Loading...

AX-SFAZ-API-1-01-TX30

Onsemi

AX-SFAZ-API-1-01-TX30 by Onsemi

AX-SFAZ-API-1-01-TX30 by Onsemi is a Telecom Interface IC with 40 terminals, operating temperature range of -40 to 85 °C. It features a package style of CHIP CARRIER and is suitable for telecom circuits with a data rate of 0.0006 Mbps.

Median Price

$10.935

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$10.520

1k+ parts

-

10k+ parts

-

3,000

-

$10.520

-

-

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Rochester

USA . 2,937 parts In-Stock

1+ parts

-

100+ parts

$11.350

1k+ parts

$10.160

10k+ parts

$9.560

2,937

-

$11.350

$10.160

$9.560

Farnell

UK . 2,937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$9.970

2,937

-

-

-

$9.970

Verical

USA . 2,937 parts In-Stock

1+ parts

-

100+ parts

$14.188

1k+ parts

$12.700

10k+ parts

$11.950

2,937

-

$14.188

$12.700

$11.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,106 parts In-Stock

1+ parts

$9.970

100+ parts

-

1k+ parts

-

10k+ parts

-

1,106

$9.970

-

-

-

Digiode

USA . 84 parts In-Stock

1+ parts

$12.008

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$12.008

-

-

-

Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,584 parts In-Stock

1+ parts

$8.470

100+ parts

-

1k+ parts

-

10k+ parts

-

2,584

$8.470

-

-

-

Corohmni

South Africa . 191 parts In-Stock

1+ parts

$9.970

100+ parts

-

1k+ parts

-

10k+ parts

-

191

$9.970

-

-

-

Corphita

USA . 2,228 parts In-Stock

1+ parts

$11.376

100+ parts

-

1k+ parts

-

10k+ parts

-

2,228

$11.376

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,478

-

-

-

-

TANS Electronics

Latvia . 5,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,214

-

-

-

-

Kulean Microsystems

USA . 5,210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,210

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Problanco Electronics

Mexico . 4,109 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,109

-

-

-

-

SupplyDigital Components

Austria . 3,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,013

-

-

-

-

Continental Prestige Electronics

USA . 2,937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.970

10k+ parts

-

2,937

-

-

$9.970

-

Northwest PG Solutions

USA . 917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.538

10k+ parts

-

917

-

-

$3.538

-

Native Components

USA . 732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.502

10k+ parts

-

732

-

-

$3.502

-

UHIMA Technologies

Türkiye . 347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

347

-

-

-

-

Overview

Unleash the power of seamless communication with the AX-SFAZ-API-1-01-TX30 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that redefine the standards of telecom interface ICs. This innovative chip carrier offers a wide range of applications, from enhancing telecom circuits to improving connectivity in various industries. With its advanced features and unmatched reliability, the AX-SFAZ-API-1-01-TX30 provides exceptional value and benefits to customers seeking high-performance solutions for their communication needs. Experience the difference with Onsemi's cutting-edge technology and elevate your communication experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, making it suitable for various operating environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on PCBs, saving time and cost in production.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during manufacturing and assembly processes.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures without performance degradation, ensuring reliability.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 to 85 °C allows for versatility in application across different environmental conditions.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V results in energy efficiency and compatibility with common power sources.

Data Rate: 0.0006 Mbps

Despite a relatively low data rate, this IC can still efficiently process and transmit data for telecom applications, suitable for specific use cases.

Technical Specifications

Other Function Telecom Interface ICs AX-SFAZ-API-1-01-TX30 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

Data Rate:

.0006 Mbps

JESD-30 Code:

R-XQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.20X.28,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

AX-SFAZ-API-1-01-TX30 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11