000

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Bastille Electronics

Australia . 3,021 parts In-Stock

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UNI Independent Distributors

Spain . 1,802 parts In-Stock

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Corphita

USA . 273 parts In-Stock

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Overview

Unlock the full potential of your telecom applications with the SA639DH,518 from NXP Semiconductors. This high-quality IC offers reliable performance in a small, sleek package, making it ideal for a wide range of telecom interface applications. With its industrial-grade temperature rating and gull wing terminal form, this versatile component provides exceptional value and benefits to customers looking to enhance their telecom systems. Experience seamless connectivity and efficient operation with the SA639DH,518 - the perfect choice for your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and reliability for the product, making it suitable for long-term use in various environments.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount capability.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into different systems and designs.

No. of Terminals: 24

Sufficient number of terminals for connectivity and functionality.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of temperature conditions, ideal for industrial applications.

Nominal Supply Voltage: 3 V

Low power consumption with a nominal supply voltage of 3V, making it energy-efficient.

Technical Specifications

Other Function Telecom Interface ICs SA639DH,518 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA639DH,518 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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