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OPA380AIDGKTG4

Texas Instruments

OPA380AIDGKTG4 by Texas Instruments

OPA380AIDGKTG4 by Texas Instruments is a telecom interface IC with 8 terminals, operating at temperatures from -40 to 125°C. It features a supply voltage of 3/5V, low supply current of 0.0088mA, and is designed for automotive applications. This CMOS technology IC comes in a small outline package with gull wing terminals and is suitable for telecom circuits.

Median Price

$6.860

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 142 parts In-Stock

1+ parts

$6.860

100+ parts

$4.410

1k+ parts

$4.030

10k+ parts

-

142

$6.860

$4.410

$4.030

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$3.480

-

-

-

Digiode

USA . 1,995 parts In-Stock

1+ parts

$5.766

100+ parts

-

1k+ parts

-

10k+ parts

-

1,995

$5.766

-

-

-

Vyrian

USA . 3,449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,449

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

$3.274

10k+ parts

-

2,000

$3.410

-

$3.274

-

Continental Prestige Electronics

USA . 5,296 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

$3.410

5,296

$3.480

-

-

$3.410

Argo Parts USA

USA . 463 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

-

463

$3.480

-

-

-

Ampacity Inc.

Singapore . 142 parts In-Stock

1+ parts

$5.160

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$5.160

-

-

-

Corphita

USA . 1,501 parts In-Stock

1+ parts

$5.463

100+ parts

-

1k+ parts

-

10k+ parts

-

1,501

$5.463

-

-

-

Corohmni

South Africa . 53 parts In-Stock

1+ parts

$6.912

100+ parts

-

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-

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53

$6.912

-

-

-

Parana Technologies

USA . 746 parts In-Stock

1+ parts

$13.444

100+ parts

-

1k+ parts

$13.961

10k+ parts

-

746

$13.444

-

$13.961

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AZTECH Wire

Italy . 502 parts In-Stock

1+ parts

$14.471

100+ parts

-

1k+ parts

-

10k+ parts

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502

$14.471

-

-

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DigiPath Technology Company

USA . 1,519 parts In-Stock

1+ parts

$14.804

100+ parts

-

1k+ parts

-

10k+ parts

-

1,519

$14.804

-

-

-

ChromeModa Solutions

Germany . 4,256 parts In-Stock

1+ parts

$15.106

100+ parts

$12.387

1k+ parts

-

10k+ parts

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4,256

$15.106

$12.387

-

-

IDEA Electronic Components Group

UK . 488 parts In-Stock

1+ parts

$15.106

100+ parts

$14.351

1k+ parts

$13.595

10k+ parts

-

488

$15.106

$14.351

$13.595

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Microchip USA

USA . 999 parts In-Stock

1+ parts

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100+ parts

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999

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Perfect Parts

USA . 504 parts In-Stock

1+ parts

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504

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Robosynatics

Brazil . 300 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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300

-

-

-

-

Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$0.101

1k+ parts

$0.101

10k+ parts

$0.101

300

-

$0.101

$0.101

$0.101

Overview

Experience superior quality and reliability with the OPA380AIDGKTG4 by Texas Instruments, a leading manufacturer in the industry. This innovative telecom interface IC offers unparalleled performance and versatility, making it ideal for a wide range of applications. With its compact design, advanced technology, and automotive-grade temperature grade, this product ensures maximum efficiency and durability. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations and elevate your projects to new heights. Choose the OPA380AIDGKTG4 for unmatched value and unbeatable benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, perfect for compact electronic devices.

Package Shape: SQUARE

The square package shape provides a uniform and efficient layout for components, maximizing board space and simplifying assembly.

Power Supplies (V): 3/5

With dual power supply options of 3V and 5V, this product offers flexibility in operating voltage, making it compatible with a variety of systems.

No. of Terminals: 8

The 8 terminals offer multiple connection points, enabling a wide range of signal processing and communication functions.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style helps in reducing overall footprint and enhancing thermal performance in tight spaces.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even under extreme environmental conditions, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for consistent operation in cold environments, ensuring reliability in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of nickel, palladium, gold, and silver terminal finish enhances conductivity and corrosion resistance, contributing to long-term functionality.

Terminal Position: DUAL

The dual terminal position offers multiple connection options, increasing versatility and convenience in circuit design and wiring.

Maximum Seated Height: 1.1 mm

The low maximum seated height minimizes space requirements and facilitates compact designs, suitable for applications with height restrictions.

Width: 3 mm

The narrow width dimension allows for efficient placement on circuit boards, optimizing board space and enabling high-density integration.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and precise soldering, reducing the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables robust solder joints, ensuring reliability in harsh operating conditions.

Length: 3 mm

The compact length dimension contributes to a space-efficient design, making it suitable for applications with size constraints.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade rating indicates that this product is designed to withstand the demanding temperature conditions in automotive environments.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for telecom applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections and mechanical stability, ensuring reliable performance in vibration-prone environments.

Maximum Supply Current: 0.0088 mA

The low maximum supply current minimizes power consumption, making this product suitable for energy-efficient devices and battery-powered applications.

Telecom IC Type: TELECOM CIRCUIT

The telecom IC type indicates that this product is specifically tailored for telecommunication applications, ensuring optimized performance and compatibility in communication systems.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage offers standard voltage support, making this product widely compatible with various electronic systems and devices.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density mounting and precise connections, facilitating intricate circuit designs and miniaturization.

Moisture Sensitivity Level (MSL): 2

The MSL level 2 rating indicates that this product has a moderate level of moisture sensitivity, suitable for handling and storage in typical manufacturing environments.

Technical Specifications

Other Function Telecom Interface ICs OPA380AIDGKTG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0088 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

OPA380AIDGKTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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