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SA639DH/01,112

NXP Semiconductors

SA639DH/01,112 by NXP Semiconductors

SA639DH/01,112 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold terminal finish and 3V nominal voltage for reliable telecom circuit performance.

Median Price

$3.230

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 17 parts In-Stock

1+ parts

$3.230

100+ parts

$3.040

1k+ parts

$2.750

10k+ parts

-

17

$3.230

$3.040

$2.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$2.529

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$2.529

-

-

-

Digiode

USA . 2,983 parts In-Stock

1+ parts

$3.068

100+ parts

-

1k+ parts

-

10k+ parts

-

2,983

$3.068

-

-

-

Vyrian

USA . 8,569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,569

-

-

-

-

Anansix

USA . 2,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,619

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 17 parts In-Stock

1+ parts

$2.750

100+ parts

-

1k+ parts

-

10k+ parts

-

17

$2.750

-

-

-

Corphita

USA . 266 parts In-Stock

1+ parts

$2.907

100+ parts

-

1k+ parts

-

10k+ parts

-

266

$2.907

-

-

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$19.225

100+ parts

-

1k+ parts

-

10k+ parts

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744

$19.225

-

-

-

UNI Independent Distributors

Spain . 3,368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,368

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-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.478

1k+ parts

$2.403

10k+ parts

$2.352

500

-

$2.478

$2.403

$2.352

Overview

Elevate your telecom interface performance with the SA639DH/01,112 by NXP Semiconductors. Designed with precision and expertise, this high-quality product offers unparalleled reliability and functionality. Perfect for a wide range of applications within the telecom industry, this versatile IC ensures seamless communication and optimal performance. Experience the value and benefits that this innovative product brings to your projects, delivering unmatched advantages and efficiency to customers. Choose NXP Semiconductors for superior quality and cutting-edge technology in telecom interface ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight yet durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and ensuring a secure connection.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs, maximizing space utilization and efficiency.

No. of Terminals: 24

With 24 terminals, this product offers versatility in connecting to other components and peripherals, making it suitable for complex telecom interfaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand high levels of heat, ensuring reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows this product to perform effectively even in extreme cold conditions, enhancing its reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-lasting performance and reliability.

Terminal Position: DUAL

Dual terminal position allows for flexible connectivity options, enabling versatile integration into different circuit designs.

Maximum Seated Height: 1.1 mm

Low seated height minimizes the overall profile of the product, making it suitable for compact devices and applications where space is limited.

Width: 4.4 mm

With a narrow width, this product can be easily integrated into tight spaces and crowded circuit board layouts, enhancing design flexibility.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering during assembly, preventing any solder joint issues and ensuring a reliable connection.

Length: 7.8 mm

Compact length allows for space-efficient placement on circuit boards, making it ideal for applications where board real estate is limited.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures that the product can operate reliably in harsh industrial environments with high temperature fluctuations.

Terminal Form: GULL WING

Gull wing terminal form provides a strong mechanical bond to the circuit board, enhancing reliability and ensuring stable connections during operation.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this product offers the necessary functionality and performance required for telecom interfaces, ensuring seamless communication.

Nominal Supply Voltage: 3 V

With a 3V nominal supply voltage, this product is suitable for low-power applications, helping to conserve energy and optimize power efficiency.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on circuit boards, enabling efficient use of space and supporting complex telecom interface designs.

Technical Specifications

Other Function Telecom Interface ICs SA639DH/01,112 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA639DH/01,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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