Loading...

SA639DH/01

NXP Semiconductors

SA639DH/01 by NXP Semiconductors

SA639DH/01 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V, it features gull wing terminals and is designed for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,113

-

-

-

-

Anansix

USA . 2,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,056

-

-

-

-

Vyrian

USA . 1,319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,319

-

-

-

-

ComSIT Distribution GmbH

Germany . 819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

819

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 599 parts In-Stock

1+ parts

$19.374

100+ parts

-

1k+ parts

-

10k+ parts

-

599

$19.374

-

-

-

Ampacity Inc.

Singapore . 542 parts In-Stock

1+ parts

$450.000

100+ parts

-

1k+ parts

-

10k+ parts

-

542

$450.000

-

-

-

One Stop Electronics

USA . 1,124 parts In-Stock

1+ parts

$670.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,124

$670.000

-

-

-

Lixinc

USA . 12,449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,449

-

-

-

-

UNI Independent Distributors

Spain . 8,334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,334

-

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Bastille Electronics

Australia . 2,818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,818

-

-

-

-

Corphita

USA . 2,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,811

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Kepictronics

USA . 593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

593

-

-

-

-

Perfect Parts

USA . 125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

125

-

-

-

-

Overview

Experience seamless communication with the SA639DH/01 by NXP Semiconductors, a leading manufacturer in the industry. Designed for telecom interfaces, this versatile IC offers reliability and superior performance. With a compact design and industrial-grade temperature range, this product ensures optimal functionality in various applications. Enhance your projects with the value and benefits of the SA639DH/01, providing customers with a cutting-edge solution for their communication needs.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and resistance to external elements, making the product reliable for long-term use.

Surface Mount

YES - Allows for easy installation on PCBs, saving space and reducing assembly time.

Package Shape

RECTANGULAR - Provides a standardized form factor for compatibility with various PCB layouts.

No. of Terminals

24 - Offers multiple connection points for enhanced functionality and flexibility in circuit design.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Enables a compact design without sacrificing performance.

Maximum Operating Temperature

85 °C - Ensures stable operation even in high-temperature environments.

Minimum Operating Temperature

40 °C - Can withstand low temperatures without compromising performance.

Terminal Finish

NICKEL PALLADIUM GOLD - Provides corrosion resistance and reliable electrical connections.

Terminal Position

DUAL - Allows for multiple connection options to accommodate different circuit configurations.

Maximum Seated Height

1.1 mm - Offers a low profile design for space-constrained applications.

Width

4.4 mm - Compact size enables easy integration into tight spaces.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures proper soldering without damaging the components.

Peak Reflow Temperature °C

260 - Handles high-temperature soldering processes for reliable connections.

Length

7.8 mm - Provides a balanced form factor for easy integration into various devices.

Temperature Grade

INDUSTRIAL - Suitable for rugged industrial environments where temperature fluctuations are common.

Terminal Form

GULL WING - Facilitates easy soldering and robust mechanical connections.

Telecom IC Type

TELECOM CIRCUIT - Specifically designed for telecom applications, ensuring optimized performance in communication systems.

Nominal Supply Voltage

3 V - Compatible with common voltage standards, making it easy to integrate into existing systems.

Terminal Pitch

0.65 mm - Allows for close spacing of terminals, enhancing connectivity options and circuit density.

Technical Specifications

Other Function Telecom Interface ICs SA639DH/01 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SA639DH/01 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19