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OPA380AIDRG4

Texas Instruments

OPA380AIDRG4 by Texas Instruments

OPA380AIDRG4 by Texas Instruments is an 8-terminal IC with a supply voltage of 3/5V. It operates in temperatures ranging from -40 to 125°C, making it suitable for automotive applications. With a low supply current of 0.008mA, this telecom circuit IC is ideal for surface mount designs in compact spaces.

Median Price

$2.033

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 361 parts In-Stock

1+ parts

$2.033

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361

$2.033

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Vyrian

USA . 7,664 parts In-Stock

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Digiode

USA . 181 parts In-Stock

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181

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Nova Conductors

Japan . 44 parts In-Stock

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44

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,268 parts In-Stock

1+ parts

$11.002

100+ parts

$1,021.719

1k+ parts

$9.902

10k+ parts

-

1,268

$11.002

$1,021.719

$9.902

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DigiPath Technology Company

USA . 1,509 parts In-Stock

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$12.115

100+ parts

$11.146

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1,509

$12.115

$11.146

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ChromeModa Solutions

Germany . 3,251 parts In-Stock

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$12.362

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$10.137

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3,251

$12.362

$10.137

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IDEA Electronic Components Group

UK . 810 parts In-Stock

1+ parts

$12.362

100+ parts

$11.744

1k+ parts

$11.126

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810

$12.362

$11.744

$11.126

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Corohmni

South Africa . 244 parts In-Stock

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$12.917

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244

$12.917

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AZTECH Wire

Italy . 645 parts In-Stock

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$14.399

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645

$14.399

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Semicontronic

India . 516 parts In-Stock

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$41.000

100+ parts

$39.975

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$39.770

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516

$41.000

$39.975

$39.770

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One Stop Electronics

USA . 217 parts In-Stock

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$81.000

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217

$81.000

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Ampacity Inc.

Singapore . 1,565 parts In-Stock

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$179.000

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Continental Prestige Electronics

USA . 5,836 parts In-Stock

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Perfect Parts

USA . 1,669 parts In-Stock

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Microchip USA

USA . 1,594 parts In-Stock

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Corphita

USA . 1,185 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 498 parts In-Stock

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498

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Overview

Elevate your telecom interface applications with the OPA380AIDRG4 by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers reliable solutions that meet industry standards. This small outline IC offers superior performance and efficiency, making it an ideal choice for various telecom circuit designs. Experience the value of seamless connectivity and enhanced functionality with the OPA380AIDRG4, setting a new standard in telecommunications technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying assembly processes.

Power Supplies (V): 3/5

Supports a wide range of power supply options, making it versatile for different applications.

Package Shape: RECTANGULAR

Simplifies the design and layout of PCBs, optimizing space usage.

Maximum Operating Temperature: 125 °C

Ensures stable performance in various temperature conditions, suitable for demanding applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, enhancing the overall reliability of the IC.

Width: 3.9 mm

Compact size allows for efficient use of space on PCBs, ideal for designs with limited space.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications, meeting industry standards for performance and reliability in harsh environments.

Maximum Supply Current: 0.008 mA

Low power consumption minimizes energy usage and heat generation, ideal for battery-powered devices.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimal performance in communication systems.

Technical Specifications

Other Function Telecom Interface ICs OPA380AIDRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.008 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

OPA380AIDRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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