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CC1125RHBT

Texas Instruments

CC1125RHBT by Texas Instruments

CC1125RHBT by Texas Instruments is a telecom IC with 32 terminals, operating at 3V. It has a data rate of 0.2 Mbps and can withstand temperatures from -40 to 85°C. This chip carrier package is ideal for industrial telecom applications requiring a compact design and surface mount capability.

Median Price

$7.306

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 79,662 parts In-Stock

1+ parts

$5.601

100+ parts

$4.566

1k+ parts

$3.044

10k+ parts

-

79,662

$5.601

$4.566

$3.044

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Mouser Electronics

USA . 4,283 parts In-Stock

1+ parts

$9.010

100+ parts

$6.040

1k+ parts

$5.440

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-

4,283

$9.010

$6.040

$5.440

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DigiKey

USA . 1,375 parts In-Stock

1+ parts

$9.010

100+ parts

$6.835

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-

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-

1,375

$9.010

$6.835

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Chip1Stop

Japan . 250 parts In-Stock

1+ parts

-

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$4.761

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250

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$4.761

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.566

100+ parts

-

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100

$4.566

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Digiode

USA . 2,744 parts In-Stock

1+ parts

$5.321

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-

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2,744

$5.321

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TME

Poland . 236 parts In-Stock

1+ parts

$7.390

100+ parts

$5.510

1k+ parts

$5.420

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236

$7.390

$5.510

$5.420

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Vyrian

USA . 21,297 parts In-Stock

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21,297

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Ampacity Inc.

Singapore . 21,310 parts In-Stock

1+ parts

$4.050

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-

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21,310

$4.050

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Semicontronic

India . 21,110 parts In-Stock

1+ parts

$4.050

100+ parts

$3.949

1k+ parts

$3.928

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-

21,110

$4.050

$3.949

$3.928

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Continental Prestige Electronics

USA . 2,577 parts In-Stock

1+ parts

$4.566

100+ parts

-

1k+ parts

-

10k+ parts

$4.475

2,577

$4.566

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-

$4.475

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.566

100+ parts

$4.475

1k+ parts

-

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2,000

$4.566

$4.475

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Corohmni

South Africa . 446 parts In-Stock

1+ parts

$4.870

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446

$4.870

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$5.016

100+ parts

$4.765

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$4.765

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350

$5.016

$4.765

$4.765

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Corphita

USA . 2,814 parts In-Stock

1+ parts

$5.041

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2,814

$5.041

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Modulus Dynamics

Lithuania . 30 parts In-Stock

1+ parts

$5.068

100+ parts

$5.018

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$4.866

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30

$5.068

$5.018

$4.866

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Parana Technologies

USA . 1,996 parts In-Stock

1+ parts

$6.518

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$7.259

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1,996

$6.518

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$7.259

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DigiPath Technology Company

USA . 384 parts In-Stock

1+ parts

$7.178

100+ parts

$6.603

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384

$7.178

$6.603

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ChromeModa Solutions

Germany . 6,149 parts In-Stock

1+ parts

$7.324

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$6.006

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6,149

$7.324

$6.006

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IDEA Electronic Components Group

UK . 439 parts In-Stock

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$7.324

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$6.592

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439

$7.324

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$6.592

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Perfect Parts

USA . 30,808 parts In-Stock

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Lixinc

USA . 9,732 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,906 parts In-Stock

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Argo Parts USA

USA . 4,815 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,937 parts In-Stock

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Robosynatics

Brazil . 1,500 parts In-Stock

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Lucentia Tech

USA . 1,500 parts In-Stock

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Overview

Upgrade your telecom systems with the Texas Instruments CC1125RHBT, a high-quality telecom interface IC that delivers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this versatile chip carrier offers a wide range of applications in the telecom sector. With a nominal supply voltage of 3V and a data rate of 0.2 Mbps, this industrial-grade IC provides seamless connectivity and efficient operation. Experience the benefits of superior quality and cutting-edge technology with the CC1125RHBT, designed to elevate your telecom systems to new heights.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and reliability for long-term use.

Surface Mount

YES - Allows for easy installation and space-saving design.

Package Shape

SQUARE - Ensures efficient use of space on a circuit board.

Power Supplies (V)

3 - Compatible with common power sources for easy integration.

No. of Terminals

32 - Offers versatility for various connectivity options.

Package Style (Meter)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Provides efficient heat dissipation and compact design.

Maximum Operating Temperature

85 °C - Suitable for industrial applications with high temperature requirements.

Minimum Operating Temperature

40 °C - Can withstand cold environments for versatile use.

Terminal Finish

NICKEL PALLADIUM GOLD SILVER - Ensures strong and reliable connections.

Terminal Position

QUAD - Allows for easy routing and connecting of terminals.

Maximum Seated Height

1 mm - Ideal for compact devices with limited space.

Width

5 mm - Space-saving design for efficient PCB layout.

Maximum Time At Peak Reflow Temperature (s)

30 - Allows for safe and effective soldering processes.

Peak Reflow Temperature °C

260 - Ensures proper soldering and component reliability.

Length

5 mm - Compact size for convenient placement on a circuit board.

Temperature Grade

INDUSTRIAL - Suitable for harsh environments and industrial settings.

Terminal Form

NO LEAD - Environmentally friendly and compliant with regulations.

Telecom IC Type

TELECOM CIRCUIT - Specifically designed for telecommunications applications.

Nominal Supply Voltage

3 V - Compatible with standard voltage supplies for easy integration.

Terminal Pitch

0.5 mm - Allows for close spacing of terminals for efficient connectivity.

Data Rate

0.2 Mbps - Supports moderate data transfer speeds for telecom applications.

Moisture Sensitivity Level (MSL)

3 - Suitable for environments with moderate moisture exposure.

Technical Specifications

Other Function Telecom Interface ICs CC1125RHBT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.2 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC1125RHBT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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