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OPA381AIDRBT

Texas Instruments

OPA381AIDRBT by Texas Instruments

OPA381AIDRBT by Texas Instruments is an 8-terminal telecom interface IC with a small outline package and dual terminal position. It operates in automotive-grade temperatures from -40 to 125°C, with a nominal voltage of 5V. Ideal for telecom circuits, this IC has a moisture sensitivity level of 2 and is surface mountable.

Median Price

$1.580

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 114,928 parts In-Stock

1+ parts

$1.626

100+ parts

$1.343

1k+ parts

$0.726

10k+ parts

-

114,928

$1.626

$1.343

$0.726

-

Mouser Electronics

USA . 299 parts In-Stock

1+ parts

$2.540

100+ parts

$1.550

1k+ parts

$1.330

10k+ parts

$1.280

299

$2.540

$1.550

$1.330

$1.280

Rochester

USA . 15,486 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$1.070

10k+ parts

$1.010

15,486

-

$1.200

$1.070

$1.010

DigiKey

USA . 15,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.580

10k+ parts

-

15,486

-

-

$1.580

-

Verical

USA . 7,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.337

10k+ parts

$1.262

7,250

-

-

$1.337

$1.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 416 parts In-Stock

1+ parts

$0.907

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$0.907

-

-

-

Digiode

USA . 2,470 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

2,470

$0.960

-

-

-

DigiKey Marketplace

USA . 15,694 parts In-Stock

1+ parts

-

100+ parts

$1.050

1k+ parts

-

10k+ parts

-

15,694

-

$1.050

-

-

SPM Sales

USA . 295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

295

-

-

-

-

North Shore Components

USA . 29 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,870 parts In-Stock

1+ parts

$0.909

100+ parts

-

1k+ parts

-

10k+ parts

-

1,870

$0.909

-

-

-

Parana Technologies

USA . 2,363 parts In-Stock

1+ parts

$5.932

100+ parts

-

1k+ parts

$6.716

10k+ parts

-

2,363

$5.932

-

$6.716

-

ChromeModa Solutions

Germany . 1,394 parts In-Stock

1+ parts

$6.665

100+ parts

$5.465

1k+ parts

-

10k+ parts

-

1,394

$6.665

$5.465

-

-

IDEA Electronic Components Group

UK . 821 parts In-Stock

1+ parts

$6.665

100+ parts

-

1k+ parts

$5.998

10k+ parts

-

821

$6.665

-

$5.998

-

Computer Components Inc. - USA

USA . 10,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,600

-

-

-

-

DigiPath Technology Company

USA . 1,260 parts In-Stock

1+ parts

-

100+ parts

$6.009

1k+ parts

-

10k+ parts

-

1,260

-

$6.009

-

-

Overview

Enhance your telecommunications interface with the Texas Instruments OPA381AIDRBT. With a reputation for high-quality products, Texas Instruments delivers reliability and performance. This small outline, heat sink package allows for easy integration into your design while providing a wide operating temperature range. Ideal for automotive applications, this telecom circuit IC offers customers exceptional value and benefits. Upgrade your project today with the OPA381AIDRBT and experience the advantages of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material allows for a lightweight and durable package, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount capability enables easy and convenient installation of the product on PCBs, saving space and improving the overall design aesthetics.

Package Shape: SQUARE

The square package shape provides a compact form factor, allowing for efficient use of board space and enabling easy integration into various applications.

No. of Terminals: 8

The 8 terminals offer sufficient connectivity options for the product, enabling versatile connections and functionalities in telecom applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand demanding operational conditions and ensure reliable performance under extreme temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to function effectively in cold environments, enhancing its versatility and applicability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent corrosion resistance and conductivity, ensuring reliable signal transmission and long-term durability of the product.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and improves the overall connectivity and stability of the product in telecom interfaces.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm contributes to a slim profile and compact design of the product, making it suitable for space-constrained applications.

Width: 3 mm

The narrow width of 3 mm enhances the product's compatibility with various board layouts and ensures efficient use of space in telecom interface circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for precise and controlled soldering processes, ensuring reliable connections and performance of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can undergo high-temperature soldering without damage, ensuring secure and durable connections in telecom interfaces.

Length: 3 mm

The compact length of 3 mm complements the square package shape and small outline profile of the product, facilitating easy integration and installation in tight spaces.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates the product's suitability for use in automotive applications, where reliability and performance under challenging conditions are essential.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and offers improved soldering properties, making the product environmentally friendly and easy to handle.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this product ensures optimized performance and compatibility in telecommunications applications, meeting industry standards and requirements.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides a standardized power input for the product, ensuring consistent and reliable operation in telecom interfaces and circuits.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65 mm allows for precise connections and compact layout designs, enhancing the product's versatility and suitability for high-density PCB applications.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, the product is less susceptible to moisture-related damage during storage and handling, ensuring long-term reliability in various environments.

Technical Specifications

Other Function Telecom Interface ICs OPA381AIDRBT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

OPA381AIDRBT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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