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XB3-24Z8ST-J

Digi International

XB3-24Z8ST-J by Digi International

XB3-24Z8ST-J by Digi Int. is a telecom IC with 20 terminals in MICROELECTRONIC ASSEMBLY package. Operating temp range -40 to 85°C, suitable for INDUSTRIAL applications. Features THROUGH-HOLE terminals and DUAL position, ideal for TELECOM CIRCUIT designs.

Median Price

$23.520

Lifecycle Status

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DigiKey

USA . 3,363 parts In-Stock

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Mouser Electronics

USA . 560 parts In-Stock

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Avnet

USA . 50 parts In-Stock

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Arrow

USA . 2 parts In-Stock

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Newark

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Farnell

UK . 226 parts In-Stock

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Element14

Singapore . 250 parts In-Stock

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Verical

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Nova Conductors

Japan . 25 parts In-Stock

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$26.380

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TME

Poland . 69 parts In-Stock

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Vyrian

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$10.102

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$9.694

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Aztec Data Supply Inc.

USA . 2,836 parts In-Stock

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Corohmni

South Africa . 246 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$25.852

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Continental Prestige Electronics

USA . 206 parts In-Stock

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$36.890

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Neutron USA

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Authorized Procurement Solutions

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Argo Parts USA

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

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GreenTree Electronics

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Overview

Experience seamless connectivity with the XB3-24Z8ST-J by Digi International. As a leader in cutting-edge technology, Digi International ensures top-notch quality and reliability in all their products. The XB3-24Z8ST-J falls under the category of Other Function Telecom Interface ICs, offering endless possibilities for applications in various industries. With its industrial-grade temperature range and dual terminal position, this product provides unmatched performance and versatility. Trust Digi International to deliver exceptional value and benefits to meet all your connectivity needs.

Feature Benefit Bullets

No. of Terminals: 20

Having 20 terminals allows for a versatile and complex circuit design, enabling a wide range of functionality and connectivity options.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The MICROELECTRONIC ASSEMBLY package style ensures durability and compactness, making it suitable for telecom applications where space is limited.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold environments without compromising efficiency and functionality.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and connectivity options, making it easier to integrate into existing systems or designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this product can operate reliably in demanding industrial environments, making it suitable for telecom applications that require robust performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form factor allows for easy soldering and secure mounting, ensuring a stable connection that can withstand vibrations and mechanical stress.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this IC type ensures optimized performance and compatibility with telecom systems, making it a reliable choice for telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs XB3-24Z8ST-J attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Digi International

Specs

JESD-30 Code:

X-XDMA-T20

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

PCN

Manufacturer Highlights

Digi International

Since 1985, Digi International Inc. (Digi) has been a pioneer in wireless communication, forging the future for connected devices and responding to the needs of the people and enterprises that use them. Before the Internet of Things was a thing, we built M2M and IoT devices, adapted to evolving network standards, and optimized data communications around the most advanced protocols and emerging technologies. From radio frequency modems to gateways, cellular routers, networking devices, embedded system-on-modules (SOM) and single-board computers (SBCs), Digi's solutions have continually grown to serve the full breadth of applications across the IoT landscape. Today, our IoT offering includes sensor-based solutions, a sophisticated platform for remotely monitoring device deployments of any size, anywhere, as well as professional design, implementation and certification teams to help you carry out your vision, no matter how large or small.

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