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AX-SFEU-1-01-TB05

Onsemi

AX-SFEU-1-01-TB05 by Onsemi

AX-SFEU-1-01-TB05 by Onsemi is a Telecom Circuit IC with 40 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. This surface-mount IC is ideal for telecom interface applications requiring a very thin profile and industrial temperature grade.

Median Price

$2.421

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 22 parts In-Stock

1+ parts

$2.421

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22

$2.421

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Chip Stock

USA . 37,000 parts In-Stock

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37,000

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VNN

France . 5,683 parts In-Stock

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5,683

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Vyrian

USA . 3,146 parts In-Stock

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3,146

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Digiode

USA . 525 parts In-Stock

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525

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,193 parts In-Stock

1+ parts

$0.090

100+ parts

-

1k+ parts

$0.061

10k+ parts

$0.061

2,193

$0.090

-

$0.061

$0.061

Continental Prestige Electronics

USA . 6,626 parts In-Stock

1+ parts

$2.421

100+ parts

-

1k+ parts

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$2.372

6,626

$2.421

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-

$2.372

Argo Parts USA

USA . 4,897 parts In-Stock

1+ parts

$2.421

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4,897

$2.421

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.421

100+ parts

-

1k+ parts

$2.300

10k+ parts

$2.251

2,000

$2.421

-

$2.300

$2.251

AZTECH Wire

Italy . 711 parts In-Stock

1+ parts

$11.783

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711

$11.783

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Semicontronic

India . 330 parts In-Stock

1+ parts

$178.000

100+ parts

$173.550

1k+ parts

$172.660

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330

$178.000

$173.550

$172.660

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Ampacity Inc.

Singapore . 623 parts In-Stock

1+ parts

$976.000

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623

$976.000

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Problanco Electronics

Mexico . 7,795 parts In-Stock

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7,795

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TANS Electronics

Latvia . 3,326 parts In-Stock

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3,326

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Kulean Microsystems

USA . 2,021 parts In-Stock

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2,021

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SupplyDigital Components

Austria . 777 parts In-Stock

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777

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UHIMA Technologies

Türkiye . 713 parts In-Stock

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713

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$13.376

1k+ parts

$12.386

10k+ parts

$12.386

250

-

$13.376

$12.386

$12.386

Corohmni

South Africa . 243 parts In-Stock

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243

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Corphita

USA . 66 parts In-Stock

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Overview

Elevate your telecom interface systems with the AX-SFEU-1-01-TB05 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product. This chip carrier, heat sink/slug with very thin profile package offers unmatched performance and durability for a wide range of applications. With its industrial-grade temperature grade and no lead terminal form, this telecom circuit IC ensures seamless operation in challenging environments. Upgrade your systems today with the AX-SFEU-1-01-TB05 and experience superior functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, saving space and simplifying assembly.

No. of Terminals: 40

High number of terminals allow for more connections and features in the IC, increasing functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a variety of environments and conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures good conductivity and corrosion resistance, extending the lifespan of the IC.

Maximum Seated Height: 1 mm

Low seated height allows for compact design and integration into tight spaces within electronic devices.

Nominal Supply Voltage: 3 V

Low supply voltage requirement makes the IC energy-efficient and suitable for battery-powered devices.

Technical Specifications

Other Function Telecom Interface ICs AX-SFEU-1-01-TB05 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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