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OPA381AIDGKT

Texas Instruments

OPA381AIDGKT by Texas Instruments

OPA381AIDGKT by Texas Instruments is an 8-terminal IC with a package style of small outline, thin profile, and shrink pitch. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal voltage of 5V, it is designed for telecom circuits with a terminal pitch of 0.65mm.

Median Price

$1.860

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 54,309 parts In-Stock

1+ parts

$1.951

100+ parts

$1.611

1k+ parts

$0.871

10k+ parts

-

54,309

$1.951

$1.611

$0.871

-

Mouser Electronics

USA . 317 parts In-Stock

1+ parts

$3.020

100+ parts

$1.860

1k+ parts

$1.610

10k+ parts

$1.570

317

$3.020

$1.860

$1.610

$1.570

Rochester

USA . 9,721 parts In-Stock

1+ parts

-

100+ parts

$1.420

1k+ parts

$1.270

10k+ parts

$1.190

9,721

-

$1.420

$1.270

$1.190

DigiKey

USA . 9,721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.860

10k+ parts

-

9,721

-

-

$1.860

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.587

10k+ parts

$1.488

6,000

-

-

$1.587

$1.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,423 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

-

10k+ parts

-

3,423

$1.150

-

-

-

Chip Stock

USA . 76,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

76,230

-

-

-

-

Vyrian

USA . 16,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,004

-

-

-

-

ComSIT Distribution GmbH

Germany . 213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

213

-

-

-

-

ComSIT USA

USA . 213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

213

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Elcom Components

USA . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35

-

-

-

-

Bristol Electronics

USA . 27 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27

-

-

-

-

Prism Electronics

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 16,031 parts In-Stock

1+ parts

$0.920

100+ parts

$0.897

1k+ parts

$0.892

10k+ parts

-

16,031

$0.920

$0.897

$0.892

-

Ampacity Inc.

Singapore . 15,911 parts In-Stock

1+ parts

$0.920

100+ parts

-

1k+ parts

-

10k+ parts

-

15,911

$0.920

-

-

-

Corphita

USA . 885 parts In-Stock

1+ parts

$1.089

100+ parts

-

1k+ parts

-

10k+ parts

-

885

$1.089

-

-

-

Corohmni

South Africa . 237 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

-

10k+ parts

-

237

$1.340

-

-

-

Parana Technologies

USA . 500 parts In-Stock

1+ parts

$11.610

100+ parts

-

1k+ parts

$12.008

10k+ parts

-

500

$11.610

-

$12.008

-

DigiPath Technology Company

USA . 1,538 parts In-Stock

1+ parts

$12.784

100+ parts

-

1k+ parts

-

10k+ parts

-

1,538

$12.784

-

-

-

IDEA Electronic Components Group

UK . 2,326 parts In-Stock

1+ parts

$13.045

100+ parts

$12.393

1k+ parts

$11.740

10k+ parts

-

2,326

$13.045

$12.393

$11.740

-

ChromeModa Solutions

Germany . 777 parts In-Stock

1+ parts

$13.045

100+ parts

$10.697

1k+ parts

-

10k+ parts

-

777

$13.045

$10.697

-

-

Argo Parts USA

USA . 3,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,407

-

-

-

-

Continental Prestige Electronics

USA . 3,007 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,007

-

-

-

-

Lixinc

USA . 2,966 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,966

-

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the OPA381AIDGKT by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unmatched quality and reliability. Ideal for a wide range of applications, this product delivers exceptional performance in the automotive industry. Experience seamless connectivity and enhanced functionality with this innovative solution. Upgrade your systems today and elevate your projects to new heights with the OPA381AIDGKT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly.

Package Shape: SQUARE

The square shape helps in optimizing space utilization on the PCB.

No. of Terminals: 8

With 8 terminals, this product allows for multiple connections and functionalities.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style ensures space-saving design and efficient heat dissipation.

Maximum Operating Temperature: 125 °C

The high operating temperature range makes this product suitable for harsh environments.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures functionality in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The quality terminal finish enhances conductivity and ensures long-term reliability.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and connections.

Maximum Seated Height: 1.1 mm

The low seated height allows for compact designs and efficient PCB stacking.

Width: 3 mm

The narrow width of 3mm allows for space-saving installation.

Maximum Time At Peak Reflow Temperature: 30s

The short reflow time helps in preventing overheating during assembly.

Peak Reflow Temperature: 260C

The high peak reflow temperature ensures proper soldering and connection integrity.

Length: 3 mm

The compact length of 3mm contributes to space-efficient PCB layouts.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliability in automotive applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure and reliable connections.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring proper functionality and compatibility.

Nominal Supply Voltage: 5 V

The 5V supply voltage is common and widely compatible with various systems.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm allows for high-density PCB designs.

Moisture Sensitivity Level (MSL): 2

MSL 2 ensures proper handling and storage of the product during assembly and transportation.

Technical Specifications

Other Function Telecom Interface ICs OPA381AIDGKT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

OPA381AIDGKT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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