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TLK2711IRCP

Texas Instruments

TLK2711IRCP by Texas Instruments

TLK2711IRCP by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and terminal pitch of 0.5mm. Ideal for telecom circuits, it features a flatpack package style and nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,424 parts In-Stock

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7,424

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Digiode

USA . 2,912 parts In-Stock

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2,912

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Chip Stock

USA . 147 parts In-Stock

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147

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Nova Conductors

Japan . 48 parts In-Stock

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48

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Distributors (Availability)

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AZTECH Wire

Italy . 579 parts In-Stock

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$11.424

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579

$11.424

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Parana Technologies

USA . 1,514 parts In-Stock

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$13.476

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$13.988

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1,514

$13.476

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$13.988

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DigiPath Technology Company

USA . 1,722 parts In-Stock

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$14.839

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$13.652

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$14.839

$13.652

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IDEA Electronic Components Group

UK . 904 parts In-Stock

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$15.142

100+ parts

$14.385

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$13.628

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904

$15.142

$14.385

$13.628

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ChromeModa Solutions

Germany . 320 parts In-Stock

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$15.142

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$12.416

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320

$15.142

$12.416

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One Stop Electronics

USA . 868 parts In-Stock

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$264.000

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868

$264.000

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Ampacity Inc.

Singapore . 923 parts In-Stock

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$897.000

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923

$897.000

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Semicontronic

India . 1,641 parts In-Stock

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$941.000

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$917.475

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$912.770

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1,641

$941.000

$917.475

$912.770

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Lixinc

USA . 15,041 parts In-Stock

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Corphita

USA . 4,757 parts In-Stock

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Continental Prestige Electronics

USA . 1,633 parts In-Stock

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Argo Parts USA

USA . 1,407 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Microchip USA

USA . 463 parts In-Stock

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463

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Overview

Discover the cutting-edge TLK2711IRCP by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. This telecom interface IC boasts a myriad of applications in various industries, offering unmatched performance and seamless connectivity. With its innovative features and advanced technology, this product delivers exceptional value to customers by providing smooth operation, enhanced efficiency, and unparalleled convenience. Elevate your projects with the TLK2711IRCP and experience the next level of telecommunications excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring longevity and reliability in various operating conditions.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving time and labor during production.

Power Supplies (V): 2.5

Offers a stable and commonly used voltage level for powering the IC, ensuring compatibility with many systems.

No. of Terminals: 64

Provides a sufficient number of connection points for interfacing the IC with other components in the telecom system.

Maximum Operating Temperature: 85 °C

Allows the IC to function reliably in high-temperature environments, increasing its versatility and applicability.

Terminal Finish: NICKEL PALLADIUM GOLD

Delivers high conductivity and corrosion resistance for the terminals, enhancing the overall performance and lifespan of the IC.

Width: 10 mm

Compact size facilitates space-saving design and integration within telecom equipment or systems.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow processes during assembly, leading to reliable connections and overall product quality.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications, where the IC may be exposed to harsh conditions or extended operation.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring the IC's reliability and performance in various environmental conditions.

Technical Specifications

Other Function Telecom Interface ICs TLK2711IRCP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2711IRCP Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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