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PN5321A3HN/C106

NXP Semiconductors

PN5321A3HN/C106 by NXP Semiconductors

PN5321A3HN/C106 by NXP Semiconductors is a telecom IC with 40 terminals in a square chip carrier package. Operating from -30 to 85°C, it features nickel palladium gold terminal finish and quad position. With a compact size of 6x6mm and 0.5mm pitch, it's ideal for telecom circuit applications.

Median Price

$5.722

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 20,650 parts In-Stock

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Anansix

USA . 1,282 parts In-Stock

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Vyrian

USA . 1,022 parts In-Stock

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Bristol Electronics

USA . 543 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 477 parts In-Stock

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477

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J2 Sourcing AB

Sweden . 258 parts In-Stock

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Digiode

USA . 178 parts In-Stock

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178

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Partservice

France . 20 parts In-Stock

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$5.525

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$5.525

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$5.525

20

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$5.525

$5.525

$5.525

Micros sp.j. W. Kędra i J. Lic

Poland . 20 parts In-Stock

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$5.919

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$5.919

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$5.919

20

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$5.919

$5.919

$5.919

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,224 parts In-Stock

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$10.420

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$10.420

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AZTECH Wire

Italy . 361 parts In-Stock

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$12.109

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361

$12.109

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Corohmni

South Africa . 795 parts In-Stock

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$12.523

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795

$12.523

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Ampacity Inc.

Singapore . 1,138 parts In-Stock

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$63.000

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Semicontronic

India . 343 parts In-Stock

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$89.000

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$86.775

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$86.330

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343

$89.000

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$86.330

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One Stop Electronics

USA . 170 parts In-Stock

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$520.000

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USA . 120,050 parts In-Stock

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Metaverse IC Inc.

Canada . 98,000 parts In-Stock

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Authorized Procurement Solutions

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S.R.D Solutions

India . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,597 parts In-Stock

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Lixinc

USA . 6,870 parts In-Stock

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UNI Independent Distributors

Spain . 5,500 parts In-Stock

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Argo Parts USA

USA . 4,717 parts In-Stock

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Corphita

USA . 4,578 parts In-Stock

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Continental Prestige Electronics

USA . 3,215 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 805 parts In-Stock

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Futuretech Components

Singapore . 500 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Infinite Electronics LLP (Excess)

. 165 parts In-Stock

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Advanced Electronics

New Zealand . 26 parts In-Stock

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Overview

Unlock the potential of seamless connectivity with the PN5321A3HN/C106 by NXP Semiconductors. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. From secure transactions to efficient data transfer, this versatile chip carrier caters to a wide range of applications. Experience the convenience and innovation that NXP Semiconductors brings to the table, as you elevate your projects with the PN5321A3HN/C106. Discover a world of possibilities with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and offers good thermal properties, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy integration into various electronic devices, saving space and enabling efficient PCB assembly.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB and allows for easy alignment during assembly.

No. of Terminals: 40

Having a higher number of terminals allows for more connectivity options and functionality in the telecom interface.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature makes the product suitable for deployment in various climates and ensures reliability in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and stable performance.

Terminal Position: QUAD

The quad terminal position provides multiple connection points for enhanced reliability and stability in telecom applications.

Maximum Seated Height: 1 mm

The low seated height allows for a compact design, making the product suitable for space-constrained applications.

Width: 6 mm

The compact width of the product allows for easy integration into different electronic systems without taking up much space.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering during assembly, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering and ensures the product can withstand the soldering process without damage.

Length: 6 mm

The compact length of the product makes it suitable for applications where space is limited, without compromising functionality.

Terminal Form: NO LEAD

The lead-free terminal form makes the product environmentally friendly and compliant with regulations, ensuring safe and sustainable use.

Telecom IC Type: TELECOM CIRCUIT

Being a specialized telecom circuit type ensures the product is designed to meet the specific requirements and standards of telecom applications, guaranteeing optimal performance.

Terminal Pitch: 0.5 mm

The tight terminal pitch allows for high-density mounting, enabling more connections in a limited space and enhancing functionality.

Moisture Sensitivity Level (MSL): 2

The moderate moisture sensitivity level indicates the product can withstand a certain level of moisture exposure during storage and handling, ensuring product integrity.

Technical Specifications

Other Function Telecom Interface ICs PN5321A3HN/C106 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

PN5321A3HN/C106 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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