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OPA381AIDRBTG4

Texas Instruments

OPA381AIDRBTG4 by Texas Instruments

OPA381AIDRBTG4 by Texas Instruments is a telecom interface IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 5V and low supply current of 0.0011mA, suitable for automotive applications. This IC comes in a small outline package with nickel palladium gold finish, making it ideal for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,954 parts In-Stock

1+ parts

-

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7,954

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Digiode

USA . 1,436 parts In-Stock

1+ parts

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1,436

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 561 parts In-Stock

1+ parts

$9.488

100+ parts

-

1k+ parts

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561

$9.488

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Parana Technologies

USA . 922 parts In-Stock

1+ parts

$12.241

100+ parts

-

1k+ parts

$12.664

10k+ parts

-

922

$12.241

-

$12.664

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ChromeModa Solutions

Germany . 985 parts In-Stock

1+ parts

$13.754

100+ parts

$11.278

1k+ parts

-

10k+ parts

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985

$13.754

$11.278

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IDEA Electronic Components Group

UK . 627 parts In-Stock

1+ parts

$13.754

100+ parts

$13.066

1k+ parts

$12.379

10k+ parts

-

627

$13.754

$13.066

$12.379

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One Stop Electronics

USA . 1,077 parts In-Stock

1+ parts

$411.000

100+ parts

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1,077

$411.000

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Corphita

USA . 4,744 parts In-Stock

1+ parts

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4,744

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DigiPath Technology Company

USA . 1,506 parts In-Stock

1+ parts

-

100+ parts

$12.401

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1,506

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$12.401

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Overview

Experience unparalleled quality and reliability with the OPA381AIDRBTG4 by Texas Instruments, a leading manufacturer in the industry. This versatile Telecom Interface IC offers exceptional performance in various applications, making it a top choice for your projects. With its advanced features and innovative design, this product provides value, benefits, and advantages that exceed expectations. Trust Texas Instruments to deliver cutting-edge solutions that elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient manufacturing processes, reducing assembly time and costs.

Power Supplies (V): 3/5

Support for multiple power supply voltages provides flexibility in system design and compatibility with different power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Width: 3 mm

Compact width of 3mm allows for space-efficient PCB layout and integration into small devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets industry standards and requirements for reliable operation in vehicles.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common and widely supported voltage level, making it compatible with a variety of systems and devices.

Technical Specifications

Other Function Telecom Interface ICs OPA381AIDRBTG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0011 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

OPA381AIDRBTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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