Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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OPA381AIDGKR by Texas Instruments is an 8-terminal telecom interface IC in a small outline package. With a temperature range of -40 to 125°C, it operates at a nominal voltage of 5V. Ideal for automotive applications, this IC has a moisture sensitivity level of 2 and features Gull Wing terminal form.
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$6.016
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Argo Parts USA
Authorized Procurement Solutions
Bastille Electronics
Kepictronics
The use of plastic/epoxy material ensures durability and reliability in various environmental conditions.
The surface mount feature allows for easy and efficient PCB assembly, saving time and cost in production processes.
The square package shape provides a compact and space-efficient design for applications with limited board space.
With 8 terminals, this product offers versatility and flexibility in connecting to other components within the system.
The small outline and thin profile design, along with shrink pitch technology, contribute to a reduced footprint on the PCB.
The high maximum operating temperature ensures reliable performance even in extreme heat conditions.
The low minimum operating temperature allows for operation in cold environments without any impact on functionality.
The terminal finish of nickel palladium gold silver provides excellent conductivity and corrosion resistance for long-term reliability.
The dual terminal position offers redundancy and improved signal integrity in case one terminal fails.
The low maximum seated height minimizes the overall height of the component, ideal for compact electronic devices.
The 3mm width contributes to a compact form factor, suitable for applications where space is a constraint.
The maximum time at peak reflow temperature ensures proper soldering and component reliability during assembly.
The high peak reflow temperature allows for secure and reliable solder joints during assembly processes.
The 3mm length contributes to a small and space-saving design for applications with limited board space.
The automotive temperature grade ensures the product can withstand harsh temperature conditions in automotive applications.
The gull wing terminal form offers mechanical strength and easier inspection during assembly processes.
The telecom circuit type allows for seamless integration into telecom systems for efficient communication.
The 5V nominal supply voltage is a standard voltage level, making it compatible with a wide range of systems.
The small terminal pitch of 0.65mm allows for high-density mounting and space-saving on the PCB.
The MSL 2 rating indicates the level of protection against moisture, ensuring reliability in humid environments.
Other Function Telecom Interface ICs OPA381AIDGKR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Channels:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
OPA381AIDGKR Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.33.00.01
SB
8542.33.00.00
PCN Assembly/Origin - Additional Assembly Sites 16/Dec/2021
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS495A-SP
Honeywell Sensing And Control
SS495A-SP by Honeywell is a magnetic field sensor with 10.5V max supply voltage, 3" body width, and 1.5% linearity. Ideal for applications requiring a Hall effect sensor with -40 to 150°C operating temperature range, such as position sensing in automotive or industrial systems.
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
Sangdest Microelectronics (Nanjing)
451-00002
Laird Technologies
Laird Technologies' 451-00002 is a surface mount telecom IC with 71 terminals. Operating b/w -40 to 85°C, it has a seated height of 2.35mm and nominal voltage of 3.3V. Ideal for telecom circuits, it offers data rates up to 2 Mbps in microelectronic assemblies.
BG95M5LA-64-SGNS
Quectel Wireless Solutions
BG95M5LA-64-SGNS by Quectel Wireless Solutions is a telecom IC with 1.119 Mbps data rate, operating at -35 to 75 °C. Its compact rectangular design with 102 terminals makes it suitable for various telecom applications requiring a nominal voltage of 3.8 V.
CC2564CRVMT
Texas Instruments CC2564CRVMT is a telecom IC with 76 terminals in a square chip carrier package. It operates at -40 to 85°C, with a data rate of 4 Mbps and nominal voltage of 3.6 V. Ideal for telecom applications requiring high-speed data transmission in industrial environments.
450-0178C
Ls Research
TELECOM CIRCUIT;
DWM1000
Decawave
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SIM800C
Simcom Wireless Solutions
SIM800C by Simcom Wireless Solutions is a telecom IC with 0.0856 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has 42 terminals in a rectangular package. Ideal for IoT, M2M, and GSM applications due to its surface mount capability and quad terminal position.
DA14531MOD-00F0100C
Dialog Semiconductor
TELECOM CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
BGM111A256V21R
Silicon Labs
BGM111A256V21R by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.2mm, suitable for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages in surface mount form.
MAX2769CETI+T
Maxim Integrated
TELECOM CIRCUIT; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
BGM111A256V2
BGM111A256V2 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial applications requiring reliable telecom circuit interfaces.
HMC773ALC3BTR
Analog Devices
Analog Devices' HMC773ALC3BTR is a telecom IC with 12 terminals in a square chip carrier package. Operating from -40 to 85°C, it features gold over nickel terminal finish and 0.5mm pitch. Ideal for industrial applications requiring very thin profile components.
MGM12P32F1024GA-V4
Silicon Labs' MGM12P32F1024GA-V4 is a TELECOM CIRCUIT IC with 3.3V supply voltage, 1 Mbps data rate, and operating temperatures from -40 to 85 °C. Its RECTANGULAR package shape makes it ideal for telecom interface applications.
BGM220SC22WGA2
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
BMD-300-A-R
Rigado
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 47; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
CC2564MODNCMOER
CC2564MODNCMOER by Texas Instruments is a telecom IC with 33 terminals, operating at 3.6V with a data rate of 4 Mbps. It is surface mountable, has a rectangular package shape, and is suitable for applications requiring high-speed wireless communication in compact electronic devices.
453-00059C
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
NRF51822-QFAB-T
Nordic Semiconductor Asa
NRF51822-QFAB-T by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, -25 to 75°C operating range, and 0.4mm terminal pitch. It is used in telecom circuits due to its square chip carrier package style and quad terminal position, suitable for surface mount applications.
ANNA-B112-00B
U-blox Ag
ANNA-B112-00B by U-blox Ag is a telecom IC with 52 terminals, operating at -40 to 85°C. It has a data rate of 2 Mbps and nominal voltage of 3V. This square-shaped, surface-mount package is ideal for industrial applications requiring high-speed telecom circuit functionality.
PN7160A1EV/C100K
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
NINA-B112-01B-00
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
OPA380AIDGKT
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
OPA380AIDGKTG4
OPA380AIDGKTG4 by Texas Instruments is a telecom interface IC with 8 terminals, operating at temperatures from -40 to 125°C. It features a supply voltage of 3/5V, low supply current of 0.0088mA, and is designed for automotive applications. This CMOS technology IC comes in a small outline package with gull wing terminals and is suitable for telecom circuits.
OPA380AIDGKR
OPA380AIDGKR by Texas Instruments is a telecom interface IC with 8 terminals, operating at temperatures from -40 to 125°C. It has a supply voltage of 5V and low supply current of 0.008mA, making it suitable for automotive applications. The package style is small outline with a thin profile and shrink pitch, ideal for surface mount assembly.
OPA380AIDG4
OPA380AIDG4 by Texas Instruments is a telecom interface IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 5V and low supply current of 0.008mA, suitable for automotive applications. The package style is small outline with gull wing terminals, making it ideal for surface mount designs.
OPA380AIDGKRG4
OPA380AID
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
OPA380AIDR
OPA380AIDRG4
OPA381AIDGKT
OPA381AIDGKT by Texas Instruments is an 8-terminal IC with a package style of small outline, thin profile, and shrink pitch. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal voltage of 5V, it is designed for telecom circuits with a terminal pitch of 0.65mm.
OPA381AIDGKTG4
OPA381AIDGKRG4
OPA381AIDRBR
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;
OPA381AIDRBRG4
OPA381AIDRBT
OPA381AIDRBTG4
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