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ADF7012BRU-U1

Analog Devices

ADF7012BRU-U1 by Analog Devices

Analog Devices ADF7012BRU-U1 is a telecom IC with 24 terminals, operating at -40 to 85°C. It has power supplies of 2.5/3.3V and uses CMOS technology. This IC is ideal for industrial applications requiring a small outline package with gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,736 parts In-Stock

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Digiode

USA . 116 parts In-Stock

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116

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Native Components

USA . 604 parts In-Stock

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$0.695

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604

$0.695

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Northwest PG Solutions

USA . 919 parts In-Stock

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$0.764

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919

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Parana Technologies

USA . 4,196 parts In-Stock

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$11.275

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$10.486

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4,196

$11.275

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$10.486

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IDEA Electronic Components Group

UK . 1,094 parts In-Stock

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$12.124

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$11.518

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$11.518

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DigiPath Technology Company

USA . 2,018 parts In-Stock

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$18.913

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$18.157

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$18.157

2,018

$18.913

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$18.157

AZTECH Wire

Italy . 536 parts In-Stock

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$19.481

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536

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Semicontronic

India . 1,177 parts In-Stock

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$543.000

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$529.425

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$526.710

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One Stop Electronics

USA . 1,527 parts In-Stock

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$627.000

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Corphita

USA . 666 parts In-Stock

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Overview

Elevate your telecommunications projects with the ADF7012BRU-U1 by Analog Devices. This top-of-the-line IC boasts unparalleled quality and reliability, thanks to the renowned manufacturer's commitment to excellence. With a wide range of applications in various industries, this product offers unmatched value and benefits to customers seeking cutting-edge solutions for their projects. Say goodbye to compromise and hello to superior performance with the ADF7012BRU-U1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and chemical resistance, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape offers a standardized form factor that is easy to integrate into existing designs and layouts.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options allows for flexibility in designing and operating the product at different voltage levels.

No. of Terminals: 24

A higher number of terminals provide more connection points for interfacing with other components and devices, enhancing the functionality of the product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style offers space-saving advantages and improved thermal performance in compact electronic systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliability and stability even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the product to function effectively in extreme cold conditions, making it suitable for various applications.

Terminal Finish: Tin/Lead (Sn85Pb15)

The tin/lead terminal finish provides good solderability and ensures secure connections, enhancing the overall reliability of the product.

Terminal Position: DUAL

Having dual terminal positions offers additional flexibility in circuit design and layout, enabling more versatile connection options for different applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates that the product is designed to meet the rugged requirements of industrial applications, ensuring robust performance and longevity.

Technology: CMOS

The use of CMOS technology results in low power consumption, high speed, and compatibility with various digital systems, making the product efficient and versatile.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical strength and ease of soldering, providing reliable connections and simplifying the assembly process.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for high-density mounting and precise placement of the product on the PCB, enabling efficient use of space and optimized circuit layout.

Technical Specifications

Other Function Telecom Interface ICs ADF7012BRU-U1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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