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ADF7023BCPZ-RL

Analog Devices

ADF7023BCPZ-RL by Analog Devices

Analog Devices' ADF7023BCPZ-RL is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 2/3.3V and terminal pitch of 0.5mm. This square-shaped chip carrier is ideal for industrial applications requiring very thin profile packages.

Median Price

$6.240

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,898 parts In-Stock

1+ parts

$6.240

100+ parts

$4.716

1k+ parts

$4.149

10k+ parts

$3.815

2,898

$6.240

$4.716

$4.149

$3.815

Newark

USA . 5,000 parts In-Stock

1+ parts

$8.330

100+ parts

$5.280

1k+ parts

$3.740

10k+ parts

-

5,000

$8.330

$5.280

$3.740

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Element14

Singapore . 5,000 parts In-Stock

1+ parts

$9.170

100+ parts

$6.940

1k+ parts

$6.340

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-

5,000

$9.170

$6.940

$6.340

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Verical

USA . 55,000 parts In-Stock

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$2.983

55,000

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$2.983

Farnell

UK . 5,000 parts In-Stock

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-

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$3.980

1k+ parts

$3.470

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5,000

-

$3.980

$3.470

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Distributors (In-Stock)

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Dynamic Solutions

Germany . 20,000 parts In-Stock

1+ parts

$1.500

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-

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$1.500

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Digiode

USA . 563 parts In-Stock

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$4.161

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563

$4.161

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Vyrian

USA . 17,309 parts In-Stock

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17,309

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Chip Stock

USA . 8,500 parts In-Stock

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8,500

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VNN

France . 293 parts In-Stock

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293

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Nova Conductors

Japan . 15 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 17,446 parts In-Stock

1+ parts

$2.540

100+ parts

-

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17,446

$2.540

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Corphita

USA . 440 parts In-Stock

1+ parts

$3.942

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440

$3.942

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Semicontronic

India . 17,200 parts In-Stock

1+ parts

$5.520

100+ parts

$5.382

1k+ parts

$5.354

10k+ parts

-

17,200

$5.520

$5.382

$5.354

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Parana Technologies

USA . 3,505 parts In-Stock

1+ parts

$7.178

100+ parts

-

1k+ parts

$6.675

10k+ parts

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3,505

$7.178

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$6.675

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Aztec Data Supply Inc.

USA . 4,158 parts In-Stock

1+ parts

$7.500

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4,158

$7.500

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IDEA Electronic Components Group

UK . 612 parts In-Stock

1+ parts

$7.718

100+ parts

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$7.332

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612

$7.718

-

$7.332

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DigiPath Technology Company

USA . 2,322 parts In-Stock

1+ parts

$12.040

100+ parts

$11.558

1k+ parts

-

10k+ parts

$11.558

2,322

$12.040

$11.558

-

$11.558

Corohmni

South Africa . 648 parts In-Stock

1+ parts

$14.327

100+ parts

-

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648

$14.327

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QUARKTWIN TECHNOLOGY LTD

USA . 28,308 parts In-Stock

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Lixinc

USA . 18,882 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,500 parts In-Stock

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7,500

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RC Electronics

USA . 6,889 parts In-Stock

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Futuretech Components

Singapore . 6,200 parts In-Stock

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6,200

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Continental Prestige Electronics

USA . 6,129 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Argo Parts USA

USA . 3,034 parts In-Stock

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3,034

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Overview

Elevate your telecommunications projects with the ADF7023BCPZ-RL by Analog Devices. Renowned for their high-quality manufacturing, Analog Devices delivers top-tier solutions in the Other Function Telecom Interface ICs category. With its compact square package shape and advanced features, this product offers unmatched value to customers looking to enhance their communication systems. Whether it's for industrial applications or telecom circuits, this innovative IC provides reliability, performance, and efficiency, making it a must-have component for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape provides efficient use of space on the circuit board and enhances overall design aesthetics.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages ensures compatibility with various systems and applications.

No. of Terminals: 32

Having a high number of terminals allows for connectivity to multiple external components, enhancing functionality and versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles offers thermal management, durability, and space-saving advantages, making it suitable for various environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures operation in a wide range of environments, including harsh cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easy connection and compatibility with various circuit board layouts.

Maximum Seated Height: 0.8 mm

The low maximum seated height profile minimizes the overall height of the component, making it suitable for slim devices.

Width: 5 mm

The compact width dimension helps in fitting the component in tight spaces without compromising functionality.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes thermal stress on the component during assembly, ensuring reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables robust soldering and assembly processes, ensuring secure connections.

Length: 5 mm

The compact length dimension helps in maintaining a small footprint on the board, saving space for other components.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in various temperature ranges, making it suitable for industrial applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of lead-related hazards and environmental concerns, making it a more environmentally friendly option.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers specialized features and performance enhancements for telecommunication applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V ensures compatibility with standard voltage levels in many electronic systems, simplifying integration.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for dense packing of terminals on the board, maximizing connectivity options and saving space.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level allows for safe handling and storage, ensuring the component's performance and reliability over time.

Technical Specifications

Other Function Telecom Interface ICs ADF7023BCPZ-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

ADF7023BCPZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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