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ADF7012BRUZ-RL7

Analog Devices

ADF7012BRUZ-RL7 by Analog Devices

ADF7012BRUZ-RL7 by Analog Devices is a telecom IC with 24 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 3V and uses CMOS technology. This surface-mount IC in a small outline package is ideal for telecom circuit applications.

Median Price

$2.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 1,000 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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$2.140

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Chip Stock

USA . 8,930 parts In-Stock

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Vyrian

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VNN

France . 4,369 parts In-Stock

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Digiode

USA . 833 parts In-Stock

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Continental Prestige Electronics

USA . 4,806 parts In-Stock

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$2.097

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Argo Parts USA

USA . 3,930 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$2.033

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$1.990

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$1.990

AZTECH Wire

Italy . 188 parts In-Stock

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$4.957

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Parana Technologies

USA . 864 parts In-Stock

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$8.354

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$7.769

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IDEA Electronic Components Group

UK . 1,181 parts In-Stock

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Corohmni

South Africa . 947 parts In-Stock

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DigiPath Technology Company

USA . 764 parts In-Stock

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$14.013

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$13.453

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$13.453

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$13.453

Semicontronic

India . 2,056 parts In-Stock

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$630.000

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$614.250

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$611.100

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One Stop Electronics

USA . 1,030 parts In-Stock

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Ampacity Inc.

Singapore . 671 parts In-Stock

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RC Electronics

USA . 33,997 parts In-Stock

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$2.180

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Lixinc

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Authorized Procurement Solutions

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Perfect Parts

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Corphita

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Overview

Discover the cutting-edge ADF7012BRUZ-RL7 by Analog Devices, a top-tier manufacturer known for high-quality products. This telecom interface IC offers unparalleled performance and reliability in various applications. From communication systems to industrial automation, this product stands out for its compact design, wide operating temperature range, and dual-terminal position. With a nominal supply voltage of 3V and advanced CMOS technology, the ADF7012BRUZ-RL7 delivers exceptional value and benefits to customers seeking superior connectivity solutions. Upgrade your projects today with this innovative component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environments.

Surface Mount: YES

With surface mount capability, this IC can be easily integrated into compact designs for space-saving purposes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on circuit boards and easy handling during assembly.

Power Supplies (V): 2.5/3.3

Compatible with both 2.5V and 3.3V power supplies, providing flexibility in system design and integration.

No. of Terminals: 24

With 24 terminals, this IC offers multiple connection points for enhanced functionality and performance.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style contribute to space efficiency and improved thermal performance.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85°C, ensuring reliable performance under varying conditions.

Minimum Operating Temperature: -40 °C

Able to withstand cold temperatures down to -40°C, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and resistance to corrosion, extending the lifespan of the IC.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures stable connections for uninterrupted operation.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2mm allows for slim and compact device designs.

Width: 4.4 mm

With a width of 4.4mm, this IC can fit into tight spaces without compromising on performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the IC can withstand peak temperatures during soldering processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliable connections.

Length: 7.8 mm

The length of 7.8mm offers a balance between compact size and functional integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes this IC suitable for rugged environments and extended operating conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency of the IC.

Terminal Form: GULL WING

Gull wing terminal form allows for efficient soldering and secure connections for long-term reliability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, offering specialized features and functionality for communication systems.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3V, this IC is compatible with standard power sources for easy integration.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch provides precise alignment and connection for optimal performance.

Technical Specifications

Other Function Telecom Interface ICs ADF7012BRUZ-RL7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

ADF7012BRUZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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