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AX-SFAZ-1-01-TX30

Onsemi

AX-SFAZ-1-01-TX30 by Onsemi

AX-SFAZ-1-01-TX30 by Onsemi is a telecom IC with 40 terminals in a chip carrier package. It operates b/w -40 to 85 °C, with a supply voltage of 3.3V and data rate of 0.0006 Mbps. Ideal for telecom circuit applications due to its compact size and industrial temperature grade suitability.

Median Price

$11.560

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

$11.560

1k+ parts

$11.560

10k+ parts

$11.560

45,000

-

$11.560

$11.560

$11.560

Flip Electronics (Authorized)

USA . 45,000 parts In-Stock

1+ parts

-

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1k+ parts

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45,000

-

-

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Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$11.350

1k+ parts

$10.160

10k+ parts

$9.560

3,000

-

$11.350

$10.160

$9.560

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$14.188

1k+ parts

$12.700

10k+ parts

$11.950

3,000

-

$14.188

$12.700

$11.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,618 parts In-Stock

1+ parts

$11.560

100+ parts

-

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1,618

$11.560

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Digiode

USA . 2,226 parts In-Stock

1+ parts

$12.008

100+ parts

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2,226

$12.008

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Flip Electronics

USA . 45,000 parts In-Stock

1+ parts

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45,000

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 546 parts In-Stock

1+ parts

$11.376

100+ parts

-

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546

$11.376

-

-

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Corohmni

South Africa . 249 parts In-Stock

1+ parts

$11.560

100+ parts

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249

$11.560

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-

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Native Components

USA . 49 parts In-Stock

1+ parts

$23.432

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49

$23.432

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Northwest PG Solutions

USA . 592 parts In-Stock

1+ parts

$25.775

100+ parts

$23.197

1k+ parts

-

10k+ parts

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592

$25.775

$23.197

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-

Component Stockers USA

USA . 63,065 parts In-Stock

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Perfect Parts

USA . 13,306 parts In-Stock

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13,306

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Problanco Electronics

Mexico . 7,058 parts In-Stock

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7,058

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SupplyDigital Components

Austria . 3,577 parts In-Stock

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3,577

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Kulean Microsystems

USA . 3,175 parts In-Stock

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3,175

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GreenTree Electronics

Israel . 2,995 parts In-Stock

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2,995

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Authorized Procurement Solutions

USA . 2,895 parts In-Stock

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2,895

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UHIMA Technologies

Türkiye . 281 parts In-Stock

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281

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TANS Electronics

Latvia . 39 parts In-Stock

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39

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Overview

Elevate your telecom interface experience with the AX-SFAZ-1-01-TX30 by Onsemi. Known for their top-notch quality and innovation, Onsemi brings you a cutting-edge product that will revolutionize your telecom applications. This versatile chip carrier offers a very thin profile and is designed for easy surface mounting, making it ideal for a wide range of industrial settings. With its nickel gold palladium terminal finish and reliable performance, this telecom circuit IC ensures optimal functionality at all times. Upgrade your systems today and discover the unmatched value and benefits that the AX-SFAZ-1-01-TX30 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the IC, making it suitable for various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape is a common and practical design for easy integration into circuit board layouts.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can perform reliably in demanding industrial environments.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage is a standard and commonly available power source, ensuring compatibility with existing systems.

Data Rate: 0.0006 Mbps

This IC supports a data rate of 0.0006 Mbps, suitable for telecom applications requiring low to moderate data transfer speeds.

Technical Specifications

Other Function Telecom Interface ICs AX-SFAZ-1-01-TX30 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

Data Rate:

.0006 Mbps

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

AX-SFAZ-1-01-TX30 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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