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CC1121RHBR

Texas Instruments

CC1121RHBR by Texas Instruments

The Texas Instruments CC1121RHBR is a telecom IC with 32 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it has a data rate of 0.2 Mbps and nominal voltage of 3V. Ideal for telecom circuits, this IC is surface mountable and features a moisture sensitivity level of MSL3.

Median Price

$4.440

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,749 parts In-Stock

1+ parts

$4.440

100+ parts

$3.330

1k+ parts

$2.920

10k+ parts

$2.530

2,749

$4.440

$3.330

$2.920

$2.530

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$2.577

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$2.577

-

-

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Digiode

USA . 4,486 parts In-Stock

1+ parts

$3.952

100+ parts

-

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4,486

$3.952

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Cogito LLC

Ukraine . 40,000 parts In-Stock

1+ parts

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40,000

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Chip Stock

USA . 25,300 parts In-Stock

1+ parts

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25,300

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Vyrian

USA . 13,365 parts In-Stock

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13,365

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Speed Components Ltd

Israel . 1,579 parts In-Stock

1+ parts

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1,579

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 1,343 parts In-Stock

1+ parts

$2.577

100+ parts

-

1k+ parts

-

10k+ parts

-

1,343

$2.577

-

-

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Continental Prestige Electronics

USA . 1,040 parts In-Stock

1+ parts

$2.577

100+ parts

-

1k+ parts

-

10k+ parts

$2.525

1,040

$2.577

-

-

$2.525

Netroflash

USA . 50 parts In-Stock

1+ parts

$2.577

100+ parts

$2.525

1k+ parts

-

10k+ parts

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50

$2.577

$2.525

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Ampacity Inc.

Singapore . 13,354 parts In-Stock

1+ parts

$3.540

100+ parts

-

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13,354

$3.540

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Corphita

USA . 180 parts In-Stock

1+ parts

$3.744

100+ parts

-

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180

$3.744

-

-

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Component Stockers USA

USA . 41,556 parts In-Stock

1+ parts

$4.080

100+ parts

$3.000

1k+ parts

$1.460

10k+ parts

$1.460

41,556

$4.080

$3.000

$1.460

$1.460

Semicontronic

India . 13,524 parts In-Stock

1+ parts

$7.700

100+ parts

$7.508

1k+ parts

$7.469

10k+ parts

-

13,524

$7.700

$7.508

$7.469

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Corohmni

South Africa . 28 parts In-Stock

1+ parts

$7.977

100+ parts

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28

$7.977

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Parana Technologies

USA . 1,637 parts In-Stock

1+ parts

$11.768

100+ parts

-

1k+ parts

$12.170

10k+ parts

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1,637

$11.768

-

$12.170

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DigiPath Technology Company

USA . 1,450 parts In-Stock

1+ parts

$12.959

100+ parts

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1,450

$12.959

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ChromeModa Solutions

Germany . 3,087 parts In-Stock

1+ parts

$13.223

100+ parts

$10.843

1k+ parts

-

10k+ parts

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3,087

$13.223

$10.843

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IDEA Electronic Components Group

UK . 1,599 parts In-Stock

1+ parts

$13.223

100+ parts

$12.562

1k+ parts

$11.901

10k+ parts

-

1,599

$13.223

$12.562

$11.901

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$19.170

100+ parts

$17.445

1k+ parts

$15.719

10k+ parts

-

2,500

$19.170

$17.445

$15.719

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Epart123

USA . 30,000 parts In-Stock

1+ parts

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$1.750

30,000

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$1.750

S.R.D Solutions

India . 30,000 parts In-Stock

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GreenTree Electronics

Israel . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,649 parts In-Stock

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Lixinc

USA . 10,888 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Alle Elektronik GmbH

Germany . 4,046 parts In-Stock

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4,046

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Enhance your telecommunications projects with the Texas Instruments CC1121RHBR. With a reputation for top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the category of Other Function Telecom Interface ICs. This versatile product offers a wide range of applications and is designed to optimize performance and efficiency. Experience seamless connectivity and superior functionality with the CC1121RHBR, providing unmatched value and benefits to customers seeking a competitive edge in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for long-term use in various conditions.

Surface Mount: YES

Being surface mountable allows for easy and cost-effective PCB assembly, saving time and effort during the manufacturing process.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, enabling compact designs and maximizing overall system performance.

Power Supplies (V): 3

Operating at a power supply of 3V ensures compatibility with common power sources, making it easier to integrate this product into existing systems.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options, allowing for versatile applications and customization according to specific requirements.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers efficient heat dissipation and compact form factor, ideal for space-constrained designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, ensuring reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C enables this product to function in extreme cold conditions, making it suitable for various industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of nickel, palladium, gold, and silver terminal finish ensures excellent conductivity and resistance to corrosion, enhancing overall product reliability and longevity.

Terminal Position: QUAD

The quad terminal position offers improved stability and connectivity, reducing the risk of connection failures and ensuring consistent performance in demanding telecom applications.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, this product allows for low-profile designs with minimal interference, making it ideal for compact and space-efficient systems.

Width: 5 mm

The 5mm width provides a balance between compactness and ease of handling, allowing for efficient integration into various electronic devices and telecom systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly, preventing overheating and potential damage to the product during manufacturing.

Peak Reflow Temperature °C: 260

Operating at a peak reflow temperature of 260°C enables reliable and consistent soldering, ensuring sturdy connections and long-term performance of the product.

Length: 5 mm

With a length of 5mm, this product offers a compact footprint, facilitating space-saving designs and efficient use of PCB real estate in telecom applications.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product meets the stringent requirements of industrial environments, ensuring robust performance and reliability in demanding conditions.

Terminal Form: NO LEAD

The use of no-lead terminal form reduces environmental impact and complies with regulations, offering a more sustainable and eco-friendly solution for telecom interface applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this product offers optimized performance and compatibility with telecom systems, ensuring seamless integration and reliable operation in telecommunications networks.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures stable and efficient power consumption, enabling energy-efficient operation and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product allows for high-density packaging and precise connections, facilitating compact designs and efficient signal transmission in telecom applications.

Data Rate: 0.2 Mbps

Supporting a data rate of 0.2 Mbps, this product enables fast and reliable data transmission in telecom networks, ensuring smooth communication and seamless connectivity.

Moisture Sensitivity Level (MSL): 3

Featuring a moisture sensitivity level of 3, this product offers enhanced protection against moisture damage, ensuring long-term reliability and performance in humid or damp environments.

Technical Specifications

Other Function Telecom Interface ICs CC1121RHBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.2 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC1121RHBR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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