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XCC2642R1FRGZR

Texas Instruments

XCC2642R1FRGZR by Texas Instruments

XCC2642R1FRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuit applications, it features nickel palladium gold terminal finish and very thin profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,402 parts In-Stock

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Digiode

USA . 547 parts In-Stock

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547

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Nova Conductors

Japan . 82 parts In-Stock

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82

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$6.190

100+ parts

$5.881

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$5.881

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15

$6.190

$5.881

$5.881

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AZTECH Wire

Italy . 610 parts In-Stock

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$12.130

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610

$12.130

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Parana Technologies

USA . 2,138 parts In-Stock

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$14.865

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$15.295

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$14.865

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DigiPath Technology Company

USA . 411 parts In-Stock

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$16.368

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$15.059

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411

$16.368

$15.059

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ChromeModa Solutions

Germany . 3,949 parts In-Stock

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$16.702

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$13.696

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$16.702

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IDEA Electronic Components Group

UK . 2,296 parts In-Stock

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$16.702

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$15.867

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$15.032

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Corohmni

South Africa . 1,020 parts In-Stock

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$16.828

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One Stop Electronics

USA . 680 parts In-Stock

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$226.000

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Semicontronic

India . 340 parts In-Stock

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$239.000

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$233.025

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$231.830

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340

$239.000

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Ampacity Inc.

Singapore . 202 parts In-Stock

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$767.000

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Argo Parts USA

USA . 4,423 parts In-Stock

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Corphita

USA . 4,416 parts In-Stock

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Continental Prestige Electronics

USA . 2,758 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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Overview

Unlock the power of seamless communication with the XCC2642R1FRGZR by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Perfect for a wide range of applications in the telecommunications industry, this product provides exceptional value to customers looking for top-notch performance and efficiency. Experience the advantages of Texas Instruments' cutting-edge technology and elevate your projects to new heights with the XCC2642R1FRGZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection, making the product suitable for diverse environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB, allowing for compact design.

No. of Terminals: 48

The high number of terminals enables connectivity with multiple other components, enhancing functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer flexibility and customization options based on specific project requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various operating conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in extreme cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position offers stable and secure connection points, reducing the risk of disconnections or signal interruptions.

Maximum Seated Height: 1 mm

Low maximum seated height helps in reducing overall profile of the product, making it suitable for compact designs.

Width: 7 mm

Narrow width allows for efficient placement on the PCB, maximizing space utilization.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and effective soldering during assembly, saving time and energy.

Peak Reflow Temperature °C: 260

High peak reflow temperature helps in achieving strong and reliable solder joints for stable connections.

Length: 7 mm

Compact length contributes to the overall small form factor of the product, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the product can withstand harsh operating environments, making it suitable for industrial applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and offers improved safety during handling and disposal.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimal performance in telecommunications systems.

Nominal Supply Voltage: 3 V

Stable and standard supply voltage of 3V ensures consistent and reliable operation of the product.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high-density mounting, enabling more components to be placed on the PCB for increased functionality.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates good resistance to moisture damage, ensuring long-term reliability in humid environments.

Technical Specifications

Other Function Telecom Interface ICs XCC2642R1FRGZR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

XCC2642R1FRGZR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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